ZMC will represent ClassOne’s advanced Solstice single-wafer and Trident batch processing tools throughout the Southeast Asia (SEA) region, including Singapore, Malaysia, Vietnam, Philippines, and Thailand.
SEMI Applauds Findings on Cybersecurity Hardware Adoption in Europe
To strengthen cybersecurity for semiconductor manufacturing in Europe, the industry must unify behind security standards, support decision-makers in adopting new technologies, and identify new skill sets needed to deploy and manage cybersecurity hardware.
Weebit Scaling Down its ReRAM Technology to 22nm
Weebit Nano Limited announced that together with CEA-Leti it is scaling its embedded Resistive Random-Access Memory (ReRAM) technology down to 22nm – one of the industry’s most common process nodes.
RIBER Receives Order for a New Research Machine in the United States
RIBER, a global market leader for molecular beam epitaxy (MBE) equipment serving the semiconductor industry, is announcing an order for a MBE 32 research system in the United States.
CVEDIA Partners with AI Chipmaker Hailo to Launch Next-Generation Thermal Edge AI Solutions
Hailo, a AI (Artificial Intelligence) chipmaker, today announced its partnership with CVEDIA, a leader in edge computer vision software, to launch next-generation thermal edge AI solutions.
RIBER Pilot Line to Benefit from French State Financial Support
As part of the call for projects “Industry Stimulus Plan – Strategic Sectors,” launched by the French Ministry of Industry, RIBER, a global market leader for molecular beam epitaxy (MBE) equipment serving the semiconductor industry, has been awarded public funding to finance its 300mm pilot line.
Mobile Semiconductor’s 22FDX Register File Memory Compiler Receives GlobalFoundries Platinum Status
At the end of 2021, GlobalFoundries awarded Mobile Semiconductor Platinum Qualification Status for the RF1P-ULL-GF22FDX Memory Compiler.
The Development of the World’s First Distortion-Free Stretchable Micro-LED Meta-Display Technology
Development of a stretchable display where images can be transversely/ longitudinally stretched up to 25% without distortion. Results of this study have been published in Advanced Functional Materials.
A New Community Is Being Built at UCLA Around PyGears, a New Framework for Agile Chip Design
PyGears, a new hardware description language, has been introduced at UCLA in order to implement the idea of agile chip design based on reusable components and high-level Python constructs.
Pat Gelsinger Takes us on a Trip Down Memory Lane – and a Look Ahead: Part 1
Last November, Intel held their Innovation Days, with opening keynote by CEO Pat Gelsinger.
