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MACOM Announces Stephen G. Daly as President and Chief Executive Officer

MACOM Technology Solutions Holdings, Inc. (“MACOM”) (NASDAQ: MTSI), a supplier of semiconductor solutions, today announced the appointment of Stephen G. Daly as President and Chief Executive Officer, effective immediately. Mr. Daly succeeds John Croteau, who resigned on May 15, 2019. Mr. Croteau had served as President and Chief Executive Officer since December 2012. Mr. Croteau will be available to MACOM in an advisory capacity for the next two months to ensure…

Toshiba Memory and Western Digital to Jointly Invest in Flash Manufacturing Facility in Kitakami, Japan

Toshiba Memory Corporation and Western Digital Corp. have finalized a formal agreement to jointly invest in the “K1” manufacturing facility that Toshiba Memory is currently constructing in Kitakami, Iwate Prefecture, Japan.

CEA-Leti and Silvaco Team Up on Yield-Prediction Project For Ultra-Low-Power Static Memories

Leti, a research institute of CEA-Tech, and Silvaco Inc., a global provider of software, IP…

Global Semiconductor Alliance Launches Initiative to Bolster Women’s Leadership

The Global Semiconductor Alliance (GSA) today unveiled its Women’s Leadership Initiative (WLI), seeking to significantly increase…

CyberOptics to Launch New AVLS3 with CyberSpectrum Software and New NanoResolution MRS Sensor at SEMICON West

CyberOptics® Corporation (NASDAQ: CYBE), a global developer and manufacturer of high-precision 3D sensing technology solutions,…

Call For SEMICON WEST 2019 “Best Of West” Award Applications

SEMI is accepting SEMICON West 2019 exhibitor applications for the Best of West award recognizing innovative new products or services…

Mentor Certified for Latest TSMC 5nm FinFET Process and TSMC-SoIC 3D Chip Stacking Tech

Mentor, a Siemens business, announced that several tools in its Calibre™ nmPlatform and Analog FastSPICE…

Semiconductor Leaders Strike Agreement on Global Policy Agenda

The Semiconductor Industry Association welcomed a policy agreement reached by global semiconductor industry leaders at the 23rd annual meeting of the World Semiconductor Council this week in Xiamen, China.

IEEE International Electron Devices Meeting Announces 2019 Call for Papers

The 65th annual IEEE International Electron Devices Meeting(IEDM), to be held at the Hilton San Francisco Union…

Edwards Responds to United Nations’ New Greenhouse Gas Guidelines

The Intergovernmental Panel on Climate Change (IPCC), the United Nations’ body for assessing the science…

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