Design

What the CHIPS and Science Act Could Mean for Domestic Semiconductor Manufacturing Innovation

It’s important for semiconductor companies to utilize the CHIPS Act funding as effectively as possible. One way to do this is by switching to a chiplet-based design flow. 

Purdue Partners with IIT Madras to Create Semiconductor Dual-Degree Program

Purdue University and the Indian Institute of Technology Madras (IIT Madras) will soon launch a dual-degree master’s program in semiconductors as part of a newly signed agreement to cooperate in education and research in semiconductors and microelectronics.

Canada’s Semiconductor Council Announces Managing Director

Canada’s Semiconductor Council (CSC) announced Dr. C. Paul Slaby as Managing Director, effective November 1, 2022.

Three Trends Shaping the Future of EDA

As more systems companies move to design their own chips and electronic products, what are the key EDA trends impacting the pace of innovation?

SEMI Announces Semiconductor Climate Consortium Founding Members

Consortium aims to accelerate reduction of greenhouse gas emissions across semiconductor value chain. Consortium members and SEMI to participate at 2022 United Nations Climate Change Conference (COP27).

Professors from UC-Santa Barbara and UC-San Diego to be Honored for Excellence in Semiconductor Research

SIA and SRC present the University Research Awards annually to individuals who demonstrate excellence in advancing research in semiconductor technology and design.

Standardize to Optimize

Product data and analytics bring valuable insights, but without standardization, it can only take you so far.

The CHIPS and Science Act of 2022: U.S. Semiconductor Industry Must Act Now to Seize Opportunities

Organizations must be ready to act once the funding and bidding opportunities for valuable contracts start to flow.

GOWIN Semiconductor Partners with Metrics for Simulator Tool

GOWIN Semiconductor Corp, the world’s fastest-growing programmable logic company, is partnering with Metrics Design Automation to introduce DSim Cloud as part of GOWIN’s FPGA EDA solution.

Cadence’s New Flow Automates Custom/Analog Design Migration on TSMC Advanced Technologies

Cadence Design Systems, Inc.collaborated with TSMC to develop a node-to-node design migration flow built upon the Cadence Virtuoso design platform for custom/analog IC blocks that use TSMC’s advanced process technologies.

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