Design

Henkel Opens Application Engineering Center for Electronics Applications in South China

Henkel announced the opening of its South China Application Engineering Center (SCAEC) in Dongguan, Guangdong Province.

Cadence and GlobalFoundries Collaborate on RF and mmWave Design Flow to Accelerate Mobile and 5G Innovation

Cadence Design Systems, Inc. today announced that it has collaborated with GlobalFoundries (GF) to accelerate 5G and mobile design innovation through the delivery of the Cadence RF and mmWave flow for the GF 22FDX platform.

Chung-Ang University Researchers Breathe Life into Sensors with Versatile Gas Masks

The researchers developed a novel self-powered device that is driven by respiration, allowing them to be integrated with gas masks.

Intel Elects Lip-Bu Tan to Its Board of Directors

Intel Corporation today announced that Lip‑Bu Tan, executive chairman of Cadence Design Systems Inc., chairman of Walden International, and founding managing partner of Celesta Capital and Walden Catalyst Ventures, was elected to Intel’s board of directors, effective Sept. 1, 2022.

Applied Materials Chief Technology Officer Dr. Om Nalamasu Receives IEEE Frederik Philips Award

Applied Materials, Inc. today announced that Dr. Omkaram (Om) Nalamasu, Senior Vice President and Chief Technology Officer, is the recipient of the 2023 IEEE Frederik Philips Award, which honors outstanding accomplishments in the management of research and development resulting in effective innovation in the electrical and electronics industry.

Researchers 3D Print First High-Performance Nanostructured Alloy That’s Both Ultrastrong and Ductile

A team of researchers at the University of Massachusetts Amherst and the Georgia Institute of Technology has 3D printed a dual-phase, nanostructured high-entropy alloy that exceeds the strength and ductility of other state-of-the-art additively manufactured materials, which could lead to higher-performance components for applications in aerospace, medicine, energy and transportation.

US CHIPS ACT Now Approved by President Biden – What’s Next?

Yesterday, President Biden signed the long-awaited CHIPs Act into law. So, “what’s next” for the US semiconductor industry? The electronic materials advisory firm TECHCET offers insight. 

President Biden Signs CHIPS Act Into Law

The legislation provides a 25% tax credit for U.S. facilities that produce semiconductors or chipmaking equipment and $52 billion in funding for new semiconductor programs.

The Democratization of Chip Design

The open-source silicon movement with a community-based, open-source platform of easy-to-use, easy-to-access tools is a practical and efficient way to ensure innovation and has the potential to drive exponential semiconductor industry growth.

InnovationLab Demonstrates Breakthrough PCB Production Method Based on Additive Manufacturing

InnovationLab, the expert in printed electronics “from lab to fab”, announces it has achieved a breakthrough in additive manufacturing of printed circuit boards (PCBs), helping meet higher environmental standards for electronics production while also reducing costs.

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