ACM Research, Inc., a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today introduced its comprehensive tool set to support compound semiconductor manufacturing.
Packaging
SRC and NSF to Support Semiconductor Research Experiences for Undergraduates
The U.S. National Science Foundation (NSF) and Semiconductor Research Corporation (SRC) recently signed a memorandum of understanding to support hands-on research opportunities for undergraduate students in technical areas related to semiconductors.
JEDEC Publishes HBM3 Update to High Bandwidth Memory (HBM) Standard
JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of the next version of its High Bandwidth Memory (HBM) DRAM standard.
NucleiSys Adopts Breker’s System Coherency TrekApp
Breker Verification Systems announced Nuclei System Technology deployed its System Coherency Synthesis TrekApp to ensure coherency of its configurable low-power and high-performance 32- and 64-bit RISC-V processor intellectual property (IP) designs.
America COMPETES Act of 2022 Is a Much-Needed Bill, but Not Sufficient to Compete with China, Says ITIF
Following the introduction of the America COMPETES Act of 2022 from the House of Representatives, companion legislation to the U.S. Innovation and Competition Act (USICA), which passed the Senate last June, the Information Technology and Innovation Foundation (ITIF), the leading think tank for science and technology policy, released the following statement.
CEVA Introduces Security IP for Die-to-Die Communication Between Chiplets
CEVA, Inc. announced today that it has expanded its IP market reach by introducing the Fortrix SecureD2D IP solution.
North American Semiconductor Equipment Industry Posts December 2021 Billings
After record-breaking billings of North America-based semiconductor equipment manufacturers in November 2021, December billings remained robust and were the second-highest ever.
SPIE and the University of Rochester Announce $1 Million Optics Graduate Fellowship
SPIE, the international society for optics and photonics, and the University of Rochester have announced the establishment of the SPIE Graduate Fellowship in Optical Sciences and Engineering.
Top Tier Semiconductor Supplier Qualifies Veeco’s Wet Processing System for Next Generation High Bandwidth Memory Applications
Veeco Instruments Inc. today announced that a world leading semiconductor supplier has qualified Veeco’s WaferStorm Wet Processing System for advanced packaging applications that will support next generation high bandwidth memory (HBM).
SEMI Industry Strategy Symposium Europe to Spotlight Environmental Sustainability, Social Responsibility and Supply Chain Resilience
SEMI announced today the return of the Industry Strategy Symposium Europe (ISS Europe) 2022 as an in-person event to Brussels, Belgium, May 30, with insights from leading analysts, economists, policymakers and technologists on major forces impacting the semiconductor industry.
