Packaging

Intel Xeon Scalable Platform Built for Most Sensitive Workloads

Intel today unveiled the suite of new security features for the upcoming 3rd generation Intel® Xeon® Scalable platform, code-named “Ice Lake.” Intel is doubling down on its Security First Pledge, bringing its pioneering and proven Intel® Software Guard Extension (Intel® SGX) to the full spectrum of Ice Lake platforms, along with new features that include Intel® Total Memory Encryption (Intel® TME), Intel® Platform Firmware Resilience (Intel® PFR) and new cryptographic accelerators…

Temperature Sensor Market is Projected to Reach USD 9 Billion by 2026

According to a recent study from market research firm Global Market Insights, The temperature sensor market is projected to garner noteworthy gains on account of surging application across diverse electronic appliances.

A-Pro Semicon Chooses Veeco’s Propel HVM Platform for the Deveopment of GaN Power Seimconductor and 5G RF Devices

Veeco Instruments Inc. announced that A-Pro Semicon, Co., Ltd, a subsidiary of A-Pro’s semiconductor business based in Korea, has selected Veeco’s Propel HVM MOCVD system for the development and production of GaN-based power and 5G RF semiconductor devices.

Energy Taiwan 2020 Opens Tomorrow with Leading-Edge Smart Green Energy Technologies in the Spotlight

Energy Taiwan today hosts a pre-show press conference with government and industry opinion leaders sharing the latest perspectives on domestic policies, energy industry trends, corporate energy consumption, and domestic green energy transformation goals and opportunities.

Global Silicon Wafer Shipments on Track for 2020 Recovery and 2022 Record High, SEMI Reports

Global silicon wafer shipments are set to increase 2.4% year-over-year in 2020, with growth continuing in 2021 and shipments reaching a record high in 2022, SEMI reported today in its annual silicon shipment forecast for the semiconductor industry.

Advanced Packaging Market to Witness Steady Growth of 8% During 2020-2026

According to a recent study from market research firm Global Market Insights, the advanced packaging market is set to grow from its current market value of more than $25 billion to over $40 billion by 2026, gaining remarkable traction over the 2020 to 2026 period.

Photonic IC Market Is Expected To Exhibit A CAGR Of 42.6% During The Forecast Period Of 2020-2027

A photonic integrated circuit (IC) is a device that integrates two or more photonic functions similar to an electronic integrated circuit. Photonic ICs are used in fiber-optic communications to multiplex and demultiplex Wavelength Division Multiplex (WMD) carrier signals.

Tektronix Introduces S530 Series Parametric Test System with KTE 7 Software to Support Wide Bandgap (WBG) Fabrication

Tektronix, Inc., a worldwide provider of test and measurement solutions, today released the new Keithley S530 Series Parametric Test System with KTE 7 software and other enhancements.

Global Semiconductor Sales Increase 4.9 Percent Year-to-Year in August

The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors were $36.2 billion in August 2020, 4.9 percent more than the August 2019 total of $34.5 billionand 3.6 percent higher than the July 2020 total of $35.0 billion.

Five Trends That Will Shape the Future Semiconductor Technology Landscape

Is Moore’s Law still alive, and which applications will benefit from ultra-scaled technologies? How will data centers cope with the overwhelming amount of data? And will we be able to break the memory wall in traditional Von Neumann computing architectures?

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