Intel Launches AI for Workforce Program for Students in 18 Community Colleges

Intel announced a major expansion of its Intel AI for Workforce Program to help educate the next generation of U.S. technologists, engineers and inventors.

Fabrication of Printed High-Performance Thin-Film Transistors Operable at One Volt

NIMS has developed low-temperature-catalyzed, solution-processed SiO2 (LCSS), which subsequently enabled printing of high-performance thin-film transistors (TFTs) and three-dimensional circuits connecting various elements.

IITC: New Materials for Advanced Interconnects

On-chip interconnects have not been scaling at the same speed as transistors. When TSMC went from 20nm to 16/14nm, for example, they decided to replace the bulk MOSFET with a FinFET, but they left the interconnect stack as is. In part, interconnect scaling has been slow because companies don’t want to make too many major changes at the same time and introduce risk. Costs, of course, are also an issue.…

Extreme Stress for Existing Foundry/Fabless Model

Dr. Roawen Chen, senior vice president of global operations at Qualcomm, will provide the keynote talk at The ConFab 2014 this year. The event will be held June 22-25 at The Encore at The Wynn in Las Vegas. In his talk, Dr. Chen, will describe how the increased performance and the rapid shift from traditional handsets to consumer computing device post a number of manufacturing and supply chain challenges for…

At The ConFab 2014: The Outlook for the Semiconductor Industry

The semiconductor market will continue at a steady growth rate for the next several years. For a semiconductor company to achieve significant growth in this ultra-competitive environment, it needs to identify market opportunities and predict the future, in terms of markets, both regionally and globally, anticipate technological advancements, as well as envision new applications. At The ConFab in June, Session 1 will provide an overview of these critical issues. The…

The ConFab R&D Panel is Set

A panel session at The ConFab, to be held June 22-25 in Las Vegas, will focus on how the semiconductor industry can continue to innovate in an environment where lower revenue growth is combined with rising development costs and consolidation.  The panel will discuss where the next big growth drivers will come from and the ability of the industry to continue scaling and remain on Moore’s Law through the introduction…

MEMS – Enter with Care

By Karen Lightman, MEMS Industry Group MEMS – enter with care. I think that will be my tagline for MEMS Industry Group’s third annual MEMS Executive Congress Europe 2014 recently held in Munich, Germany. The official theme of the conference was the “MEMS-Enabled Life,” and the keynotes and panelists did talk about how MEMS is currently and will continue to improve our quality of life. However, what struck me the…

Webcast on 3D Integration/Advanced Packaging, Lithography

If you’ve been following the field of 3D integration for any time at all, then you’re familiar with Sitaram Arkalgud. In addition to being a great guy, he led the charge on 3D integration at SEMATECH in the early days. He’s now at Invensas and I’m very much looking forward to hearing from him again, this Thursday at 1:00 Eastern. You can hear from him too, by tuning into our…

Qualcomm’s Dr. Roawen Chen to keynote at The ConFab

I’m delighted to report that Dr. Roawen Chen, Senior Vice Present of global operations at Qualcomm, has accepted our invitation to deliver the keynote talk at The ConFab, on Monday June 23rd. As previously announced, Dr. Gary Patton, Vice President of IBM’s Semiconductor Research and Development Center in East Fishkill, New York, will deliver the keynote on the second day, on Tuesday June 24th. I’m thrilled to have these two…

Dr. Gary Patton to provide keynote at The ConFab

I’m very pleased to announce that IBM’s Dr. Gary Patton will provide the keynote talk at The ConFab on Tuesday, June 24th. Gary is Vice President of IBM’s Semiconductor Research and Development Center in East Fishkill, New York. He has responsibility for IBM’s semiconductor R&D roadmap, operations, and technology development alliances, with primary locations in East Fishkill, New York, Burlington, Vermont, and the Albany Nanotech Research Center in Albany, New…

Mission accomplished. Now what?

In the late ‘80s and ‘90s, when our magazine staff gathered for dinner we often made a toast: “Here’s to chip silicon!” I really believed (and still do) that making electronics more affordable would increase their use and make our lives better and the world a better place to be. I haven’t toasted to cheap silicon for a while. Why? Because that mission has been accomplished. At SEMI’s ISS, Paul…

Take the NCMS survey, but first figure out your nano position

I recommend taking the new survey out by the National Center for Manufacturing Sciences (NCMS) – www.usnanosurvey.org — but you may first want to give some thought as to what is and what isn’t “nanotechnology.” That’s been something of a puzzle for the semiconductor and related industries over the last 10+ years. Some put semiconductor manufacturing, where matter is regularly manipulated on an atomic scale, squarely in the nanotechnology camp.…

No technical barriers seen for 450mm

Paul Farrar, general manager of the G450C consortium, said early work has demonstrated good results and that he sees no real barriers to implementing 450mm wafers from a technical standpoint. Speaking at the SEMI ISS meeting in January, Farrar showed impressive results from, etch, CVD, PVD, CMP, furnaces, electroplating, wet cleans and lithography processes and said the inspection/metrology tools were in place to measure results. “I don’t believe we will…

50 years ago: February 1964

In February of 1964, The Beatles landed for the first time at JFK in New Work and appeared on the Ed Sullivan show on February 9th. Their song “I want to hold your hand” – their 1st #1 hit – was still #1 after 7 weeks.  France & Great-Britain signed an accord over building the channel tunnel (construction for the “chunnel” began in 1988; it opened in 1992). The GI…

Exploring the MEMS-Enabled Life: A Preview of MEMS Executive Congress Europe 2014

By Karen Lightman, executive director, MEMS Industry Group Munich, Germany is one of my favorite cities in the world. If you agree or if you’ve never been there, I have the perfect opportunity for you to join me:  MEMS Industry Group’s (MIG’s) MEMS Executive Congress Europe 2014 will be held at the beautiful Sofitel Hotel Bayerpost on March 10-11. The theme of our third European Congress is the “MEMS-enabled life,”…

Intel’s e-DRAM Shows Up In The Wild

When Intel launched their Haswell series chips last June, they stated that the high-end systems would have embedded DRAM, as a separate chip in the package; and they gave a paper at the VLSI Technology Symposium [1] that month, and another at IEDM [2]. It took us a while to track down a couple of laptops with the requisite Haswell version, but we did and now we have a few…

Intel’s e-DRAM Shows Up In The Wild

When Intel launched their Haswell series chips last June, they stated that the high-end systems would have embedded DRAM, as a separate chip in the package; and they gave a paper at the VLSI Technology Symposium [1] that month, and another at IEDM [2]. It took us a while to track down a couple of laptops with the requisite Haswell version, but we did and now we have a few…

High cost per wafer, long design cycles may delay 20nm and beyond

Handel Jones, founder and CEO of International Business Strategies (IBS), spoke at SEMI’s Industry Strategy Symposium last week, focusing on key trends, factors impacting the growth of the industry and the migration to smaller feature dimensions. He is bullish about 2014 and industry innovation, but cautious about how quickly the industry will move to new technology nodes due to higher costs, and long design cycles. Overall, he said he believed…

The magic behind the gadget and the need for innovation

Rick Wallace, president and CEO of KLA-Tencor, provided the keynote talk at the SEMI Industry Strategy Symposium (ISS) this year, held Jan 12-15 in Half Moon Bay, CA. He said he believes the semiconductor industry might be facing a “Concorde” moment, referring to the demise of supersonic passenger transport, the last flight of which was on 24 October 2003. “That failed not because of technology but because of economics,” Wallace…

50 years ago: January 1964

The origin of Solid State Technology began in 1958, the same year that Jack Kilby of Texas Instruments invented the integrated circuit (the invention of the transistor is credited to Bell Labs; the first transistor was demonstrated on December 23, 1947). The initial name of the magazine was “Semiconductor Products” and that was changed to “Semiconductor Products and Solid State Technology” by 1962.   In this news series, we’ll look…

Is It Time for A Roadmap for Equipment and Materials?

Hopefully everyone is familiar with the International Technology Roadmap for Semiconductors (ITRS). It was launched in 1992, when the Semiconductor Industry Association (SIA) coordinated the first efforts of producing what was originally The National Technology Roadmap for Semiconductors (NTRS). This roadmap of requirements and possible solutions was generated three times in 1992, 1994, and 1997. The NTRS provided a 15-year outlook on the major trends of the semiconductor industry. As…

Challenges of 10nm and 7nm CMOS at IEDM

The International Electron Devices Meeting (IEDM) was held in Washington, D.C. this week. I attended a short course on Sunday focused on the Challenges of 10nm and 7nm CMOS Technologies, organized by Aaron Thean of imec. The speakers were Frederic Boeuf of ST Microlelectronics, who gave a general overview of drivers and challenges; Zsolt Tokei of imec, who spoke on interconnect challenges; Andy Wei of GLOBALFOUNDRIES who talked about process…

MEMS: An Enabler of the Next Internet Revolution

Micro-electromechanical systems (MEMS) and sensor fusion will play a critical role in enabling a more intelligent and intuitive Internet of Things (IoT)—one that will revolutionize the consumer space forever. The MEMS and sensor technology is here today and now is the time to harness it for your products and position yourself for this exciting future. I encourage you to read on and learn about some great examples of MEMS enabling…

Pressure-based Mass Flow Controllers for Semiconductor Processing

Dr. Mohamed Saleem, Chief Technology Officer of Brooks Instrument, talks with Editor-in-Chief Pete Singer about how mass flow controllers (MFCs) are used in the semiconductor industry, and key differences between older thermal-based MFCs and newer pressure-based MFCs.

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