Packaging

Mitsubishi Electric Develops Accurate Circuit Simulation Technology for SiC-MOSFETs

Mitsubishi Electric Corporation (TOKYO:6503) announced today that it has developed a highly accurate Simulation Program with Integrated Circuit Emphasis (SPICE) model to analyze the electronic circuitry of discrete power semiconductors.

Imec and GLOBALFOUNDRIES Announce Breakthrough in AI Chip, Bringing Deep Neural Network Calculations to IoT Edge Devices

Imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, and GLOBALFOUNDRIES (GF), the world’s leading specialty foundry, today announced a hardware demonstration of a new artificial intelligence chip.

SST Vacuum Reflow Systems Offers Trade-In on DAP Series Furnaces

Palomar Technologies, a global leader in total process solutions for advanced photonics and microelectronic device packaging today, announced that SST Vacuum Reflow Systems, a wholly-owned subsidiary of Palomar Technologies, is offering a 25% discount off the retail price of the SST 3130 programmable vacuum reflow oven with the trade-in of an SST DAP series furnace.

Virtual SEMICON West 2020 to Gather Industry Leaders, Visionaries to Highlight Opportunities for Stronger Preparedness for Global Challenges

Better readiness for future global shocks through technology innovation will come into sharp focus at the Virtual SEMICON West 2020, July 20-23, as more than 150 semiconductor industry visionaries and government leaders gather for keynotes, fireside chats and executive panels on opportunities for improving responses to worldwide challenges.

130 years of Pfeiffer Vacuum

Pfeiffer Vacuum has been setting standards in vacuum technology for 130 years. Science and industry have benefited equally from the numerous innovations developed and successfully brought to the market by this long-established company.

Asahi/America ISO Certificate Renewed

Asahi/America, Inc., the leader in thermoplastic fluid flow solutions, is pleased to announce the reissuance of its ISO 9001:2015 certificate. The Massachusetts-based company has received continuous ISO certification since 1996.

Emerging Photovoltaics: Materials Opportunity in New $38 Billion Market, Reports IDTechEx

IDTechEx predicts $38 billion dollars in 2040 without colliding with the silicon-in-glass “power station” business.

SK hynix Starts Mass-Production of High-Speed DRAM, “HBM2E”

SK hynix Inc. announced that it has started the full-scale mass-production of high-speed DRAM, ‘HBM2E’, only ten months after the Company announced the development of the new product in August last year.

HighRadius Continues European Expansion with Opening of Frankfurt, Germany Office

HighRadius, a fintech enterprise Software-as-a-Service (SaaS) company specializing in automating the order-to-cash and treasury management processes, today announced further expansion in the EMEA region after posting triple-digit YoY growth.

Renesas Adds Leading Power Efficiency to Ultra-Low Power Embedded Controller RE Family

Renesas Electronics Corporation expanded its RE Family lineup of embedded controllers with a new ultra-low power consumption member based on Renesas’ breakthrough silicon-on-thin-buried-oxide ( SOTB) process technology and built around the Arm Cortex-M0+ core.

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