NEC Corporation and Analog Devices, Inc. announced today that they have teamed up to design a 5G Network Massive MIMO Antenna Radio Unit for Rakuten Mobile.
Packaging
SiPearl Joins the CXL Consortium Behind Compute Express Link, the Breakthrough CPU-to-Device Interconnect
SiPearl has joined the CXL Consortium, whose founding members are the world leaders Alibaba, Cisco, Dell EMC, Facebook, Google, Hewlett Packard Enterprise, Huawei, Intel Corporation and Microsoft.
TSMC Recognizes Synopsys Collaboration with Four OIP Partner of the Year Awards for IP and EDA Solutions
Synopsys, Inc. today announced it has received four 2020 OIP Partner of the Year awards for IP and EDA solutions from TSMC demonstrating excellence in next-generation system-on-chip (SoC) and 3DIC design enablement.
Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
Synopsys, Inc. today announced that its 3DIC Compiler solution enabled Samsung Foundry to design, implement and tape out a complex 5-nanometer SoC featuring eight high-bandwidth memories (HBMs) in a single package.
Lattice CrossLink-NX FPGA Wins 2020 EM Best of Industry Award
Lattice Semiconductor Corporation (NASDAQ: LSCC), the low power programmable leader, announced the Lattice CrossLink-NX FPGA for embedded vision and AI applications won the Best FPGA Award in the Technology & Product Innovation category at the 2020 EM Best of Industry Awards.
Cobham Advanced Electronic Solutions Launches Industry’s Highest Density NAND Flash Memory Module for Space Applications
Cobham Advanced Electronic Solutions today announced the industry’s highest density NAND flash memory device for a range of demanding space applications.
First Multi-Zone Time-of-Flight Sensor Headlines STMicroelectronics Technology Powering Samsung Flagship Galaxy Note20 Ultra Phones
STMicroelectronics revealed that the newly unveiled Samsung Galaxy Note20 Ultra uses top-notch ST sensing and control technology, enhancing the smartphones’ high-end features while squeezing every watt from the power budget with minimal noise and package size.
Palomar Technologies and Fraunhofer IISB Form Research Initiative on Power Modules for Electric Vehicles
Palomar Technologies, a global leader in total process solutions for advanced photonics and microelectronic device packaging, and the Fraunhofer Institute for Integrated Systems and Device Technology IISB in Erlangen, Germany, announced their joint research initiative in the area of high-quality, void-free power module packaging for electric vehicles.
The Chip Warriors: A Podcast Documentary Series
America won the first cold war by outspending the Soviet Union in nuclear weapons. Many observers believe the US is engaged in a new cold war – with China. If true, it will be fought with technologies like 5G, artificial intelligence and semiconductors – but this time the US is being outspent.
Deca Partners with ADTEC Engineering to Enhance Adaptive Patterning for 2µm Chiplet Scaling
Deca, an industry-leading provider of advanced electronic interconnect technologies, announced today the signing of an agreement with ADTEC Engineering to join its new AP Live Network.
