Leti, a research institute of CEA Tech, recently announced a new technology for fabricating GaN microLED displays for applications ranging from smart watches to TVs with no size limit. The approach fabricates elementary units of all-in-one red, green, blue (RGB) microLEDs on a CMOS driving circuit, and transfers the devices to a simple receiving substrate. The units are fabricated with a full semiconductor, wafer-scale approach. “This new process, in the proof-of-concept…
Design
USC ISI and Intel Custom Foundry Collaborate to Spur Microelectronics Innovation
USC Viterbi’s Information Sciences Institute (ISI) and the Intel Corporation’s custom foundry organization today announced a collaboration to design, fabricate and package integrated circuits (ICs) through USC ISI’s MOSIS unit. The collaboration combines MOSIS’s industry-leading integrated circuit manufacturing expertise with Intel’s high-performance complementary metal-oxide semiconductor (CMOS) fabrication and packaging technology. It positions ISI and Intel Custom Foundry (ICF) to lead a new era of high-performance microelectronic manufacturing for the U.S. and global IC…
Audi First Carmaker To Join SEMI
SEMI, the industry association serving the global electronics manufacturing and design supply chain, announced that AUDI AG, a leading German manufacturer of luxury vehicles, has become the first automotive OEM to join SEMI. SEMI membership will give Audi access to SEMI core competencies in developing international standards and harmonizing technology roadmaps and enable the automaker to leverage the global SEMI platform to promote industry alignment across supply-chain segments. Audi is a…
Samsung Foundry Begins Partnership with Silvaco to Launch their Semiconductor IP Assets
Silvaco Inc., a supplier of EDA software and design IP, announced that the semiconductor design IP of Samsung Foundry is now marketed, licensed and supported through Silvaco Inc. The addition of Samsung production-proven design IP complements Silvaco’s existing SIPware™ IP products and solutions—embedded processors, wired interfaces, bus fabrics, peripheral controllers, cores for automotive, consumer and IoT/sensor applications. The initial offering of hard design IP is for the 14nm process node and is…
