MEMS

CEVA Announces Milestone of 100 Million CEVA-powered Cellular IoT Chips Shipped

CEVA, Inc., the licensor of wireless connectivity and smart sensing technologies and integrated IP solutions, today announced that more than 100 million CEVA-powered cellular IoT chips have been shipped by CEVA licensees since the beginning of 2020.

Advanced MEMS Sensors from STMicroelectronics Power-Up the Onlife Era

STMicroelectronics is introducing its third generation of MEMS sensors. The new sensors enable the next leap in performance and features for consumer mobiles and smart industries, healthcare, and retail.

UMC Announces New 22nm Wafer Fab in Singapore

United Microelectronics Corporation, a global semiconductor foundry, today announced that its Board of Directors has approved a plan to build a new advanced manufacturing facility next to its existing 300mm fab (Fab12i) in Singapore.

SIA Statement on Sanctions on Russia

The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer regarding new export control rules announced today in response to Russia’s invasion of Ukraine.

Microprocessor Growth Will Slow in 2022 after Cellphone MPU Surge

Total MPU sales are expected to rise 7% this year with cellphone processors increasing 10% following a 31% jump in 2021; modest growth is seen in computer CPUs and embedded MPUs, says new 1Q update.

‘Seeing’ Non-Uniformities in 2D Materials May Lead to New Medical Sensors

A novel and better approach at detecting non-uniformities in the optical properties of two-dimensional materials could potentially open the door to new uses for these materials, such as for drug detection, according to a team of researchers.  

Rigetti Computing Announces Michael Harburn as Chief Technical Officer

Rigetti Holdings, Inc., a developer of hybrid quantum-classical computing systems, today announced Michael Harburn, who previously held the role of Senior Vice President, Fabrication Operations and QPU Engineering at Rigetti, has been appointed Chief Technical Officer.

POET Technologies and Liobate Technologies Collaborate on Ultra-High-Performance Photonic Integrated Circuits

POET Technologies Inc., the designer and developer of the POET Optical Interposer and Photonic Integrated Circuits (PICs) for the data center and tele-communication markets, today announced a collaboration with Liobate Technologies to incorporate advanced Thin-Film Lithium Niobate modulators onto POET’s Optical Engines supporting power-efficient ultra-high-bandwidth electro-optic conversion for data center and telecom applications.

Imec Pioneers Ultra-Wideband Transmitter Chip That Pushes Data Rates up to 1.66Gb/s with Milliwatt Power

At this week’s International Solid-State Circuits Conference (ISSCC), imec presented a new impulse-radio ultra-wideband (IR-UWB) transmitter chip that could redefine the future of UWB technology.

Manoj R. Shah, Former Professor of Practice at Rensselaer Polytechnic Institute, Elected to the National Academy of Engineering

Manoj R. Shah, former Professor of Practice at Rensselaer Polytechnic Institute, has been elected to the National Academy of Engineering (NAE) for his “technical advancements in design, analysis, and applications of electric machines.”

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