Global IC market expected to exceed $500 billion for the first time.
To help accommodate its rapid global expansion while providing room for future growth, Alliance Memory has moved into a new building in Taiwan with twice the warehouse and office space of the company’s previous local facility.
This week, at the 2021 Symposia on VLSI Technology and Circuits (VLSI 2021), imec demonstrates for the first time fully functional integrated forksheet field-effect transistors.
As per the latest report published by Market Research Future (MRFR), the global 3D semiconductor packaging market is likely to reach a valuation of USD 37,472.7 million by the end of 2023, reflecting a healthy growth rate.
Applied Materials, Inc. today unveiled a new way to engineer the wiring of advanced logic chips that enables scaling to the 3nm node and beyond.
NHanced Semiconductors is expanding the cleanroom of its North Carolina foundry to house a new high-volume line of advanced packaging (AP) equipment.
Hprobe today announced the demonstration of a new 3D magnetic generator design resulting in magnetic field accuracy of less than 5µT (5 microteslas) for wafer level probing of 3D angular magnetic sensors.
The ST25R3918 from STMicroelectronics is a multi-purpose NFC transceiver supporting passive peer-to-peer functionality and NFC card-emulation mode as well as NFC reader operation.
Graphcore, the British maker of the Intelligence Processing Unit (IPU), a new type of microprocessor specifically designed to support artificial intelligence workloads, and SiPearl, the Franco-German company that designs the high computing power and low consumption microprocessor for supercomputers, have entered into a strategic partnership.
ETEL’s new UltimET Advanced is a powerful and versatile multi-axis motion controller now available to bring fast real-time processing and a higher level of flexibility to a variety of complex manufacturing applications.
The global high end ASIC market will reach nearly $20 billion in five years, driven by high-performance computing applications in data processing and telecommunications, according to James Huang, Vice President, Alchip Technologies.
The worldwide semiconductor shortage will persist through 2021, and is expected to recover to normal levels by the second quarter of 2022, according to Gartner, Inc.
Rice University theorists simulate the molecular transitions that take place inside a furnace to create 2D molybdenum disulfide, a semiconductor that could find a home in next-generation electronics.
Semiconductor revenue in Q1 2021 grew from the previous quarter, Q4 2020, marking just the third time that has happened since research firm Omdia began tracking quarterly semiconductor revenue in 2002.
STMicroelectronics and Politecnico di Milano, a scientific-technological university, which trains engineers, architects and industrial designers, announced today a five-year collaboration agreement in the presence of Italy’s Minister of Economic Development Giancarlo Giorgetti.
The research report on ‘global semiconductor process control equipment market’ is all-inclusive analysis of this domain, inclusive of historical data and verifiable projections for 2020-2025.
After a 3% drop in 2020, the automotive IC market is forecast to surge more than 25% in 2021.
A research team from the University of Massachusetts Amherst has created an electronic microsystem that can intelligently respond to information inputs without any external energy input, much like a self-autonomous living organism.
The Semiconductor Industry Association announced worldwide sales of semiconductors were $41.8 billion in April 2021, an increase of 1.9% from the March 2021 total of $41.0 billion and 21.7% more than the April 2020 total of $34.4 billion.
sureCore Limited and Intrinsic Ltd today announced a collaboration agreement to bring high performance embedded RRAM to market.
indie Semiconductor and Thunder Bridge Acquisition II, Ltd. today announced the completion of their previously announced business combination.
The U.S. Naval Research Laboratory’s gallium nitride (GaN) wafers, also called large-area engineered substrates, can enable GaN to potentially be a displacement technology for silicon semiconductors used in microelectronics, particularly in power electronics.
Cree, Inc. today announced that Shenzhen Gospower Digital Technology Co., Ltd. will utilize Cree’s Wolfspeed 650V silicon carbide MOSFETs for next generation Common Redundant Power Supply (CRPS) solutions.
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