SmartDV Technologies, a supplier of Design and Verification Intellectual Property (IP), and NSITEXE, developer of advanced processors, today signed a multi-year agreement that enables SmartDV to license NSITEXE’s recently announced RISC-V-based, 32-bit CPU core to its customers.
Following the introduction of the America COMPETES Act of 2022 from the House of Representatives, companion legislation to the U.S. Innovation and Competition Act (USICA), which passed the Senate last June, the Information Technology and Innovation Foundation (ITIF), the leading think tank for science and technology policy, released the following statement.
CEVA, Inc. announced today that it has expanded its IP market reach by introducing the Fortrix SecureD2D IP solution.
Wooptix SL will be presenting a new technique for Patterned Wafer Geometry at the upcoming SPIE Advanced Lithography conference on February 28th, 2022, in a paper published together with Applied Materials.
After record-breaking billings of North America-based semiconductor equipment manufacturers in November 2021, December billings remained robust and were the second-highest ever.
For the first time, researchers have created blue LEDs using layers of metal halide perovskite linked with asymmetrical bridges, solving a critical instability problem.
SPIE, the international society for optics and photonics, and the University of Rochester have announced the establishment of the SPIE Graduate Fellowship in Optical Sciences and Engineering.
Veeco Instruments Inc. today announced that a world leading semiconductor supplier has qualified Veeco’s WaferStorm Wet Processing System for advanced packaging applications that will support next generation high bandwidth memory (HBM).
SEMI announced today the return of the Industry Strategy Symposium Europe (ISS Europe) 2022 as an in-person event to Brussels, Belgium, May 30, with insights from leading analysts, economists, policymakers and technologists on major forces impacting the semiconductor industry.
Kandou, a developer in high-speed, energy-efficient chip-to-chip link solutions to improve the way the world connects and communicates, officially opened its Silicon Glen office in East Kilbride, Scotland, today.
Weebit Nano Limited, a developer of next-generation memory technologies for the global semiconductor industry, announced that together with its development partner CEA-Leti, it has demonstrated its first operational crossbar arrays, a key milestone on the Company’s path to creating discrete (stand-alone) non-volatile memory (NVM) chips.
EVG is the first semiconductor equipment supplier ever to receive Preferred Supplier status.
This country’s semiconductor chip shortage is likely to continue well into 2022, and a Georgia Tech expert predicts that the U.S. will need to make major changes to the manufacturing and supply chain of these all-important chips in the coming year to stave off further effects.
A research team led by the University of Washington has developed new optical computing hardware for AI and machine learning that is faster and much more energy efficient than conventional electronics.
First three-year period of double-digit gains in 25 years, based on IC Insights’ forecast.
Trio-Tech International today announced that it has resumed full operations at the Company’s Tianjin, China, facility.
In its continuing efforts to discover and develop innovative technologies for the packaging industry, Amcor announced today its strategic investment in PragmatIC Semiconductor.
Intel will invest more than $20 billion to build two new factories and to establish a new epicenter for advanced chipmaking in the Midwest.
Their solar cells made using perovskite and organic materials achieve a power conversion efficiency of 23.6%, approaching that of conventional silicon solar cells.
DuPont Interconnect Solutions, a business within the Electronics & Industrial segment, today announced it has completed the expansion project at its Circleville, Ohio manufacturing site.
Samco, a manufacturer of etching, deposition and surface treatment processing equipment for the semiconductor and related industries and academic facilities, is proud to introduce the new plasma etching cluster tool “Cluster H.”
Intevac, Inc., a supplier of thin-film processing systems, today announced the appointment of Nigel Hunton as president and chief executive officer (CEO), and member of the board of directors, effective January 19th.
A semiconducting material that performed a quantum “flip” from a conductor to an insulator above room temperature has been developed at the University of Michigan.
CyberOptics — Live from SEMICON West 2021
CyberOptics’ new WX3000 Metrology and Inspection system, which Incorporates the company’s NanoResolution Multi-Reflection Suppression™ (MRS™) sensor, enables the combination of high speed, high resolution and high accuracy for wafer-level and advanced packaging. At SEMICON West, Subodh Kulkarni, President and CEO, explains how it works and what’s new in the company’s other product lines.
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