Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

SmartKem and Nanosys Enter into Joint Development Agreement

SmartKem, Inc., a company seeking to reshape the world of electronics with a revolutionary new organic semiconductor platform that enables a new generation of displays, and Nanosys, Inc. announced today that they have entered into a joint development agreement to work together on a new generation of low-cost solution printed microLED and quantum dot materials for advanced displays.

Anant Adke of Siemens EDA Joins Si2 Board of Directors

Anant Adke, vice president of Engineering, Siemens EDA, has been elected to the Silicon Integration Initiative board of directors. He replaces Juan Rey, who retired from Siemens EDA in December.

Weebit Appoints NVM Expert Gabriel Molas as Chief Scientist

Weebit Nano Limited, a developer of next-generation memory technologies for the global semiconductor industry, announced it has appointed ReRAM and non-volatile memory (NVM) expert Gabriel Molas as Chief Scientist.

Alchip Technology Moves North America Operation

Alchip Technologies, Limited has moved its North American headquarters to upgraded accommodations at 2107 North First Street, San Jose, California.

Veeco Receives Multi-Tool Order

Veeco Instruments Inc. today announced that a manufacturer of optoelectronic components has ordered multiple Lumina Metal Organic Chemical Vapor Deposition (MOCVD) Systems for production of leading-edge photonics applications.

Kulicke & Soffa Expands Thermal Compression Bonding Capabilities to Accelerate Innovation in the Integration of Semiconductor and Silicon Photonics

Kulicke and Soffa Industries, Inc.  announced it is expanding its Thermal Compression Bonding (TCB) capabilities to accelerate innovation in the integration of semiconductor and Silicon Photonics.

pSemi Introduces Complete 5G mmWave RF Front-End (RFFE) Solution

pSemi Corporation, a Murata company focused on semiconductor integration, announces the expansion of its millimeter wave (mmWave) RF front-end portfolio for 5G wireless infrastructure applications.

Cadence Appoints Mary Louise Krakauer to Board of Directors

Cadence Design Systems, Inc. announced the appointment of Mary Louise (ML) Krakauer to its board of directors, effective January 31, 2022.

SiTime Introduces XCalibur, a MEMS Solution for the Timing Industry’s Supply Chain Disruption

SiTime Corporation today introduced the SiTime XCalibur active resonator. This new product category solves supply chain constraints using programmable semiconductors to deliver a drop-in replacement for quartz crystal resonators.

Technique Smooths Path for AI Training in Wireless Devices

Federated learning is a great tool for training artificial intelligence (AI) systems while protecting data privacy, but the amount of data traffic involved has made it unwieldy for systems that include wireless devices. A new technique uses compression to drastically reduce the size of data transmissions, creating additional opportunities for AI training on wireless technologies.