Jim Hogan and Edward McCluskey Named Honorees of ESD Alliance and IEEE CEDA Phil Kaufman Hall of Fame

Jim Hogan, executive, angel investor and board member, and Stanford University Professor Edward J. McCluskey today became the first posthumous honorees of a new honor acknowledging their significant and noteworthy contributions to the electronic system design industry.

Wafer Supply Constrained Through 2024 Likely

Will there be new greenfield projects to help with tightened capacity?

NVIDIA Announces Instant AI Infrastructure for Enterprises

NVIDIA today unveiled NVIDIA AI LaunchPad, a comprehensive program delivered through hybrid-cloud providers that gives enterprises immediate access to NVIDIA-powered infrastructure and software to streamline the entire AI lifecycle.

SiPearl Opens Site in Barcelona

SiPearl, the company that is designing the high-performance, low power microprocessor for the European exascale supercomputer, is opening its Barcelona office as the second operational subsidiary outside of France.

Kioxia’s AI Project Wins 2020 Field Innovation Award Silver Prize From Japanese Society for Artificial Intelligence

Kioxia Corporation announced today that it was awarded the 2020 Field Innovation Award Silver Prize by the Japanese Society for Artificial Intelligence (JSAI) for its TEZUKA 2020 project.

5 Key Vulnerabilities in the Semiconductor Supply Chain

There’s an ongoing push to strengthen the semiconductor supply chain, but making gains in that area is not as straightforward as some people initially believed. Here are five of the top vulnerabilities for the semiconductor sector to solve.

Park Systems Appoints Dr. Stefan Kaemmer as President, Park Systems Americas

“Park Systems is experiencing unprecedented expansion, and during the coming years we expect to add significantly to the revenue growth that put us at the One Trillion Mark at Kosdaq in 2021”, comments Dr. Sang-il Park, CEO & Founder of Park Systems.

Synopsys to Acquire Semiconductor and Flat Panel Display Solutions from BISTel

Synopsys, Inc. today announced that it has signed a definitive agreement to acquire the semiconductor and flat panel display solutions from BISTel, a developer of engineering equipment systems and AI applications for semiconductor smart manufacturing, headquartered in South Korea.

Dialog Semiconductor Achieves Industry’s Highest Ranking for IoTMark-Wi-Fi Benchmark

Dialog Semiconductor plc today announced that its DA16200 SoC has scored 815 on the EEMBC IoTMark-Wi-Fi benchmark.

Microchip Boosts GaN RF Portfolio with Ka-band Monolithic MMIC with High Linearity for SatCom Terminals

The new device, Microchip’s first GaN MMIC, is designed for use in commercial and defense satellite communications, 5G networks and other aerospace and defense systems.

STMicroelectronics Powers Wireless-Charging Growth with Secure Solution for Consumer and Automotive Qi-certified Chargers

STMicroelectronics (NYSE: STM) is protecting wireless charging of small devices and mobiles with a convenient solution for authenticating certified Qi chargers.

EV Group Launches Step-And-Repeat Mastering Services for Nanoimprint Lithography

EV Group announced that it has established the EVG Step-and-Repeat (S&R) Mastering Shop, a new service offering to help customers accelerate the deployment of nanoimprint lithography (NIL) in high-volume manufacturing.

Paving the Way for Smart Factories

Intel, EXOR International, TIM and JMA Wireless teamed together to build an end-to-end smart factory in Verona, Italy, as an example of the benefits of Industry 4.0 digitalization to manufacturers of all sizes.

ROHM Introduces Industry-first AC/DC Converter ICs in a Surface Mount Package with Built-in 1700V SiC MOSFET

ROHM Semiconductor today introduced the industry’s first AC/DC converter ICs with a built-in 1700V SiC MOSFET (BM2SC12xFP2-LBZ) in the TO263-7L package.

Winbond Unveils New 1.8V 512Mb SPI NOR flash for 5G and Other High-End Server Applications

Winbond Electronics Corporation, a global supplier of semiconductor memory solutions, today announced it is expanding its total solution of SPI NOR Flash with the introduction of the new single die monolithic 1.8V 512Mb SPI NOR flash.

Breathing New Life into Existing Tech: FT-IR Spectrometer Shows Molecular Orientation

Osaka Prefecture University observes the molecular orientation of thin-film materials with Fourier transform infrared spectroscopy (FT-IR) using an originally designed, 3D printed attenuated total reflectance (ATR) unit.

SIA Applauds Senate Introduction of FABS Act

The Semiconductor Industry Association (SIA) today applauded the introduction in Congress of the Facilitating American-Built Semiconductors (FABS) Act, bipartisan legislation that would establish an investment tax credit to incentivize greater semiconductor manufacturing in the United States.

Inducing and Tuning Spin Interactions in Layered Material

Magnetic-spin interactions that allow spin-manipulation by electrical control allow potential applications in energy-efficient spintronic devices.

Innovative Foundry Technologies Resolves Infringement Dispute with SMIC and Initiates New Patent Litigation

Innovative Foundry Technologies LLC (IFT) has resolved its patent dispute with Semiconductor Manufacturing International Corporation (SMIC).

AI System-on-Chip Runs on Solar Power

AI is used in an array of extremely useful applications, such as predicting a machine’s lifetime through its vibrations, monitoring the cardiac activity of patients and incorporating facial recognition capabilities into video surveillance systems.

New Manufacturing Technique for Flexible Electronics

Researchers at Stanford University have invented a manufacturing technique that yields flexible, atomically thin transistors less than 100 nanometers in length – several times smaller than previously possible.

Advantest Developing Innovative Methodologies for High-Speed Scan and Software-Based Functional Testing

Semiconductor test equipment supplier Advantest Corporation is pilot testing a next-generation solution for performing both high-speed scan testing and software-driven functional device testing on the V93000 platform by leveraging the existing high-speed serial I/O interfaces on advanced integrated circuits (ICs).

IC Insights Raises Its 2021 Worldwide IC Market Forecast to +24%

Global IC market expected to exceed $500 billion for the first time.

Delphon Helps Transform Ideas into New Products

Delphon is the materials incubator and advanced manufacturing center known for solving complex product development and manufacturing challenges by supporting innovation at its Gel-Pak, UltraTape and TouchMark divisions. Learn more about how we can help transform your ideas into new products.

Featured Products



202101junAll Day04julECTC 2021 - Virtual(All Day) VIRTUAL CONFERENCE


202101junAll Day04julECTC 2021 - Virtual(All Day) VIRTUAL CONFERENCE

202101julAll DayInternational SPM Symposium — FAMT 2021 - VirtualFailure Analysis and Material Testing(All Day: thursday) VIRTUAL CONFERENCE


202104augAll Day05FeaturedAdvancements in Thermal Management - Virtual(All Day) VIRTUAL CONFERENCE

202109augAll Day12SiP — Advanced System in Package Technology - Virtual(All Day) VIRTUAL CONFERENCE

202123augAll Day27FeaturedSEMICON Southeast Asia 2021 - Hybrid(All Day) TBD