Renesas Expands Access to Portfolio of Leading-Edge IP Licenses

Renesas Electronics Corporation (TSE:6723), a supplier of advanced semiconductor solutions, today announced expanded access to its highly sought portfolio of intellectual property (IP) licenses that allow designers to meet a broad range of customer requirements in a rapidly changing industry. Starting today, customers will have access to IPs such as advanced 7nm (nanometer) SRAM and TCAM, and leading-edge standard Ethernet time-sensitive networking (TSN) IP. Furthermore, Renesas is working on providing a system IP which includes PIM (processing in memory), which attracted attention as an AI accelerator, presented in a conference paper in June 2019.

New Architected Material Shape-Changes to Tune Its Qualities

Architected materials are comprised of micron and nanoscale structures like crossbeams, arches, domes, and spirals, much like the elements of a building’s architecture. Researchers from the California Institute of Technology, the Georgia Institute of Technology, and ETH Zurich have made an architected material that shifts the shapes of these structures. When a slight current is applied, nanoscale beams thicken and bend into arches that increasingly bow as the current is boosted. The material maintains the new shape even when the current is off, and the shape can be changed back by reversing the current. Both are novel characteristics.

North American Semiconductor Equipment Industry Posts September 2019 Billings

North America-based manufacturers of semiconductor equipment posted $1.95 billion in billings worldwide in September 2019 (three-month average basis), according to the September Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 2.4 percent lower than the final August 2019 level of $2.00 billion, and is 6.0 percent lower than the September 2018 billings level of $2.08 billion. “Monthly billings of North American equipment manufacturers declined for the second consecutive month,” said Ajit Manocha, president and CEO of SEMI.

ESD Alliance Takes SMART Design to SEMICON Europa

The Electronic System Design (ESD) Alliance, a SEMI Strategic Association Partner, today unveiled SMART Design, the first system-centric series showcasing advances in electronic system design to be held at SEMICON Europa. SEMICON Europa will begin Tuesday, November 12, through Friday, November 15, at Messe München in Munich, Germany. SMART Design is scheduled for Wednesday, November 13, from 2:30 p.m. until 5 p.m. in TechARENA 1, Hall B1.

New Operational Technology Cyber Security Alliance Launches to Deliver Comprehensive Cyber Security Guidelines for Operational Technology

Cyber-attacks on critical and industrial infrastructure are on the rise, impacting operational reliability and business risk across all industries, including utilities, manufacturing and oil & gas. Threats to operational technology (OT) – the hardware and software dedicated to monitoring and controlling physical devices such as valves, pumps, etc. – can disrupt operations, negatively impact productivity, cause ecological damage and compromise human safety. To help mitigate this risk, a new global alliance focused on cyber security launched today. The Operational Technology Cyber Security Alliance (OTCSA) was established to help companies address the OT security challenges that continue to put operations, and consequently, business at risk.

UCI Scientists Reveal Mechanism of Electron Charge Exchange in Molecules

Researchers at the University of California, Irvine have developed a new scanning transmission electron microscopy method that enables visualization of the electric charge density of materials at sub-angstrom resolution. With this technique, the UCI scientists were able to observe electron distribution between atoms and molecules and uncover clues to the origins of ferroelectricity, the capacity of certain crystals to possess spontaneous electric polarization that can be switched by the application of an electric field. The research, which is highlighted in a study published today in Nature, also revealed the mechanism of charge transfer between two materials.

Synopsys, Arm, and Samsung Foundry Enable Accelerated Development of Next-Generation Arm “Hercules” Processor on 5LPE Process

Synopsys, Inc. today announced that Synopsys, Arm, and Samsung have actively collaborated on solutions to enable early adoption of the next-generation Arm-based processor. Design-ready solutions are based on the artificial intelligence (AI)-enhanced, cloud-ready Fusion Design Platform from Synopsys, along with Arm Artisan Physical IP and POP IP for Samsung Foundry’s advanced 5LPE process. These solutions will accelerate development of the next wave of semiconductor system-on-chips (SoCs), including designs for high-performance computing (HPC), automotive, 5G, and AI market segments. The collaboration will help customers optimize power, performance, and area (PPA), and achieve faster time-to-market while providing full-flow quality-of-results (QoR) and time-to-results (TTR).

Intel Enables AI Acceleration and Brings New Pricing to Intel Xeon W and X-Series Processors

Intel today unveiled its latest lineup of Intel Xeon W and X-series processors, which puts new classes of computing performance and AI acceleration into the hands of professional creators and PC enthusiasts. Custom-designed to address the diverse needs of these growing audiences, the new Xeon W-2200 and X-series processors are targeted to be available starting November, along with a new pricing structure that represents an easier step up for creators and enthusiasts from Intel Core S-series mainstream products. Intel is the only company that delivers a full portfolio of products precision-tuned to handle the sustained compute-intensive workloads used by professional creators and enthusiasts every day.

2019 IEEE International Electron Devices Meeting to Shine the Spotlight on the Latest Advances in Semiconductors and Related Technologies

“Innovative Devices for an Era of Connected Intelligence” is the theme of the upcoming 2019 IEEE International Electron Devices Meeting (December 7-11, 2019), chosen to reflect the conference’s focus this year on the processors, memories, 3D architectures, power devices, quantum computing concepts and other technologies needed to drive diverse new applications of electronics technology forward. The 65th annual IEDM will feature a technical program of 238 papers given by many of the world’s top scientists and engineers in the field. It will be preceded by a series of 90-minute tutorials on Saturday, Dec. 7, and by day-long short courses on Sunday, Dec. 8.

The Honorable Kevin Rudd to Deliver Keynote Address at 2019 SIA Award Dinner

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today announced The Honorable Kevin Rudd, former prime minister of Australia and current president of the Asia Society Policy Institute, will deliver the keynote address at the 2019 SIA Award Dinner, which will take place on Thursday, Nov. 7 in San Jose, Calif. Rudd will offer insights on the future directions of the U.S.-China trade war, the risks of general economic decoupling, and implications for future collaboration in technology.

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