Alchip Technologies to became the first dedicated ASIC company to announce 5nm commercial design readiness and that is accepting 5nm design. First test-chip tape-outs are expected in December.
Packaging
Samsung Announces Availability of its Silicon-Proven 3D IC Technology for High-Performance Applications
Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced the immediate availability of its silicon-proven 3D IC packaging technology, eXtended-Cube (X-Cube), for today’s most advanced process nodes.
QuickLogic Joins CHIPS Alliance to Expand Open Source FPGA Efforts
QuickLogic Corporation (NASDAQ: QUIK), a developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, and Endpoint AI solutions, announced that it has joined the CHIPS Alliance, the leading consortium advancing common and open hardware for interfaces, processors and systems.
Electronic Components Join Forces to Take Up 10 Times Less Space on Computer Chips
A new study demonstrates the successful integration of the individual elements that make up electronic filters onto a single component, significantly reducing the amount of space taken up by the device.
Lion Semi Switched-Cap Power ICs in More than 50 Million Smartphones
Lion Semiconductor, a leading provider of switched-capacitor power ICs with world’s highest efficiencies, today announced its switched-capacitor power ICs are used in more than 50 million smartphones. This milestone comes 2 years after the company started production shipment.
SVXR Appoints Semiconductor Packaging Industry Veteran Scott Jewler as President and CEO
SVXR, Inc., a pioneer in inspection and metrology technology, announced today that Scott Jewler has been appointed President and Chief Executive Officer effective August 8th, 2020. Jewler previously held the position of Chief Operating Officer and is a co-founder of SVXR.
SiFive Secures $61 Million in Series E Funding
SiFive, Inc., the leading provider of commercial RISC-V processor IP and silicon solutions, today announced it raised $61 million in a Series E round led by SK hynix, joined by new investor Prosperity7 Ventures, with additional funding from existing investors, Sutter Hill Ventures, Western Digital Capital, Qualcomm Ventures LLC, Intel Capital, Osage University Partners, and Spark Capital.
SEMI Partners with GLOBALFOUNDRIES to Offer Apprentice Program Aimed at Building the Electronics Talent Pipeline
SEMI, the industry association serving the global electronics design and manufacturing supply chain, today launched a new collaborative apprenticeship program to make it easier for companies to offer training and for more workers to pursue careers in electronics.
Intel’s Stumble in Leading-Edge Chips Race Gives Rivals an Opportunity to Catch Up, says GlobalData
Intel has fallen behind in its ability to make commercially ready, leading-edge chips in sufficient volumes, opening the door to its main rivals, AMD and Nvidia, says GlobalData, a leading data and analytics company.
Renesas’ Intersil Brand ICs Blast Off Onboard the Mars 2020 Perseverance Rover Mission to the Red Planet
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced that more than 20 of its radiation-hardened (rad-hard) integrated circuits (ICs) were onboard the July 30 lift off of NASA’s Mars 2020 Perseverance rover.
