CEA-Leti will unveil its latest scientific results in 3D sequential integration for neural networks, 3D RRAM for in-memory computing and GaN-on-Si for power electronics at IEDM 2020, Dec. 12-16. The event will be held virtually because of the coronavirus pandemic.
Packaging
SK hynix to Acquire Intel NAND Memory Business
SK hynix and Intel will endeavor to obtain required governmental approvals, expected in late 2021.
Optoelectronics, Sensors/Actuators, Discretes Stabilize in Covid-19 Crisis
About eight months after the Covid-19 virus pandemic accelerated around the world, sales of optoelectronics, sensors and actuators, and discrete semiconductors have stabilized, and in some cases, revenues have begun showing signs of a slight recovery in the second half of 2020
IAR Systems Brings Functional Safety Tools to RISC-V With Certification For IEC 61508 and ISO 26262
IAR Systems, the future-proof supplier of software tools and services for embedded development, further extends its strong tools offering for RISC-V by announcing a certified version of its development tools.
Next-Generation Computer Chip With Two Heads
It’s a major breakthrough in the field of electronics. Engineers at EPFL’s Laboratory of Nanoscale Electronics and Structures (LANES) have developed a next-generation circuit that allows for smaller, faster and more energy-efficient devices – which would have major benefits for artificial-intelligence systems.
System Integration Key to First IC/Package Co-Design Tool Success
A proprietary system integration platform is proving the key to early trial success of MZ Technology’s GENIO IC/Package Co-Design EDA Tool. GENIO became the first commercially available IC/Package Co-Design Tool when MZ Technologies began taking order in August.
New Liquid Pressure-sensitive Adhesives from DELO Ideal for Electronic Applications
DELO, one of the world’s leading manufacturers of industrial adhesives for automotive, consumer and industrial electronics applications, has developed two liquid pressure-sensitive adhesives that have similar properties to (double-sided) adhesive tapes, but are applied in liquid form.
Q3 Global Semiconductor Sales Increase 11 Percent Compared to Q2
The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors totaled $113.6 billion during the third quarter of 2020, an increase of 11.0 percent over the previous quarter and 5.8 percent more than the third quarter of 2019.
Cadence Wins Four 2020 TSMC OIP Partner of the Year Awards
Cadence Design Systems, Inc. announced that it has received four OIP Partner of the Year awards from TSMC for IP and EDA solutions.
‘Transparent Solar Cells’ Can Take Us Towards a New Era of Personalized Energy
Today, the imminent climate change crisis demands a shift from conventionally used fossil fuels to efficient sources of green energy. This has led to researchers looking into the concept of “personalized energy,” which would make on-site energy generation possible.
