I’m delighted to report that the content from Solid State Technology is now available through the Semiconductor Digest website. Gold Flag Media LLC, co-founded by Kerry Hoffman and Pete Singer in 2019, acquired the Solid State Technology internet domains electroiq.com and solid-state.com plus all associated content late last year and we are delighted to announce that we have successfully transferred the entire contents of the vast SST library to our site.
Solid State Technology, which was founded in 1959, began posting content on the internet in the mid-1990s. Readers can now find every issue going back to 1996 and almost 34,000 posts covering news and technology developments from 1995 through early 2019.
In case you missed them, feature articles from the last several issues of Solid State Technology are also now available in html format:
The Process Watch series explores key concepts about process control defect inspection, metrology and data analytics for the semiconductor industry. This article is the fourth in a series on process control strategies for automotive semiconductor devices.
SONOS (Si-Oxide-Nitride-Oxide-Si) based eNVM technology is well-suited for System-On-a Chip (SOC) products as they are very compatible with standard logic/mixed-signal CMOS process flow. This paper describes how the SONOS based eNVM technology has been successfully developed and scaled down to 28nm node.
Insights into the rise of ASynchronous OPtical Sampling technology as a future measurement standard and how it can be used in the industry.
Any consideration of recycling must take a systems-level approach, thoroughly considering all predictable and potential costs, including risks of downtime, contamination and safety.
The potential transistor structures and materials like Carbon Nano-tube FET, Gate-All-Around FET, and compound semiconductors as solutions to overcome the problems of scaling the existing silicon FinFET transistor below 5nm node are reviewed.
Sensors are inextricably linked to the future requirements of partially and fully autonomous vehicles.
Speakers at the VLSI Symposium argued the semiconductor community thus far has not been doing enough to enable machine intelligence.
To get to the next level in performance/Watt, innovations being researched at the AI chip level include low precision, analog and resistive computing.
The Open Artwork System Interchange Standard (OASIS®) format, which can reduce both file sizes and loading times. The OASIS format has been available for almost 15 years and is accepted by every major foundry. It is also supported by all industry standard EDA tools.
When different isotopes of atoms have significantly different properties, the ability to create isotopically pure materials becomes essential.
The scaling of traditional memories such as SRAM, DRAM and Flash is no longer following the data growth rate, especially in terms of energy and speed.
A new approach, Dynamic Fault Detection (DFD) was developed to address the shortcomings of traditional FDC systems and save both production time and engineer time.
Proactive yield perfection (PYP) is a comprehensive systems-level approach to perfecting yield through detailed surveillance and sophisticated modeling that identifies actual or potential root causes of excursions.
Semiconductors continue to grow in importance in the automotive supply chain, requiring IC manufacturers to adapt their processes to produce chips that meet automotive quality standards.
A lithographic method for TSV alignment to embedded targets was evaluated using in-line stepper self metrology, with TIS correction.
Layout schema generation generates random, realistic, DRC-clean layout patterns of the new design technology for use in test vehicles.
A special thanks to our web developer Slava Dostenko for his work in keeping this content secure as we worked through the long acquisition process.