Gel-Pak, a Delphon company and a worldwide leader in cutting-edge materials and protective carriers for photonic devices, today announced it will demonstrate its latest material breakthroughs for the photonics market at Photonics West. The products exemplify the company’s 40-year track record of collaborative development and innovation in photonics component handling solutions.
Working in collaboration with key industry leaders, Gel-Pak designed novel elastomer materials and form factors to streamline process steps in the manufacturing of photonic components. These advances allow for faster throughput and significantly reduced risk of breakage of high-value devices.
- The Gel-Pak TXF film carrier uses a unique micro texture to secure and protect fragile photonic devices using non-adhesive holding forces. The product offers a clean method of holding optical components by only touching 2% of a device’s surface, which significantly reduces residue.
- The company’s latest VMF carrier is currently in development with a large optics supplier. It minimizes contact to the active area of an optic’s surface. Because contact is limited to the non-critical sections of the optical device, costly cleaning steps can be avoided.
“Photonics industry standards are more advanced and stringent than ever before, which is driving the need for cleaner and more protective handling and transport,” said Joe Montano, Delphon CEO. “The industry is quickly converging on zero tolerance for residue and contamination that interfere with device performance. Our collaborative approach to product development allows us to stay one step ahead of emerging market demands and drives continuous product innovation to ensure your photonic devices remain free from damage during handling and transport.”
Technology evolution
Gel-Pak is known for unique solutions that enable handling, transport and processing of small, valuable devices without risk of damage. It has a long history of collaboration with the world’s leading photonic device manufacturers to create customized solutions for handling and processing their sensitive components.
The company first served the photonics market with its original Gel-Box products for handling optics and laser diodes. It next expanded into proprietary vacuum release technology for use in high-volume assembly of photonic devices, and then into the development of customized films for kitting and securing components during processing or for use as a substrate. The company’s strong track record and materials expertise drove its recent collaborations with photonics device suppliers on the development of these new products.
Experience how we can protect your valuable devices at Photonics West
To learn more, please visit Gel-Pak at Booth #1651 at Photonics West, taking place January 28 to February 2 in San Francisco, Calif.
