Applied Materials, Inc. today unveiled a new way to engineer the wiring of advanced logic chips that enables scaling to the 3nm node and beyond.
Packaging
NHanced Semiconductors Announces Dedicated High‑Volume Advanced Packaging Facility
NHanced Semiconductors is expanding the cleanroom of its North Carolina foundry to house a new high-volume line of advanced packaging (AP) equipment.
Hprobe Announces Breakthrough in High-Volume Testing for Automotive/Consumer Advanced 3D Magnetic Sensors
Hprobe today announced the demonstration of a new 3D magnetic generator design resulting in magnetic field accuracy of less than 5µT (5 microteslas) for wafer level probing of 3D angular magnetic sensors.
High End FinFet ASIC Market To Approach $20 Billion
The global high end ASIC market will reach nearly $20 billion in five years, driven by high-performance computing applications in data processing and telecommunications, according to James Huang, Vice President, Alchip Technologies.
Gartner Says Global Chip Shortage Expected to Persist Until Second Quarter of 2022
The worldwide semiconductor shortage will persist through 2021, and is expected to recover to normal levels by the second quarter of 2022, according to Gartner, Inc.
sureCore & Intrinsic Announce Collaboration to Bring Novel RRAM Technology to Market
sureCore Limited and Intrinsic Ltd today announced a collaboration agreement to bring high performance embedded RRAM to market.
Cree and Gospower Deliver Silicon Carbide to Server Power Supply Market
Cree, Inc. today announced that Shenzhen Gospower Digital Technology Co., Ltd. will utilize Cree’s Wolfspeed 650V silicon carbide MOSFETs for next generation Common Redundant Power Supply (CRPS) solutions.
SEMI Digital Transformation Conference to Help Microelectronics Industry Seize New Market Opportunities
Business and technology experts will gather July 13-14 at the SEMI Innovation for a Transforming World conference to discuss how digital transformation technologies such as machine learning and artificial intelligence (AI) are reshaping the way microelectronics need to be designed, manufacturing and packaged.
2021 Resist Revenues to Grow 6% to $2.0B and to $2.4B by 2025
TECHCET announced 2021 resist revenues are forecasted to grow 6%+ to $1.98B USD and to continue expanding to $2.37B in 2025.
SEMI Applauds Senate Passage of USICA Semiconductor Funding, Urges House Action
SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded the Senate’s passage of $52 billion in funding for new incentives to promote U.S. semiconductor manufacturing and research.
