Amcor Announces Strategic Investment in PragmatIC Semiconductor

In its continuing efforts to discover and develop innovative technologies for the packaging industry, Amcor announced today its strategic investment in PragmatIC Semiconductor.

Intel Announces Next US Site with Landmark Investment in Ohio

Intel will invest more than $20 billion to build two new factories and to establish a new epicenter for advanced chipmaking in the Midwest.

NUS Research Team Sets New Efficiency Record for Solar Cell Technology

Their solar cells made using perovskite and organic materials achieve a power conversion efficiency of 23.6%, approaching that of conventional silicon solar cells.

DuPont Completes New Production Line in Circleville, Ohio

DuPont Interconnect Solutions, a business within the Electronics & Industrial segment, today announced it has completed the expansion project at its Circleville, Ohio manufacturing site.

Samco Unveils New Plasma Etching Cluster Tool for Compound Semiconductor Device Fabrication

Samco, a manufacturer of etching, deposition and surface treatment processing equipment for the semiconductor and related industries and academic facilities, is proud to introduce the new plasma etching cluster tool “Cluster H.”

Intevac Appoints Nigel Hunton as Chief Executive Officer

Intevac, Inc., a supplier of thin-film processing systems, today announced the appointment of Nigel Hunton as president and chief executive officer (CEO), and member of the board of directors, effective January 19th.

Quantum Tech: Semiconductor ‘Flipped’ to Insulator Above Room Temp

A semiconducting material that performed a quantum “flip” from a conductor to an insulator above room temperature has been developed at the University of Michigan.

Secure-IC Raises €20M to Accelerate the Development of Its Cybersecurity Solutions for Connected Objects

After 10 years of sustained and controlled growth on equity, Secure-IC, a provider of end-to-end cybersecurity solutions for embedded systems and connected objects announced today a first capital raising of 20 million euros.

Kandou Secures 2022 Supply Chain Capacity for USB4 Retimer Chips

Kandou today announced it has secured foundry capacity and backend IC packaging and testing services to meet all 2022 customer requirements for its Matterhorn USB-C multiprotocol retimer with USB4 support

AMD, Intel Display Chiplet Packaging Prowess

Last November AMD held their AMD Accelerated Data Center Premiere, Intel had their Innovation Days, and Stephen Shankland of CNET visited Intel’s fabs 42 and CH-4 in Chandler.

Quantum Computing in Silicon Hits 99% Accuracy

UNSW Sydney-led research paves the way for large silicon-based quantum processors for real-world manufacturing and application.

Semiconductor Spin Qubits Gain Further Credibility as Leading Platform for Quantum Computing

Researchers at QuTech—a collaboration between the Delft University of Technology and TNO—have taken an important step for semiconductor spin qubits by surpassing the 99% barrier for two-qubit gate fidelity.

SPIE: TriLite Demos World’s Smallest Projection Display Powered by Infineon’s 2D MEMS Mirror

TriLite announced it will present its Trixel 3, the world’s smallest Laser Beam Scanner at SPIE Photonics West from January 23-25 in San Francisco, California, USA.

U.S. Is Keystone of the World’s Science and Engineering Ecosystem

In ecological science, a keystone species is essential to the entire ecosystem. Weaken or remove a keystone and it impacts everything else. The National Science Board’s The State of U.S. Science and Engineering 2022 published today, shows that for the world’s science and engineering (S&E) ecosystem, the U.S. is such a keystone.

Advanced Energy’s 2022 Scholarship Program Strives to Promote Diversity in STEM

Advanced Energy today announced the launch of this year’s Advanced Energy STEM Diversity Scholarship Program.

Kurita Accelerates Overseas Promotion of Functional Materials for High Purity Ultrapure Water Production

Kurita Water Industries Ltd. announced that the KR-FM resin, a functional material for high purity ultrapure water production designed for yield improvement and stable operation of cutting-edge semiconductor manufacturing, has recently been adopted in North America.

EnSilica and Omni Design Collaborating on Multiple SoCs

Omni Design Technologies, a provider of high-performance, low-power mixed-signal Intellectual Property (IP) solutions, and EnSilica, a provider of custom ASIC design and supply solutions, today announced that they have entered into a partnership agreement.

Groundbreaking Research Produces Record Levels of Strain in Single-Crystal Silicon

University of Surrey researchers have developed a single-step procedure to put single-crystal silicon under more strain than has been achieved before. The discovery, which has a patent pending, could be crucial to the future development of silicon photonics, which underpins the technologies behind the internet-of-things, and is currently constrained by the lack of cheap, efficient, and easily integrated optical emitters.

BrainChip Achieves Full Commercialization of its AKD1000 AIoT Chip with Availability of Mini PCIe Boards in High Volume

BrainChip Holdings Ltd, a provider of ultra-low power high performance artificial intelligence technology and the world’s first commercial producer of neuromorphic AI chips and IP, today announced that it has begun taking orders for the first commercially available Mini PCIe board leveraging its Akida advanced neural networking processor, rounding out its suite of AKD1000 offerings.

SEMICON Korea 2022 Hybrid To Highlight Talent, Sustainability, Smart Manufacturing and Chip Industry Growth Drivers

With the global semiconductor supply chain rapidly evolving to meet the increasing demands of digital transformation, the stage is set for SEMICON Korea 2022 Hybrid as 500 semiconductor companies from around the world gather February 9-11 at COEX in Seoul for the latest industry developments, trends and innovations.

2022 Semiconductor Materials Outlook: COVID-19 Pandemic Still Having Lasting Effects on All Materials

The COVID-19 pandemic has created strong demand for both logic and memory ICs to support continued Work from Home and School from Home, and as such demand is expected to increase despite expanding availability of virus vaccines.

Mycronic Receives Order for an SLX Mask Writer

Mycronic AB (publ) has received an order for an SLX mask writer from an existing customer in Asia. The order value is in the range of USD 4-6 million.

Chroma Acquisition of ESS for Further Expansion into Semiconductor Testing Market

Chroma ATE Inc. acquired 100 percent of the shares of Environmental Stress Systems, Inc. (ESS).

CyberOptics — Live from SEMICON West 2021

CyberOptics’ new WX3000 Metrology and Inspection system, which Incorporates the company’s NanoResolution Multi-Reflection Suppression™ (MRS™) sensor, enables the combination of high speed, high resolution and high accuracy for wafer-level and advanced packaging. At SEMICON West, Subodh Kulkarni, President and CEO, explains how it works and what’s new in the company’s other product lines.

Featured Products



202219janAll Day21FeaturedImproving Supplier Quality with a Modern Effective Approach (“Managing by Measurement”) - Virtual(All Day) Virtual Training


202209febAll Day11FeaturedSEMICON Korea - Hybrid Event(All Day) Coex

202227febAll Day03marFeaturedSPIE Advanced Lithography + Patterning(All Day) San Jose McEnery Convention Center

202228febAll Day03marDVCon U.S. 2022 - Virtual(All Day) VIRTUAL CONFERENCE


202227febAll Day03marFeaturedSPIE Advanced Lithography + Patterning(All Day) San Jose McEnery Convention Center

202228febAll Day03marDVCon U.S. 2022 - Virtual(All Day) VIRTUAL CONFERENCE

202206marAll Day10OFC 2022Optical Fiber Communication Conference & Exhibition(All Day) San Diego Convention Center

202207marAll Day1018th International Conference & Exhibition on Device Packaging(All Day) We-Ko-Pa Resort and Conference Center