Senator Chuck Schumer’s office announced a collaboration between IBM and Intel for a major new investment in the domestic semiconductor industry, which is expected to add hundreds of new jobs at IBM’s Albany Research Center and its research and industry partners in the area. The senator revealed that as Intel expands its domestic manufacturing operations, they will conduct new semiconductor research in advanced semiconductor technology working with IBM’s Albany Semiconductor Research Facility.
IBM also is planning to apply for funding from the U.S. Department of Commerce National Semiconductor Technology Center (NSTC) program authorized in last year’s NDAA. The NSTC is meant to be a hub for industry, academia and the broader research community, and government to come together to serve as a hub for conducting advanced semiconductor research and prototyping that strengthens the domestic semiconductor ecosystem. The new partnership with Intel further positions IBM to compete for the NSTC.
Dario Gil, Senior Vice President and Director of IBM Research, said in an announcement: “This collaboration aims to accelerate semiconductor manufacturing innovation across the ecosystem, enhance the competitiveness of the U.S. semiconductor industry and support key U.S. government initiatives.
“IBM brings to this partnership decades of ‘hard tech’ semiconductor innovations that have shaped the industry, from the invention of one-transistor DRAM, to chemically amplified resists, to copper interconnects, to silicon germanium chips, to debuting the world’s first 7 nanometer and 5 nanometer node test chips, to IBM’s continued innovation in the industry’s first advanced “nanosheet” device structure and electronics packaging technologies.
“We are delighted that Intel, the world’s largest semiconductor manufacturer, will be partnering with IBM and leveraging this unique chip innovation ecosystem to facilitate even greater R&D collaboration and catalyze critical new innovations in semiconductor technology. This collaboration puts two of the best semiconductor research organizations together to accelerate the velocity of packaging and process innovations into the future.”
No further details were provided.
