Expect to see a convergence of edge computing, machine vision and 5G-connected vehicles.
In spintronics, the magnetic moment of electrons (spin) is used to transfer and manipulate information. An ultra-compact 2D spin-logic circuitry could be built from 2D materials that can transport the spin information over long distances and also provide strong spin-polarization of charge current. Experiments by physicists at the University of Groningen (The Netherlands) and Colombia University (USA) suggest that magnetic graphene can be the ultimate choice for these 2D spin-logic devices as it efficiently converts charge to spin current and can transfer this strong spin-polarization over long distances.
Quantum-Si Incorporated, a company pioneering next-generation semiconductor chip-based proteomics, announced today the appointment of Marijn Dekkers, Ph.D. and Ruth Fattori to its Board of Directors.
Boston Semi Equipment (BSE), a global semiconductor test automation and test handler company, today announced record orders for its test handlers.
Qorvo, a provider of RF solutions that connect the world, announced today that it has acquired Mountain View, California-based NextInput
SEMICON Europa 2022, co-located with electronica, will be postponed one week to November 15-18, SEMI announced today. The move follows Messe Munich’s announcement that it will postpone electronica for organizational reasons.
CMC Materials, Inc. (Nasdaq: CCMP), a global supplier of consumable materials primarily to semiconductor manufacturers, today reported financial results for its second quarter of fiscal 2021, which ended March 31, 2021.
IBM announced a breakthrough in semiconductor design and process with the development of the world’s first chip announced with 2 nm nanosheet technology. The new design is projected to achieve 45 percent higher performance and 75 percent lower energy use than today’s 7 nm chips. It will likely not be in production until 2024.
Today, a select group of globally recognized Canadian founders, business leaders, chip manufacturers, and investors announce Canada’s Semiconductor Council.
Model N Inc. (NYSE: MODN) today announced a new partnership with Channelnomics, a business strategy and research firm that enables high technology companies to assess, plan, and build channel program success.
PsiQuantum, a quantum computing company focused on delivering a 1 million-plus qubit quantum computer, and GLOBALFOUNDRIES (GF) today announced a major breakthrough in their partnership to build the world’s first full-scale commercial quantum computer.
Vatics acquisition allows Kneron to expand its chip offerings, integrating image sensing processors, beginning later in 2021.
Applied Materials, Inc. today announced materials engineering solutions that give its memory customers three new ways to further scale DRAM and accelerate improvements in chip performance, power, area, cost and time to market (PPACt).
ROHM Semiconductor today announced the development of the GMR320 series of shunt resistors featuring a rated power of 10W, the largest in the high-power, low-ohmic GMR lineup designed for high-power applications in the automotive, industrial equipment, and home appliance sectors.
Mixed-cation single crystals narrow the gap between perovskite and top-performing semiconductor solar cells. A synthetic approach that improves absorber layers in perovskite solar cells could help them achieve their full potential and draw closer to the performance of leading gallium arsenide devices.
Trelleborg Sealing Solutions launches four materials in its Isolast PureFab range, specifically engineered for critical semiconductor sealing applications.
dpiX and 3D-Micromac America today announced the signing of a Memorandum of Understanding (MOU) that outlines the companies’ cooperation in the development, prototyping and manufacturing of laser-manufactured, flat-panel semiconductors.
Semtech Corporation and EchoStar Corporation announced the launch of an initiative to test satellite connectivity services enabled by the LoRaWAN protocol.
Dialog Semiconductor plc announced an expansion of its SmartServer IoT Partner Program to include businesses that offer data analytics platforms with artificial intelligence (AI)-led outcomes that transform industrial operations.
The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, announced the completion of its MIPI Automotive SerDes Solutions (MASS) “display stack.”
Gel-Pak, a division of Delphon and a manufacturer of protective device carrier and film products for the semiconductor and optoelectronics industries announces its collaboration with BAE Systems on a new product called the Lid/Clip Super System (LCS2).
Worldwide sales for March increase 17.8% year-to-year, 3.7% month-to-month.
Worldwide silicon wafer area shipments increased 4% to 3,337 million square inches in the first quarter of 2021 compared to the fourth quarter of 2020, topping the previous historical high set in the third quarter of 2018, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.
A New Differential Pressure Sensor Based Mass Flow Controller for Advanced Semiconductor Processing
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