Onto Innovation Announces Multiple Orders to Support 5G Ramp

Onto Innovation Inc. (NYSE: ONTO) announced that it has received orders totaling 15 systems from two leaders in advanced packaging. Both customers are ramping up to support the ongoing demand for 5G smartphones which drives advanced packages requiring more precise process control solutions.

Hprobe, Leader in Magnetic Field Testing Announces Completion of a New Funding Round with International Investors

Hprobe, a provider of semiconductor Automatic Test Equipment (ATE) for magnetic devices, today announced the completion of a new funding round driven by international investors, providing an exceptional depth of expertise, a global ecosystem of partnerships and the endorsement of industry market leaders. The company has raised more than 2 million euros to support its strong international development in the field of spintronics based devices testing, such as MRAMs (Magnetic Random Access Memories) and TMR (Tunnel Magneto Resistance) sensors.

Dow Introduces First Solventless Silicone Conformal Coating with UV and Moisture Dual Cure

Dow (NYSE: Dow), introduced today at IPC APEX EXPO 2020 new DOWSIL™ CC-8030 UV and Moisture Dual Cure Conformal Coating, the industry’s first solventless silicone conformal coating with an ultraviolet (UV) and moisture dual cure system for high throughputs. This new environmentally responsible silicone technology promotes sustainability, health and safety while reducing processing costs through automated spraying and fast, energy-efficient UV curing.

Plessey and WaveOptics Announce Strategic Partnership Using MicroLED Display Technology for Smart Glasses

Plessey, an embedded technologies developer at the forefront of microLED technology for the augmented reality (AR) and mixed reality (MR) display market, announced today at Photonics West its’ partnership with WaveOptics, the leading designer and manufacturer of diffractive waveguides.

Designing and Fabricating Fully-Customized Chips

Silicon chip technology has surprising and largely untapped possibilities for product innovation. But reliably fabricating these specialty chips requires a multidisciplinary team and a robust plan.

A New Wave of Fan-Out Packaging Growth

Key players from different business models are fueling new growth.

Update: TSMC’s 5nm CMOS Technology Platform

At the International Electron Devices Meeting (IEDM) in San Francisco December 7-11, Geoffrey Yeap presented the talk “5nm CMOS Production Technology Platform Featuring Full-Fledged EUV and High-Mobility Channel FinFETs with Densest 0.021µm2 SRAM Cells for Mobile SoC and High-Performance Computing Applications”. Contributing Editor Dick James provides an update on his original pre-IEDM blog.