Diodes Incorporated has introduced the DIODES ZXMS81045SPQ, its first protected, automotive-compliant, high-side IntelliFET.
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Adeia and Qorvo Enter into Hybrid Bonding License Agreement
Adeia Inc., the company whose patented innovations enhance billions of devices, today announced that Qorvo, a global provider of connectivity and power solutions, has licensed Adeia’s hybrid bonding technology.
SIA Urges Full Funding of CHIPS & Science Act Research Programs in President’s FY24 Budget
Semiconductor Industry Association (SIA) President and CEO John Neuffer today sent a letter to Office of Management and Budget Director Shalanda Young, encouraging her to include in the President’s Budget Request for Fiscal Year 2024 (FY24) full funding for research and workforce programs authorized by the CHIPS and Science Act of 2022.
Alliance Memory Expands Lineup of CMOS DDR4 SDRAMs With New 16Gb Device
Alliance Memory today announced that it has expanded its portfolio of CMOS DDR4 SDRAMs with a new 16Gb device in the 96-ball FBGA package.
Ouster and Velodyne Complete Merger
The combined company will keep the name Ouster and continue to trade on New York Stock Exchange under the ticker “OUST.”
Beyond Lithium: A Promising Cathode Material for Magnesium Rechargeable Batteries
Scientists discover the optimal composition for a magnesium secondary battery cathode to achieve better cyclability and high battery capacity.
3D TSV Packages Market Size & Share to Surpass $14.9 Billion by 2028
The Global 3D TSV Packages Market is valued at $6.1 billion in 2021 and is projected to reach $14.9 billion by 2028 at a CAGR (Compound Annual Growth Rate) of 16.1% over the forecast period 2022-2028.
IDTechEx Explores Nine Startups Innovating Polymer Additive Manufacturing
Essential to understanding the evolution of the polymer 3D printing industry is exploring the change from low-cost printing technologies and materials to the slow growth and adoption of innovative polymer printing technologies and materials, from viscous thermosets to carbon fiber composites to foams.
GlobalFoundries and GM Announce Long-Term Direct Supply Agreement for U.S. Production of Semiconductor Chips
General Motors Co. and GlobalFoundries today announced a strategic, long-term agreement establishing a dedicated capacity corridor exclusively for GM’s chip supply.
