Semiconductors

eBeam Initiative Survey Reports Continued Optimism for Photomask Market Growth

The eBeam Initiative, a forum dedicated to the education and promotion of new semiconductor manufacturing approaches based on electron beam (eBeam) technologies, today announced the completion of its 10th annual eBeam Initiative Luminaries survey.

SiPearl Opens Design Center in Grenoble, France

SiPearl, the designer of the microprocessor that will power Europe’s exascale supercomputers, has opened a design center in Grenoble, the cradle of the semiconductor ecosystem in Europe. SiPearl, currently recruiting 10 engineers per month, is targeting 1,000 employees in 2025. To attain this goal, SiPearl is creating design centers in semiconductor and HPC skills pools.

Full Color LEDs Cut Down to Size

Micrometer-scale light-emitting diodes are the ideal building block for next-generation microLED displays used in head-mounted monitors, mobile phones and televisions because they are bright, respond quickly, offer longevity and consume little energy. KAUST researchers have shown that these scaled-down devices can efficiently emit light across the entire visible-light spectrum.

Voyager 1035: A Unique Combination of Deep Learning, Speed and Sensitivity

KLA’s new Voyager 1035 laser scanning patterned wafer inspector helps guide chip manufacturing by monitoring critical process steps during ramp and volume production.

Elements in Liquid Metals Compete to Win the Surface

For the first time, researchers at UNSW Sydney proposed that the phenomenon related to the surface competition between elements can be used as an approach for harvesting mixed metaloxide sheets that can be used in electronics.

New Technique Speeds Measurement of Ultrafast Pulses

University of Rochester researchers have developed a time-domain single-pixel imaging technique to speed the measurement of ultrafast pulses in infrared and far infrared wavelengths

ACM Research Ships Its First 300mm, High-Temp Single-Wafer SPM Tool for Advanced Logic, DRAM and 3D-NAND Semiconductor Manufacturing

ACM Research, Inc. today announced it has shipped its first 300mm single-wafer Sulfuric Peroxide Mixture systems for wet clean and etch processes in advanced logic, DRAM and 3D-NAND integrated circuit manufacturing.

Truphone Enables Mass IoT Deployments With iSim Collaboration

Truphone announces that in collaboration with Sony Semiconductor Israel and Kigen, Truphone has successfully enabled its IoT platform and global connectivity to run on the integrated SIM of Sony’s Altair cellular IoT chipsets, powered by Kigen iSIM OS.

Panel-Level Heterogeneous Integration Technology for Analog ICs

Micro-transfer printing, a massively parallel pick-and-place process, may be used to produce HI analog ICs comprised of large arrays of ultra-thin separately manufactured components interconnected using redistribution layer technology.

Featured Products