E&R (E&R Engineering Corp.), a Taiwan-based semiconductor equipment manufacturer with 30 years of expertise, has supplied over 500 advanced semiconductor packaging tools to major OSATs worldwide, specializing in laser and plasma solutions.
Packaging
ROHM’s New General-Purpose Chip Resistors Contribute to Greater Miniaturization
ROHM Semiconductor today announced an expanded portfolio of general-purpose chip resistors with the MCRx family, designed to achieve greater miniaturization and enhanced performance across a variety of applications.
New Industrial CoolSiC MOSFETs 650 V G2 in Q-DPAK and TOLL Packages Offer Improved Power Density
The electronics industry is experiencing a significant shift towards more compact and powerful systems. To support this trend and further drive innovation at the system level, Infineon Technologies AG is expanding its portfolio of discrete CoolSiC MOSFETs 650 V with two new product families housed in Q-DPAK and TOLL packages.
FPT Launches New Office in Pangyo, Silicon Valley of South Korea
Global IT corporation FPT’s Korean subsidiary has officially opened its fourth office in South Korea. This expansion marks a crucial step in strengthening the company’s presence in one of South Korea’s leading technology hubs and enhancing its capacity to serve a growing portfolio of clients.
Strategic Materials Conference 2025 to Highlight the New Era of Materials Innovation
With advanced materials as a critical enabler of semiconductor growth applications, the Strategic Materials Conference (SMC) 2025 will gather top executives and technology leaders from the semiconductor manufacturing industry for exclusive insights into the latest advancements in materials innovation.
Brewer Science Welcomes New Chief Business Officer
Ms. Khobadandeh brings decades of industry experience to Brewer Science.
Toward Sustainable Computing: Energy-Efficient Memory Innovation
SOT-MRAM memory technology could replace cache memory in computer architecture in the future.
LQDX and Arizona State University Sign Semiconductor Packaging Collaboration Agreement
Collaboration focuses on advanced IC-substrates and next generation wafer-level packaging.
SEMI North America Advisory Board Welcomes New Member From Energetiq
SEMI today announced the election of a new member to the SEMI North America Advisory Board (NAAB), Dr. Vikram Singh, Vice President and General Manager, LDLS at Energetiq Technology, a Hamamatsu subsidiary and leader in advanced light source solutions for critical applications.
The High Tech Used to Upskill a High-Tech Workforce
The semiconductor industry is just one example of many industries that stand to benefit from implementing simulation, virtual twin technology into training practices – but it is currently of the most need for change.
