North American Semiconductor Equipment Industry Posts September 2021 Billings

North America-based semiconductor equipment manufacturers posted $3.72 billion in billings worldwide in September 2021 (three-month moving average basis), according to the September Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI.

Deloitte-GSA Study: Transformation in Semiconductor Industry Driven by More Than Pandemic and Supply Chain Challenges

In order to understand the cause of semiconductor company transformation, Deloitte, in collaboration with the Global Semiconductor Alliance (GSA), conducted a survey in spring of 2021 of more than 40 top semiconductor industry executives.

Photoelectric measure of atomically thin stacks

A team led by researchers at the University of Warwick have discovered a breakthrough in how to measure the electronic structures of stacked 2D semiconductors using the photoelectric (PE) effect. Materials scientists around the world have been investigating various heterostructures to create different 2D materials, and stacking different combinations of 2D materials creates new materials with new properties. The new PE method measures the electronic properties of each layer in…

The New Driver for Semiconductor Tech

Over the past 40 years, the electronics industry has gone through three distinct stage or “waves” of evolution. Last year, in a Solid State Technology webcast presentation, Intel’s Islam Salama described the waves and how the latest wave is driving the semiconductor industry in new and very different ways. Dr. Salama is responsible for packaging substrate pathfinding of high density interconnects across all Intel products. His team focuses on packaging…

XMC becomes YRST or Changjiang Storage

As reported by Digitimes, a major enterprise in Wuhan, China has broken ground on the first of three mega-fabs to produce 3D-NAND chips. The final fab name-plate may ultimately read XMC or YMTC or YRST or possibly Changjiang Storage (not to be confused with GuangDong ChangJiang Storage Battery), but it is over half owned by the Chinese government’s Tsinghua Unigroup. Total investment in XMC/YRST by Tsinghua Unigroup is reported by…

China to be 15% of World Fab Capacity by 2018

Currently there are eight Chinese 300mm-diameter silicon IC fabs in operation as 2016 comes to a close. Chinese IC fab capacity now accounts for approximately 7% of worldwide 300mm capacity, as reported by VLSIresearch in a recent edition of its Critical Subsystems report (https://www.vlsiresearch.com/public/csubs/). This will expand rapidly, as ten are now under construction and two more have been announced. China’s 300mm fabs are located in ten cities. “Total Chinese…

Reliable ICs from unreliable devices

In an article published in the most recent issue of imec’s online magazine (http://magazine.imec.be/) titled “Chips must learn how to feel pain and how to cure themselves,” researchers Francky Chatthoor and Guido Groeseneken discuss how to build reliable “5nm-node” ICs out of inherently unreliable transistors. Variability in “zero time” and “over time” performance of individual transistors cannot be controlled below the “7nm-node” using traditional guard-banding in IC design. “Maybe it…

CSP Market Forecast – Strong

Chip-Scale Packages (CSP) continue to be in strong demand for IC needing the smallest form-factors for applications including automotive, industrial applications to mobile phones and wearable electronics, according to leading market research firm TechSearch International. TechSearch’s latest CSP market forecast shows a 8% CAGR from 2015 to 2020, despite a slowing growth rate for smartphones. One of the categories with the strongest growth is the quad flat no-lead (QFN) package…

Sentimental Feelings – Looking Back and Forward to MEMS & Sensors Executive Congress

By Karen Lightman, Executive Director, MEMS & Sensors Industry Group I’m feeling sentimental as I prepare with the MEMS & Sensors Industry Group (MSIG) team for our annual MEMS & Sensors Executive Congress. Maybe it’s because this will be the last Executive Congress before MSIG becomes a strategic association partner of SEMI (here’s the announcement in case you missed it). I remember the first time we hosted the Congress in…

Dan Rose departs material realm

With sadness I post that Daniel J. Rose, Ph.D.—founder of Rose Associates—passed away on September 20, 2016, due to complications of Alzheimer’s disease. Dan Rose received a Ph.D. in materials engineering from the University of British Columbia, and subsequently spent five years managing packaging manufacturing operations at Fairchild Semiconductor. He worked with and become friends with industry luminaries such as Intel’s founder Robert Noyce, and National Semiconductor’s founder Charlie Sporck.…

Process Watch: Salami slicing your yield

By David W. Price and Douglas G. Sutherland Author’s Note: The Process Watch series explores key concepts about process control—defect inspection and metrology—for the semiconductor industry. Following the previous installments, which examined the 10 fundamental truths of process control, this new series of articles highlights additional trends in process control, including successful implementation strategies and the benefits for IC manufacturing.  Introduction In a previous Process Watch article [1], we showed…

Fish-Scale Piezo Generators

Piezoelectric generators are based on thin-films of structured materials that can convert pressure into electricity. Inorganic crystals such as aluminum-nitride (AlN) barium titanate (BT) and lead-zirconium-titanate (PZT) have long been explored as piezoelectric films for various applications. Now researchers Sujoy Kumar Ghosh and Dipankar Mandal at the Jadavpur University in Kolkata, India have shown that fish scales (FSC) can be used to build a flexible bio-piezoelectric nanogenerator (BPNG) capable of…

Patterning with Films and Chemicals

Somewhere around 40nm is the limit on the smallest half-pitch feature that can be formed with a single-exposure of 193-nm wavelength laser light using water immersion (193i) lithography. While multiple-patterning (MP) is needed to achieve tighter half-pitches, smaller features at the same pitch can be formed using technology extensions of 193i. “Chemistry is key player in lithography process,” is the title of a short video presentation by Dow Electronic Materials…

ASM’s Haukka ALD Award

Dr. Suvi Haukka, executive scientist at ASM International, located in Finland, was awarded the ALD Innovation prize at the ALD 2016 Ireland conference (Figure), as chosen by the conference chairs. Haukka has had a lifetime career in Atomic Layer Deposition (ALD), starting at Microchemistry Ltd. with ALD pioneer Dr. Tuomo Suntola in 1990, and now holding over 100 patents. Since ASM bought Microchemistry in 1999, Haukka has worked on the…

The Last Technology Roadmap

After many delays, the last ever International Technology Roadmap for Semiconductors (ITRS) has been published. Now that there are just a few companies remaining in the world developing new fab technologies in each of the CMOS logic and memory spaces, each leading-edge company has a secret internal roadmap and little motivation to compare directions within fiercely competitive  commercial markets. Solid State Technology Chief Editor Pete Singer covered these developments in…

Etch Abatement Needed at 200mm Fabs to Meet WSC Goals for 2020

I’m delighted to turn the blog over again to Mike Czerniak, Environmental Solutions Business Development Manager at Edwards. A longtime champion of the environment, Mike, nominated by the UK Department of Energy and Climate Change (DECC), was just been accepted as the ‘expert witness’ on CF4 for the forthcoming Intergovernmental Panel on Climate Change (IPCC) working party on emissions of this extremely long-lived gas (50,000 years). Etch Abatement Needed at 200mm…

Broadening Scope of SEMICON

Once upon a time, SEMICONs were essentially just for semiconductor manufacturing business and technology, and predominantly CMOS ICs. Back when we followed public roadmaps for technology to maintain the cadence of new manufacturing nodes in support of Moore’s Law, it was sufficient to focus on faster transistors connected with tighter wires. Now in an era that is at least partially “More-than-Moore”—as we like to refer to heterogeneous integration of non-CMOS…

Dow Kills CIGS Solar Shingles

The mega-merger between Dow and DuPont has already shaken out an under-performing product line:  Powerhouse(TM) solar singles. As reported at PVTech, over 100 jobs in Milpitas, California and in Midland, Michigan will be lost along with the production line that assembles the copper-indium-gallium-sulfide (CIGS) cells into thin-film Building-Integrated PhotoVoltaic (BIPV) rooftop shingles. BIPV markets are very slow to grow due to inherent risk-aversion in considering new building materials, and it…

Eloquent Executives Ecosystem Expositions

#cmc,#confab,#namedropping With dimensional scaling reaching economic limits, each company in the IC fab industry must rely upon trusted connections with customers and suppliers to know which way to go, and the only way to gain trusted connections is through attending live events. Fortunately, whether you are an executive, and engineer, or an investor, there is at least one must-attend event happening these days to keep you informed. We should always…

Trefonas Earns 2016 Perkin Medal

The Society of Chemical Industry (SCI), America Group, announced on May 5, 2016 that Peter Trefonas, Ph.D., corporate fellow in Electronic Materials at Dow Chemical Co (NYSE:DOW), has won the 2016 SCI Perkin Medal. This honor recognizes Trefonas’ contributions in the development of chemicals that enable microlithography for the fabrication of microelectronic circuits. Trefonas will receive the medal at a dinner in his honor on Tuesday, September 13, 2016, at…

RFID Playing Cards “Best Product” at Printed Electronics Europe

Cartamundi, imec and Holst Centre (set up by imec and TNO) recently won the Best Product Award at Printed Electronics Europe for their ultra-thin plastic RFID technology integrated into Cartamundi’s playing cards. In each card, the RFID chip has a unique code that communicates wirelessly to an RFID reader, giving the cards in the game a unique digital identity. The jury recognized the potential of this technology to enhance printed…

Omhi kept us Ultra-Clean

Sadly, I just recently learned from the UCPSS 2016 website that Ohmi-sensei—Professor Doctor Tadahiro Ohmi—passed away in Sendai on 21 February 2016. As the guru of ultra-clean technology, he established the global Ultra Clean Society in 1988, founded the International Symposium of Semiconductor Manufacturing (ISSM) in 1992, served as program committee member of the UCPSS between 1992 and 2006, and was an IEEE Fellow. Ohmi was a Professor of New…

Process Watch: Yield management turns green

By David W. Price, Douglas G. Sutherland and Kara L. Sherman Author’s Note: The Process Watch series explores key concepts about process control—defect inspection and metrology—for the semiconductor industry. Following the previous installments, which explored the 10 fundamental truths of process control, this new series of articles highlights additional trends in process control, including successful implementation strategies and the benefits for IC manufacturing. For this article, we are pleased to…

Brooks Instrument Pressure-based Mass Flow Controllers - Theory of Operation

Meet the Brooks Instrument pressure-based mass flow controller (P-MFC) that can HANDLE the PRESSURE, the GP200 Series.

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