Packaging

Akoustis Awarded Phase 2 For DARPA COFFEE Program

Akoustis Technologies, Inc. was awarded a new multi-year, multi-million dollar contract for Phase 2 of the DARPA COmpact Front-end Filters at the ElEment-level (COFFEE) program.

GlobalFoundries Announces New Multi-Million Dollar Student Loan Repayment Program to Strengthen Semiconductor Workforce

Program designed to build a critical talent pipeline by easing the burden of education debt for U.S. employees.

Growing Supply Chain Risks for Germanium and Gallium

How can the US stabilize Ge/Ga supply to support high semiconductor demand?

Particle Measuring Systems Receives Silver EcoVadis Medal for Progress on Sustainability

Particle Measuring Systems (PMS), a developer of contamination monitoring solutions, announced that it has been awarded a Silver EcoVadis Medal for its progress toward sustainability.

New Semicon Adhesive Propels Autonomous Driving Forward

DELO has developed a flexible electronics adhesive that permanently seals sensor housings airtight and thus reliably protects components such as image sensors.

Busch Vacuum Solutions Acquires centrotherm clean solutions

Busch Vacuum Solutions, one of the largest vacuum pump manufacturers worldwide, has acquired centrotherm clean solutions, one of the technology leaders in industrial gas abatement systems.

Advanced IC Substrates: Taiwanese Companies Lead the Market

Increasing capacity expansion by substrate manufacturers to accommodate the growth of application processors in the AI age.

NextFlex Announces $6.5 Million in Funding for Flexible Hybrid Electronics Innovations in Extreme Environments and Sustainability

Projects include developments of additive approaches for complex multilayer 3D electronics, high and low temperature interconnects with proven reliability and in-mold electronics for automotive applications.

TECHCET Announces Call for Papers for 2024 CMC Conference

TECHCET announces an official call for papers for the 9th Annual Critical Materials Council (CMC) Conference taking place on April 10-11, 2024 in Chandler, Arizona.

XTPL Enters Manufacturing Lines of Modern Electronics with its Groundbreaking Ultra-Precise Dispensing Technology

This technology has just become available to the industrial market, offering unprecedented precision in mass production. 

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