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Semiconductor Industry Leaders Urge President Biden to Prioritize Funding for Semiconductor Manufacturing, Research

The Semiconductor Industry Association (SIA) Board of Directors, comprised of CEOs and senior executives at leading U.S. chip companies, today sent a letter to President Biden urging him to include substantial funding for semiconductor manufacturing and research in the administration’s economic recovery and infrastructure plan.

Top Five Wafer Capacity Leaders Raise Share of Global Capacity to 54%

Foundries and memory IC suppliers maintain strongest capacity presence.

Kuprion Introduces ActiveCopper Filled Thermal Vias

Kuprion, Inc., a spinout of Lockheed Martin, introduced ActiveCopper™ Filled Thermal Vias, leveraging a patented technology breakthrough that addresses the increased reliability demands of heat and power dissipation for complex, advanced high performance systems.

Sensata Technologies Signs Definitive Agreement to Acquire Xirgo Technologies

Sensata Technologies (NYSE: ST), a leading industrial technology company and provider of sensor-rich solutions that…

CHIPS Alliance Brings on Rob Mains as New Executive Director

CHIPS Alliance, the leading consortium advancing common and open hardware for interfaces, processors and systems,…

A*STAR’s Institute of Microelectronics Partners Eight Semiconductor Companies in Chip-to-Wafer Hybrid Bonding Consortium

A*STAR’s Institute of Microelectronics (IME) has partnered leading semiconductor companies to develop Chip-to-Wafer (C2W) Hybrid…

USABC Awards $732,448 Battery Technology Assessment Program Contract to Nanoramic Laboratories

The United States Advanced Battery Consortium LLC (USABC), a subsidiary of the United States Council…

Mouser Stocks Industry’s Widest Selection of Products

Mouser Electronics, Inc. is the industry’s leading authorized New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components.

ASM Pacific Technology and EV Group Join Forces to Enable Industry’s First Ultra Precision Die-to-Wafer Hybrid Bonding Solutions for 3D-IC Heterogeneous Integration

ASM PACIFIC TECHNOLOGY (ASM) and EV GROUP (EVG) announced the signing of a joint development agreement (JDA) to co-develop die-to-wafer hybrid bonding solutions for 3D-IC/heterogeneous integration applications.

Renesas and Dialog Semiconductor to Join Forces to Advance Global Leadership in Embedded Solutions

Renesas Electronics Corporation and Dialog Semiconductor Plc announced they have reached an agreement on the terms of a recommended all-cash acquisition by Renesas of the entire issued and to be issued share capital of Dialog (the “Acquisition”) for EUR 67.50 per share, representing a total equity value of approximately EUR 4.9 billion (approximately 615.7 billion yen).

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