Marposs Inc. announced the latest addition to its highly successful line of Industry 4.0 metrology solutions, the STIL MICROMEASURE 2 3D Measuring System.
OMNIVISION today debuted its OX08D10 8-megapixel (MP) CMOS image sensor with TheiaCel technology at AutoSens Brussels.
Plasma-Therm, a manufacturer of plasma-process equipment for the semiconductor and compound semiconductor markets, today announced that it has acquired Thin Film Equipment SrL (TFE), effective September 18, 2023.
Brooks Instrument has released a new series of Quantim QMC Coriolis mass flow controllers (MFCs) designed to provide high accuracy for very low flows of liquids and gasses.
Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules needed for future data centers and AI products.
Keysight Technologies, Inc. introduces a new compact, four-channel vector signal generator (VSG) capable of signal generation up to 8.5 GHz with 960 MHz of modulation bandwidth per channel.
The new facility, which broke ground in 2021, will bolster GF’s global manufacturing footprint across Singapore, the U.S., and Europe to provide customers with capacity to enhance supply chain flexibility and business resilience.
Bumping technologies for advanced semiconductor packaging have evolved significantly to address the challenges posed by shrinking contact pitches and the limitations associated with conventional flip-chip soldering.
Nutanix today announced that Micron Technology, an industry leader in innovative memory and storage solutions, selected Nutanix to build a cloud platform for Micron’s manufacturing facilities globally.
Archer Materials’ commercial foundry partner in the Netherlands has validated its advanced biochip gFET design by manufacturing the chips using whole four-inch wafer semiconductor fabrication processes.