Recent innovations in the field of new implant materials and innovative packaging are presented.
Scaling the BEOL: A Toolbox Filled with New Processes, Boosters and Conductors
Extending interconnects towards the 3nm technology node and beyond requires several innovations. Imec sees single-print EUV in dual-damascene modules, Supervia structures, semi-damascene modules and added functionality in the back-end-of-line (BEOL) as the way forward.
Harsh New Processes and Materials Pose Challenges for Vacuum Systems
Maximizing the productivity and profitability of the semiconductor manufacturing process requires pump designs that are optimized for the application, especially harsh applications that use condensable or corrosive gases.
Why AIoT is an Essential Element of Continued Technological Innovation
We’re taking a multiplicity of small steps towards a future where AIoT will be deployed widely, in our cars, cities, factories, and stores — and throughout our lives, for the better.
SerDes Designs: Keeping Pace with a Demanding Network Environment
As speed, signal integrity and test boundaries are pushed, cycles of architectural changes and new levels of design innovation for the SerDes chip are only a few of the challenges.
