DuPont Interconnect Solutions (ICS), a business within the Electronics & Industrial segment, will introduce the Pyralux HP laminate adhesive system at the 2022 Institute for Printed Circuits (IPC) APEX Exposition to be held in San Diego, CA from January 25 – 27, 2022.
MEMS
Toshiba Opens the Way to Longer Life Wearables and IoT Devices With New IC Chips
Minute, ultra-low quiescent current load switch ICs yield huge performance improvements.
Gelest Inc. Names Dr. Jonathan Goff as President
Gelest Inc. names Dr. Jonathan Goff as President of Gelest effective immediately.
Advancing the Future of Semiconductor Manufacturing
Manufacturing innovation can be achieved through greater capacity utilization, component reliability, and process control.
VSORA Introduces Tyr Chip Family Enabling L2-L5 Autonomous Driving
VSORA, provider of high-performance silicon intellectual property (IP) solutions for artificial intelligence (AI), digital communications and advanced driver-assistance systems (ADAS) applications, today unveiled a family of PetaFLOPS computational companion chips to accelerate Level 3 (L3) through Level 5 (L5) autonomous vehicle designs.
Micron Ships the Industry’s First 176-Layer QLC NAND in Volume and Unveils the 2400 PCIe Gen4 Client SSD
Micron Technology, Inc. today announced it has begun volume shipments of the world’s first 176-layer QLC NAND SSD. Built with the most advanced NAND architecture, Micron’s 176-layer QLC NAND delivers the industry’s leading storage density and optimized performance for a broad range of data-rich applications.
Imec Tenure-Track Holder Christian Haffner Awarded With ERC Starting Grant
Today, imec, the research and innovation hub in nanoelectronics and digital technologies, announces that the European Research Council (ERC) has awarded a prestigious Starting Grant to Christian Haffner.
Global Fab Equipment Spending Projected to Log Record High in 2022 to Mark Third Consecutive Year of Growth, SEMI Reports
Global fab equipment spending for front end facilities is expected to rise 10% year-over-year (YOY) in 2022 to a new all-time high of over US$98 billion, marking a third consecutive year of growth, SEMI highlighted today in its quarterly World Fab Forecast report.
A*STAR’s Institute of Microelectronics and Soitec to Develop Next-Generation Silicon Carbide Semiconductors
The Institute of Microelectronics (IME) at the Agency for Science, Technology and Research (A*STAR) and Soitec (Euronext Paris) have announced a research collaboration to develop next-generation silicon carbide (SiC) semiconductor devices to power electric vehicles and advanced high-voltage electronic devices.
SEMI Reschedules Industry Strategy Symposium to April 3-6, 2022
SEMI today rescheduled the Industry Strategy Symposium (ISS) 2022 from January 9-12 to April 3-6 due to a resurgence of COVID-19 cases in the United States.
