AKHAN Semiconductor, a technology company specializing in the fabrication and application of lab-grown, electronic-grade diamonds, announced today that it has been issued additional patents for invention by the Taiwan and Korean Intellectual Property Offices. The patents cover additional claims for AKHAN’s next-generation N-type diamond semiconductor electronics materials and devices. The applications for this technology platform span everything from control & guidance electronics in military & space, power inverter for automotive, to FPGA and Logic Integrated Circuits for the global semiconductor industry.
The Taiwanese-issued patent, I711153, and South Korea-issued patent 10-2195950, are key additions to AKHAN’s breakthrough Miraj Diamond® intellectual property portfolio. It is the Company’s fourth issued patent from Taiwan, the global leader in semiconductor chip manufacturing, and third issued patent from South Korea, another global leader in semiconductor foundry processing. The technology enables breakthrough performance in semiconductor electronics. Through the integration of high-quality doped diamond in semiconductor electronics applications, the novel systems allow for next-generation electronics performance, including higher power & frequency capability, higher voltages of operation, higher current density, higher thermal conductivity/reduced thermal budget, amongst other favorable attributes.
“Taiwan & South Korea both represent the global leadership when it comes to semiconductor foundries & production and are home to several of the largest chip foundries, including TSCMS, SMIC, and Samsung, so it’s important that AKHAN has an established presence in these countries, as well as the proper intellectual property protections in place,” said Adam Khan, CEO of AKHAN Semiconductor. “These patents will be critically important in advancing AKHAN’s partnerships and relationships with companies throughout Taiwan, South Korea, and the world.”
AKHAN’s comprehensive Miraj Diamond® Electronics portfolio is at the center of the company’s ability to manufacture next-generation diamond semiconductor technology. The platform enables fabrication of complex devices such as high speed/power transistors, RF, and microwave electronics. Fabricated devices have been shown to be faster, more efficient, and >1,000x thinner than the state of the art in both diamond and silicon technologies.
