MAGAZINE
March
Properties of New Materials for Microchips Can Now Be Measured Well
Reseachers of Delft University of Technology demonstrated measuring performance properties of ultrathin silicon membranes.
Silvaco Expands Partnership with Micron
Silvaco Group, Inc., a provider of TCAD, EDA software, and SIP solutions that enable semiconductor design and AI through software and innovation, today announced an enhanced partnership with Micron Technology, Inc.
RSBG Advanced Manufacturing Technologies GmbH Acquires Majority of Shares from Osiris International GmbH
RSBG Advanced Manufacturing Technologies GmbH (RSBG AMT), an investment company founded in 2019 and a wholly owned subsidiary of RSBG SE headquartered in Essen, Germany, holds 75.1% of Osiris International GmbH, headquartered in Singen, Germany, with retroactive effect from Jan. 1, 2021.
ERS Now Offers its Technology for Fan-out Debonding and Warpage Adjustment in a Fully-Automatic Machine for Panels up to 650 x 650 mm
ERS electronic, a developer of thermal management solutions for semiconductor manufacturing, is adding the Automatic Panel Debond Machine 650 (APDM650) to its portfolio of equipment for Advanced Packaging
YES Announces Strategic Partnership with Osiris for Edge Film Removal Technology
YES (Yield Engineering Systems, Inc.), a manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced that it has signed an exclusive agreement with Osiris (Osiris International GmbH) to license its smartEBR technology for edge bead removal on panels.
Fraunhofer ENAS Successfully Manufactures Ultra-Thin and Highly Flexible Parylene-Based Printed Circuit Boards with Several Metallization Layers
Scientists at the Fraunhofer Institute for Electronic Nano Systems ENAS in Chemnitz successfully developed and manufactured flexible printed circuit boards with an overall thickness of less than 20 micrometers and several metallization layers based on the polymer Parylene. The institute presents the new generation of flexible PCB this fall at the COMPAMED and the SEMICON Europa 2021.
Partnership Between SUSS MicroTec and SET to Develop a Combined Equipment Solution for 3D Chip Integration
SUSS MicroTec and SET announce a partnership in sequential die-to-wafer (D2W) hybrid bonding, a die-based interconnect technology, to provide a fully automated, customizable, highest-yield equipment to customers.
Renesas Expands Satellite Communications Portfolio with Industry’s First Commercial Dual-Beam Active Beamforming IC Lineup
Renesas Electronics Corporation (TSE:6723), a supplier of advanced semiconductor solutions, today expanded its portfolio of mmWave LNAs and Tx BFICs with the introduction of three new dual-beam active beamforming ICs.
Classiq Unveils Groundbreaking Capabilities for Its Quantum Algorithm Design Platform
Users can now integrate proprietary functionality with extensive pre-written functional models to create sophisticated and optimized quantum circuits that could not be designed otherwise.
Gwangju Institute of Science and Technology Makes Breakthrough on New Electronic Material
New research reveals the easy tunability of a perovskite material, opening doors to its widespread use in next generation electronics.
Smart Textiles: High Performance, Breathable Fabric to Power Small Electronics
Scientists have created a new triboelectric fabric that generates electricity from the movement of the body while remaining flexible and breathable.
EV Group Brings High-Speed High-Precision Metrology to 3D Heterogeneous Integration
EV Group today unveiled the EVG 40 NT2 automated metrology system, which provides overlay and critical dimension (CD) measurements for wafer-to-wafer (W2W), die-to-wafer (D2W) and die-to-die (D2D) bonding as well as maskless lithography applications.
SEMICON Europa 2021 Opens Tomorrow with Executive Forum, Smart Technologies and Digital Transformation in Spotlight
SEMICON Europa 2021, Europe’s premier gathering of the entire electronics design and manufacturing supply chain, opens tomorrow for the latest insights from visionaries and industry leaders on smart technologies, digital transformation, and how the microelectronics industry can enable a secure and sustainable digital future.
Powerful New Semiconductor Tool Introduced by Park Systems Combines Atomic Force Microscopy with White Light Interferometry
Park Systems, a manufacturer of Atomic Force Microscopes, presents Park NX-Hybrid WLI, the first fully integrated system that combines Atomic Force Microscopy (AFM) with White Light Interferometer (WLI) profilometry.
Classiq to Collaborate with The Fraunhofer Institute
Classiq, which provides a breakthrough Quantum Algorithm Design platform, announced today that it is collaborating with the Fraunhofer Institute, an applied research organization in Europe, as well as other major academic centers, on the development of software for industrial use of quantum computers.
Bridging Simulation and Reality
In their own pursuit of better displays, the Stanford Computational Imaging Lab has combined their expertise in optics and artificial intelligence.
Stanford Professors to be Honored for Excellence in Semiconductor Research
The Semiconductor Industry Association (SIA) and the Semiconductor Research Corporation (SRC) today announced two Stanford University professors are the 2021 recipients of SIA-SRC University Research Awards: Dr. Subhasish Mitra, Professor of Electrical Engineering and of Computer Science, and Dr. Boris Murmann, Professor of Electrical Engineering.
SkyWater President and CEO, Thomas Sonderman, to Serve as Panelist at Purdue Workshop for Microelectronics and Advanced Packaging Workforce Development
SkyWater Technology (NASDAQ: SKYT) announced that its President and CEO, Thomas Sonderman, is serving as a panelist today at Purdue University’s Microelectronics and Advanced Packaging Workforce Development Workshop in West Lafayette, Indiana.
Researchers Observe Marcus Inverted Region of Charge Transfer from Low-Dimensional Semiconductor Materials
A research group led by Prof. WU Kaifeng from the Dalian Institute of Chemical Physics (DICP) of the Chinese Academy of Science (CAS) observed the Marcus inverted region of charge transfer from low-dimensional semiconductor materials.
SEMICON West 2021 Hybrid to Highlight Solutions to Global Challenges, Smart Technologies, Talent
Optimal readiness and stronger alliances across the semiconductor supply chain to confront future global disruptions will come into sharp focus at SEMICON West 2021 Hybrid, December 7-9 at the Moscone Center in San Francisco.
Nye Lubricants Launches New PFOA-Compliant Grease for Semiconductor Manufacturing
Nye Lubricants announced NyeClean 5057, a REACH-compliant, low outgassing grease for use within components in cleanroom manufacturing and vacuum environments.
High Current Rated TOLL MOSFETs from Diodes Incorporated Target EV Applications
Diodes Incorporated has introduced a portfolio of automotive MOSFETs packaged in the space saving, thermally-efficient TOLL package.
Samsung Announces Availability of Its Leading-Edge 2.5D Integration ‘H-Cube’ Solution for High Performance Applications
Samsung Electronics today announced that it has developed Hybrid-Substrate Cube (H-Cube) technology, its latest 2.5D packaging solution specialized for semiconductors for HPC, AI, data center, and network products that require high-performance and large-area packaging technology.
Featured Video
Winnie Nabea, Global Product Manager at Mettler-Toledo Thornton, explains the importance of monitoring silica in ultra-high purity (UHP) water used in semiconductor manufacturing plants. Silica is one of the most critical indicators of the health of the water system. A rise in silica levels means the resin is approaching exhaustion and needs to be regenerated. If silica is not monitored, contamination of the ultrapure water can occur. She explains where silica should be monitored, outside factors that may cause silica issues, the best methods for monitoring silica, and how Mettler-Toledo is helping semiconductor manufacturers monitor the overall health of their water treatment plants.
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U.S. Aims for 20% of World’s Leading Edge Semiconductor Production by 2030
Secretary of Commerce Gina Raimondo believes investments in leading-edge logic chips manufacturing will put the U.S. on track to produce roughly 20 percent of the world’s leading-edge logic chips by the end of the decade.
Water Supply Challenges for the Semiconductor Industry
The energy-hungry nature and large carbon footprint of semiconductor manufacturing have received considerable attention in the context of reducing our emissions of planet-warming greenhouse gases. It turns out we are just as thirsty as we are hungry.
Professors from MIT, UCLA to be Honored for Excellence in Semiconductor Research
The Semiconductor Industry Association (SIA), in collaboration with the Semiconductor Research Corporation (SRC), today announced the winners of its 2019 University Research Awards.
What Do Small Companies Need to Know about the CHIPS Act?
IBM’s Poughkeepsie, N.Y. site was the backdrop for one of President Biden’s speeches promoting the passage of the $52B CHIPS (Creating Helpful Incentives to Produce Semiconductors) and Science Act, a rare piece of legislation for which the president won bipartisan support.
Intel 4 Process Drops Cobalt Interconnect, Goes with Tried and Tested Copper with Cobalt Liner/Cap
At the VLSI Symposia in June, Intel presented a paper “Intel 4 CMOS Technology Featuring Advanced FinFET Transistors Optimized for High Density and High-Performance Computing.” Blogger Dick James reports on details of the interconnect strategy.
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