Scientists from the Korea Institute of Machinery & Materials (KIMM, President Sang Jin Park) under the Ministry of Science and ICT, and the Nanyang Technological University, Singapore (NTU Singapore, President Subra Suresh) have developed a technique to create a highly uniform and scalable semiconductor wafer, paving the way to higher cup yield, more cost-efficient semiconductors and mitigating the global chip shortage.
Ln-Doped Lead-Free Double Perovskite Based Ultra-Broadband LED
Lanthanide ions were successfully incorporated into Bi:Cs2AgInCl6 lead-free double perovskite (DP), yielding ultrabroadband continuous emission. To reduce energy transfer and cross-relaxation processes among activators, “DP-in-glass composite” (DiG) structure was designed, whose PLQY is almost three times that of a multi-doped DP. Finally, a compact ultrabroadband (400~2000 nm) light source was fabricated by coupling the DiG with commercial UV LED chip, which has promising applications in nondestructive spectroscopic analyses and multifunctional illumination.
Scientists Have Improved Polymer Films for Organic Electronics
Researchers improved polymer films, the basis for organic electric. The new material is promising for increasing the capacity in lithium polymer batteries, solar cells, and modernization of organic field-effect transistors.
Moov Announces New Tempe, Arizona HQ, Plans to Triple Headcount in 2022
Moov, a data-fueled marketplace for used semiconductor manufacturing equipment, today announced the location of its new headquarters in the 100 Mill building in Tempe, Arizona.
Making Memory Serve Correctly: Fixing an Inherent Problem in Next-Generation Magnetic RAM
Scientists propose method to eliminate a disturbance source in spin-orbit torque RAM, a type of memory that could enable ultra-low-power electronics.
Pat Gelsinger Takes Us on a Trip Down Memory Lane – and a Look Ahead: Part 2
Having made the transition to FinFET, new generations followed, and we now have the Intel 7 Alder Lake part, released towards the end of last year.
Intel Announces Initial Investment of More Than €33 Billion for Semiconductor R&D and Manufacturing in EU
Investments advance world-class semiconductor ecosystem in Europe, spanning France, Germany, Ireland, Italy, Poland and Spain.
Tiny Battery-Free Devices Float in the Wind like Dandelion Seeds
Inspired by how dandelions use the wind to distribute their seeds, a University of Washington team has developed a tiny sensor-carrying device that can be blown by the wind as it tumbles toward the ground.
Luminous Computing Announces Michael Hochberg as President
Luminous Computing, the machine learning systems company building the world’s most powerful AI supercomputers, today announced the appointment of Michael Hochberg as President, where he is running engineering and operations.
SiFive Leadership in RISC-V Powers $2.5B+ Company Valuation
SiFive, Inc. today announced it has raised $175 million in a Series F financing round, valuing the company at over $2.5 billion.
