Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

Magnachip Enters into Definitive Agreement with Wise Road Capital in a Take Private Transaction Valued at $1.4 Billion

Magnachip Semiconductor Corporation, the South Korean leader in display and power solutions, today announced that it has entered into a definitive agreement with South Dearborn Limited, a company incorporated in the Cayman Islands, and Michigan Merger Sub, Inc., a Delaware corporation, which are investment vehicles established by Wise Road Capital LTD and certain of its limited partners.

CAE Strengthens Presence in Asia with Seven New Facilities

CAE, the industry’s first software and data-driven physical commodity trader for semiconductor capital equipment and commodities, announces a strengthened presence in the Asia-Pacificregion with offices in Japan, Taiwan, China, Korea, Singapore, India and Australia.

Deciphering the Secrets of Printed Electronics

We live in a world where we want our electronics to be flexible, bendable and stretchable apart from being intelligent. Printed electronics technology has emerged as the main route to enable this vision.

SME Announces Geoffrey Boothroyd Outstanding Young Manufacturing Engineers

The 14 awardees, age 35 or younger, are being recognized for their exceptional contributions and accomplishments in manufacturing throughout the early stages of their careers.

STMicroelectronics and OQmented to Jointly Develop, Manufacture, and Market Advanced MEMS Mirror-Based Laser-Beam Scanning Solutions

The joint effort aims to build on the expertise of both companies to advance the technology and products behind the leading MEMS-mirror-based laser-beam scanning (LBS) solutions in the market.

TopLine Awarded US Patent for CCGA Lead Free Solder Columns

TopLine Corporation, a provider of electronic components, services, and component engineering technology, has been granted US patent 10,937,752 for Lead Free Solder Columns for Column Grid Array Substrates.

Samsung and Marvell Unveil New System-on-a-Chip to Advance 5G Networks

Samsung Electronics Co., Ltd. and Marvell today announced that the companies jointly developed a new System-on-a-Chip (SoC) to enhance 5G network performance.

Keysight Solutions Deployed by MediaTek to Validate First 5G Modem with mmWave Spectrum Capabilities

Integrated 5G test solutions speed market introduction of new designs.

New Nanotransistors Keep Their Cool at High Voltages

Power converters play an essential role in electric vehicles and solar panels, for example, but tend to lose a lot of power in the form of heat in the electricity conversion process. Thanks to a new type of transistor developed at EPFL, these converters can perform at substantially improved efficiencies, especially in high-power applications.

Scientists Uncover a Process That Stands in the Way of Making Quantum Dots Brighter

The results have important implications for today’s TV and display screens and for future technologies where light takes the place of electrons and fluids.