GlobalFoundries today announced the appointment of Pradheepa Raman as Chief People Officer. The appointment is effective September 12, 2022.
Packaging
Sputtering Targets Driven by Robust Semiconductor Demand
Metal supply chains to face increased demand given broader chip applications.
SEMICON China 2022 to Highlight Sustainability, Smart Manufacturing and Advanced Packaging
With sustainability, smart manufacturing and advanced packaging key to the semiconductor industry’s profitable growth, SEMICON China 2022 will gather industry leaders and visionaries October 5-7 at the Shanghai New International Expo Centre for the latest insights on these and other critical topics for the electronics supply chain.
Henkel Opens Application Engineering Center for Electronics Applications in South China
Henkel announced the opening of its South China Application Engineering Center (SCAEC) in Dongguan, Guangdong Province.
Palomar Technologies Places Palomar 9000 Wedge Bonder with Bay Photonics for Advanced Photonics Applications
Palomar Technologies, a global leader in delivering total process solutions for advanced photonics and microelectronic device packaging, announced today that Bay Photonics, an advanced photonics assembly, and packaging company has taken delivery of a Palomar 9000 Wedge Bonder as a requirement for meeting the demands for wedge-to-wedge bonding by their customers.
JCET Performance Hits Another Record High in 1H 2022
Today, JCET Group, a global provider of integrated circuit (IC) manufacturing and technology services, announced its financial results for the first half year of 2022.
North American Helium Successfully Brings Third Helium Facility into Production
Non-hydrocarbon sourced helium production from new facility contracted on long-term agreement with Air Liquide.
Scientists Unravel ‘Hall Effect’ Mystery in Search for Next Generation Memory Storage Devices
An advance in the use of antiferromagnetic materials in memory storage devices has been made by an international team of physicists.
Aehr Receives Production Orders for WaferPak Full Wafer Contactors
These WaferPak Contactors are expected to ship by the end of Aehr’s fiscal third quarter ending February 28, 2023.
Meister Abrasives to Participate for the First Time at the 19th International Conference on Silicon Carbide and Related Materials
Superabrasives leader Meister Abrasives announces its participation in the International Conference on Silicon Carbide and Related Materials (ICSCRM) in September 2022.
