Packaging

IEEE International Electron Devices Meeting Announces 2019 Call for Papers

The 65th annual IEEE International Electron Devices Meeting(IEDM), to be held at the Hilton San Francisco Union Square hotel December 7–11, 2019, has issued a Call for Papers seeking the world’s best original work in all areas of microelectronics research and development. The paper submission deadline this year is Friday, July 26, 2019. Authors are asked to submit four-page camera-ready papers. Accepted papers will be published as-is in the proceedings. Only a very small…

Edwards Responds to United Nations’ New Greenhouse Gas Guidelines

The Intergovernmental Panel on Climate Change (IPCC), the United Nations’ body for assessing the science related to climate change, released the latest refinement to its 2006 Guidelines. As part of an effort to tackle climate change, the refined regulations tighten control on new greenhouse gases used in semiconductor manufacturing and increase requirements for reporting and accountability for manufacturers. “The IPCC has recognised that there is a gap between the amount…

USC ISI and Intel Custom Foundry Collaborate to Spur Microelectronics Innovation

USC Viterbi’s Information Sciences Institute (ISI) and the Intel Corporation’s custom foundry organization today announced a collaboration to design, fabricate and package integrated circuits (ICs) through USC ISI’s MOSIS unit.  The collaboration combines MOSIS’s industry-leading integrated circuit manufacturing expertise with Intel’s high-performance complementary metal-oxide semiconductor (CMOS) fabrication and packaging technology. It positions ISI and Intel Custom Foundry (ICF) to lead a new era of high-performance microelectronic manufacturing for the U.S. and global IC…

Sensors/Actuators Reach Record Sales on Slower Growth

After two strong years, the sensor and actuator market has cooled off as a result of inventory drawdowns, slowing unit shipments, and economic uncertainty, says report.

SEMI Spring Washington Forum – Connecting Members with Policymakers at a Critical Time

Tensions between the United States and China have reached fever pitch. Ongoing trade negotiations between the U.S. and China broke down earlier this month over reported backpedaling by China on key concessions in a proposed Trump administration deal.

Audi First Carmaker To Join SEMI

SEMI, the industry association serving the global electronics manufacturing and design supply chain, announced that AUDI…

Intel Recaptures Number One Quarterly Semi Supplier Ranking from Samsung

IC Insights will release its May Update to the 2019 McClean Report later this month.  This Update includes a discussion of…

Rudolph Receives First Order for its StepFAST Solution for Fan-out Panel-level Packaging

Rudolph Technologies, Inc. (NYSE: RTEC) announced that an outsourced assembly and test facility (OSAT) has…

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