MAGAZINE
March
SEMI Applauds U.S. CHIPS Act Award for Samsung Electronics Facilities
The award includes $6.4 billion in grants and an investment tax credit to help fund two new leading-edge logic fabs, a research and development fab, and an advanced packaging facility in Taylor, Texas.
Aaron Woolf, Dylan Peterson Join SIA Team
Woolf will serve as director of global policy for economic security and Peterson will be a communications associate.
Power Semiconductor Innovator GaN Systems Announces $150 Million in Growth Capital Funding
GaN Systems today announced a US $150 million growth capital funding round to accelerate innovation and adoption of GaN technology across its automotive, consumer, industrial, and enterprise markets.
pSemi Files 1,000th Patent Application and Doubles Portfolio
pSemi Corporation, a Murata company focused on semiconductor integration, announces the growth of its patent portfolio to more than 1,000 issued and pending patents worldwide.
GlobalFoundries, Ford to Address Auto Chip Supply and Meet Growing Demand
Agreement aims to build and strengthen a collaborative model to accelerate the next wave of innovation in automotive chip design.
ZVEI Robustness Validation Process for Assessing Semiconductor IC Mission Profiles
The need to change reliability assessment methods of semiconductor ICs in extended power-on automotive applications
SINGULUS TECHNOLOGIES Receives Order from Leading Semiconductor Foundry for Novel Application
The semiconductor division of SINGULUS TECHNOLOGIES AG (SINGULUS TECHNOLOGIES) was awarded an order for a TIMARIS type cluster tool for vacuum deposition on 300mm wafers.
SONOTEC Develops and Globally Distributes Clamp-On Flow Meter for Highly Pure Semiconductor Applications
As the semiconductor industry is characterized by a number of liquid flow processes in which different abrasive, adherent, corrosive and ultra-pure liquids are applied, it is of utmost importance to keep these processes safe, stable, and of high quality. SEMIFLOW flow meters are specifically designed to meet the sector-specific demand of the semiconductor industry.
Oxford Instruments Plasma Technology Helps Drive Commercialization of 2D Devices with the European Graphene Flagship Funded Pilot Line
Oxford Instruments Plasma Technology, a supplier of plasma processing solutions for high volume manufacturing and research and development (R&D), announced its involvement in the European Graphene Flagship funded pilot line.
Annual Revenue Growth to Skyrocket Among Top 25
Big gains in artificial intelligence, machine learning, 5G infrastructure provide strong boost to sales growth at AMD, MediaTek, Nvidia, and Qualcomm this year; declines for Intel and Sony.
Ferdinand-Braun-Institut in Berlin Upgrades Two amc Machines with the amcoss ams PILOT Process Control Software
Ferdinand-Braun-Institut, Leibniz-Institut fuer Hoechstfrequenztechnik (FBH) in Berlin has already been using two wafer processing systems for some time now, which are now being upgraded with the newly developed, highly convenient amcoss ams PILOT process control software.
Ushio Unveils Thermal & Surface Processing, Lithography Developments at SEMICON
Ushio Europe will supply new “superior light solutions for semiconductor” as two co-habiting trade exhibitions, SEMICON Europa and Productronica, get underway at Messe Muenchen.
Common Vulnerability and Exposures (CVE) Program Adds Silicon Labs as CVE Numbering Authority (CNA)
Silicon Labs (NASDAQ: SLAB) today announced it has been added as a Common Vulnerability and Exposures (CVE) Numbering Authority (CNA) by the CVE Program, allowing Silicon Labs to proactively assign identifiers to common vulnerabilities and exposures in accordance with cybersecurity standards.
Watlow’s Facility in Winona, MN Selected as Business of the Year
Watlow, a designer and manufacturer of complete thermal systems, announced that its facility in Winona, MN was selected by the Winona Chamber of Commerce as ‘Business of the Year.’
Watlow New STREAMLINE Heating System with ATS Technologies Reduces the Complexity Associated with Legacy Systems on a Semiconductor Tool
Watlow, a designer and manufacturer of complete thermal systems, announced the launch of its new STREAMLINE Heating System featuring Adaptive Thermal Systems (ATS) technologies.
Lam Research Appoints Jyoti Mehra to Board of Directors
Lam Research Corporation today announced Jyoti Mehra has joined its board of directors, effective November 9th.
2021 Silicon Parts Demand Outstrips Supply as Market Grows >30%
TECHCET announced silicon parts demand is outpacing supply given pandemic-induced needs for increased safety stocks and high chip production.
Construction at Oxford Instruments Plasma Technology’s Advanced Manufacturing Facility
Oxford Instruments Plasma Technology, a provider of advanced wafer processing solutions for the semiconductor industry, has broken ground at the site of their new manufacturing facility in Bristol, UK.
Entegris Launches First Corporate Social Responsibility Report
Entegris, a supplier of advanced materials and process solutions for the semiconductor and other high-tech industries, issued its first annual Corporate Social Responsibility (CSR) report.
Picosun Invests in Future with its Innovation Lab
The Picosun Innovation Lab will be used for the company’s own research and development projects, for demo purposes and most importantly for serving the company’s global semiconductor customers operating in the 300mm market.
SUSS MicroOptics Wins the Swiss Manufacturing Award 2021
The University of St. Gallen in Switzerland recognizes SUSS MicroOptics with the “Swiss Manufacturing Award” for its outstanding contribution to Switzerland’s manufacturing ecosystem.
Obducat Launch the SINDRE Integra NIL Tool
OBDUCAT AB (publ) subsidiary Obducat Technologies AB, a supplier of lithography solutions based on NIL (nanoimprint lithography), now launches the new tool platform Sindre Integra.
Europe’s Urgent Need to Invest in a Leading Semiconductor Ecosystem
Today’s chip shortage has put a spotlight on the degree to which the European economy depends on semiconductors. With limited local production capability and capacity, Europe risks its technological sovereignty and needs to correct course to maintain long-term competitiveness.
Featured Video
Winnie Nabea, Global Product Manager at Mettler-Toledo Thornton, explains the importance of monitoring silica in ultra-high purity (UHP) water used in semiconductor manufacturing plants. Silica is one of the most critical indicators of the health of the water system. A rise in silica levels means the resin is approaching exhaustion and needs to be regenerated. If silica is not monitored, contamination of the ultrapure water can occur. She explains where silica should be monitored, outside factors that may cause silica issues, the best methods for monitoring silica, and how Mettler-Toledo is helping semiconductor manufacturers monitor the overall health of their water treatment plants.
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U.S. Aims for 20% of World’s Leading Edge Semiconductor Production by 2030
Secretary of Commerce Gina Raimondo believes investments in leading-edge logic chips manufacturing will put the U.S. on track to produce roughly 20 percent of the world’s leading-edge logic chips by the end of the decade.
Water Supply Challenges for the Semiconductor Industry
The energy-hungry nature and large carbon footprint of semiconductor manufacturing have received considerable attention in the context of reducing our emissions of planet-warming greenhouse gases. It turns out we are just as thirsty as we are hungry.
Professors from MIT, UCLA to be Honored for Excellence in Semiconductor Research
The Semiconductor Industry Association (SIA), in collaboration with the Semiconductor Research Corporation (SRC), today announced the winners of its 2019 University Research Awards.
What Do Small Companies Need to Know about the CHIPS Act?
IBM’s Poughkeepsie, N.Y. site was the backdrop for one of President Biden’s speeches promoting the passage of the $52B CHIPS (Creating Helpful Incentives to Produce Semiconductors) and Science Act, a rare piece of legislation for which the president won bipartisan support.
Intel 4 Process Drops Cobalt Interconnect, Goes with Tried and Tested Copper with Cobalt Liner/Cap
At the VLSI Symposia in June, Intel presented a paper “Intel 4 CMOS Technology Featuring Advanced FinFET Transistors Optimized for High Density and High-Performance Computing.” Blogger Dick James reports on details of the interconnect strategy.
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