Efinix today announced a line of FPGA solutions designed specifically for the automotive industry to drive forward the long-term design and development of the rapidly growing numbers of electronic applications in-and-outside vehicles.
Packaging
Trane/Mitsubishi SMART MULTI Line Expands with Three-Phase System Ideal for Light Commercial Applications
Trane – by Trane Technologies has introduced new innovations to provide outdoor heat pump technology to multi-zoned buildings, optimize indoor environments, and empower customers to start their transition to next-generation refrigerants.
New Structure Transistors for Advanced Technology Node CMOS ICs
In a paper published in National Science Review, a Chinese team of scientists from Institute of Microelectronics of Chinese Academy of Sciences (IMECAS) reviewed structural innovations in Si-based transistors from planar transistors and fin field-effect transistor (FinFET) to latest gate-all-around FET (GAAFET), and even cutting-edge vertical transistor stacking, e.g. in complementary FETs (CFETs), 3D stack (3DS)-FETs and vertical-channel transistors.
SEMI: 300mm Fab Equipment Spending Forecast to Reach Record $137 Billion in 2027
Global 300mm fab equipment spending for front-end facilities is forecast to reach a record US$137 billion in 2027 after topping US$100 billion for the first time by 2025.
Synopsys Announces Acquisition of Intrinsic ID
Synopsys, Inc. today announced that it has completed the acquisition of Intrinsic ID.
Three Strong Brands Form the Global Busch Group
Busch Vacuum Solutions, Pfeiffer Vacuum and centrotherm clean solutions have become one under the new Busch Group.
STMicroelectronics Breaks the 20nm Barrier for Cost-Competitive Next-Gen Microcontrollers
STMicroelectronics announces an advanced process based on 18nm Fully Depleted Silicon On Insulator (FD-SOI) technology with embedded phase change memory (ePCM) to support next-generation embedded processing devices.
ASU and Deca Technologies to Launch R&D Center for Advanced Fan-Out Wafer-Level Packaging
Advanced packaging advances next wave of innovation in global chips manufacturing.
TSMC and Synopsys Bring Breakthrough NVIDIA Computational Lithography Platform to Production
NVIDIA today announced that TSMC and Synopsys are going into production with NVIDIA’s computational lithography platform to accelerate manufacturing and push the limits of physics for the next generation of advanced semiconductor chips.
Devan Iyer, Industry Leader on Chips Packaging Technology, Joins IPC
Devan Iyer, Ph.D., one of the semiconductor industry’s leading technology experts, has joined IPC, the global association for electronics manufacturing, as its chief strategist for advanced packaging.
