What’s in the August/September Issue?

Each issue of Semiconductor Digest has articles found only in the magazine! Read the August/September issue…

GlobalFoundries and Qualcomm Sign Agreement to Deliver Advanced 5G RF Front-End Products

GlobalFoundries (GF) and Qualcomm Global Trading PTE. Ltd., a subsidiary of Qualcomm Technologies, Inc., announced that they are extending their successful RF collaboration on 5G multi-Gigabit speed RF front-end products for delivering the high cellular speeds, superior coverage, and outstanding power efficiency in the sleek form factors users expect from the newest generation of 5G-enabled products.

MSEC 2021 to Highlight Leading-Edge MEMS and Sensors Innovations as IoT Spending Surges

Returning to a live format, MEMS and Sensors Executive Conference (MSEC 2021) will gather industry visionaries and experts October 11-13 at the Coronado Island Marriott Resort in San Diego for insights into the latest trends and innovations in sensorization for growth markets including medical, fitness, connected communities, environmental and air quality, and wearables.

IEDM 2010 Retrospective – Part 1

The International Electron Devices Meeting started its 56th session last week on Sunday in San Francisco. This year the program appears to more academic than in previous years, and this was confirmed by the conference chair in his opening address – only 145 submissions out of a total of 555, an all-time low as a percentage. Attendance was guesstimated at ~1500, again lower than earlier years on the west coast.…

IEDM Next Week!

Next Sunday the great and the good of the electron device world will be gathering in San Francisco for the 2010 IEEE International Electron Devices Meeting. To quote the conference web front page, “IEDM has been the world’s main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices.” From my perspective at Chipworks, focused on chips that have made it to…

TI Ships 40-µm Fine Pitch Copper Pillar Flip Chip Packages

The week before Semicon West, Texas Instruments and Amkor released a joint announcement that they were shipping parts in fine pitch copper pillar packages. Mark Lapedus at EETimes picked the story up and added the detail that the latest OMAP processors were going out in this format. By coincidence, Chipworks had just finished analysing TI’s Sitara AM3715, a 45-nm applications processor with a 1-GHz ARM Cortex-A8 core and a POWERVR…

Non-Intel HKMG Coming Soon? And 45LP Makes the Mainstream in Mobiles

The last few weeks have seen some announcements that finally seem to show that HKMG (high-k, metal-gate) processes other than Intel are coming into the real world. First, on September 7, Samsung showed off an engineering sample of their 32-nm Saratoga chip at their Mobile Solutions forum. A week later on the 15th, Panasonic declared that in October they would be shipping 32-nm HKMG chips for use in Blu-ray disc…

Samsung’s Eight-Stack Flash Shows up in Apple’s iPhone 4

Back in 2005 Samsung made an announcement that they would be shipping eight die stacked in the same package. At the time it seemed remarkable, but we didn’t see it any time soon after that, so it got lost in the noise of other package developments and the increasing TSV (through-silicon vias) hype. Last year we commented, in the now defunct Semiconductor International, on a 16GB Sandisk Micro-SD flash card…

The Bankability of PV Tech: The New Key to Success

A decidedly non-technical term was in vogue this week at the very technical 25th European Photovoltaic Solar Energy Conference (EUPVSEC). The term “bankability” was often used to describe the likelihood of success of a given technology. In these days of scarce capital, the only projects that will be funded are those that banks and insurers have deemed to be fund-worthy (outside of China anyway). “Banks demand extensive performance and reliability…

3 Facts from EUPVSEC

The one and only driving factor in the photovoltaics industry is cost per Watt. This is primarily a function of efficiency – how much of the sun’s power is converted to electricity — and the cost of manufacturing and installation. The ultimate goal of course is to achieve grid parity, where the cost of producing power with PV is the same or better than that achieved by traditional means (coal,…

10 million solar roofs in U.S. bill passes

The Ten Million Solar Roofs Act of 2010 (S. 3460) was was passed by the Energy and Natural Resources Committee by a vote of 13 to 10 on July 21, 2010. It was introduced by Sen. Bernie Sanders, a member of the Senate energy and environment committees and chairman of the green jobs subcommittee. The bill sets a goal, to be met through this and other incentive and R&D programs,…

Winbond Adopts Qimonda’s Buried Wordline Technology – Metal Gates Come to DRAMs

Before Qimonda’s unfortunate demise last year, they delivered an impressive paper at IEDM 2008 [1] describing a “buried wordline” (BwL) DRAM stack-cell structure. This was a marked change from their earlier technology, as until this point all of their product had been based on planar wordline structure with trench-style storage capacitors sunk into the die substrate. Even when we compare BwL-stack with conventional stack DRAM structures, there’s a major shift,…

Where Have All the New Apps Gone?

Increasingly, we are hearing about consolidation in the semiconductor industry. Bill McClean of IC Insights has perhaps pointed this out most clearly, noting that the top 10 capacity leaders held about 60% of the total 2009 worldwide IC capacity, and the top 15% held a 71% share. Looking at only 300mm capacity, the consolidation is even more obvious: the top 10 leaders held an imposing 84% share with the top…

Moore’s Law: Will Lack of R&D Funding Kill It?

In the January issue of Solid State Technology, I wrote about life after the "reset" button and how the lack of R&D funding could well bring an end to Moore’s Law. That very issue was one of the key "take aways" from last week’s ISS. What I heard from a variety of speakers is this: A massive restructuring is underway that will leave only a handful of companies producing devices…

Acro Energy Prez Defines PV User Demands

Acro Energy Technologies Corp., a leading U.S. solar integrator, announced yesterday that it has signed a Stock Purchase Agreement with Energy Efficiency Solar, Inc., a California corporation headquartered in Pomona, Calif. ("EE Solar") and BillKorthof, the sole shareholder of EE Solar. EE Solar is a full-service solar energy company that has been installing residential and commercial solar systems in Los Angeles, Orange, and San Bernardino Counties since 1989. EE Solar…

A Reality Check with Intel

The 55th International Electron Devices Meeting (IEDM) will be held next month, from December 7-9, at the Hilton Baltimore. One of the highlights of the year for us tech editors is when we receive the set of abstracts from the conference organizers, provided in advance so we can write our previews and plan our week at the conference. The conference is well known as the place where all the major…

Getting Fired up About Solar at EUPVSEC

The EUPVSEC (European photovoltaic solar energy conference and exhibition) was well attended, with 4000 registrants from 73 countries. More than 39% were from Germany and only 11% from the U.S. 943 exhibitors represented 34 countries, 49% from Germany, 10% from China and 9% from the U.S. By my rough estimate, about 1/3 of the exhibitors were pv cell/module suppliers, predominantly crystalline silicon, the rest thin film solar. The other 2/3ds…

Welcome to ElectroIQ!

Here you will find easy access to five different PennWell brands that address Electronics and Electronics Manufacturing: Solid State Technology, Photovoltaics World, Small Times, Advanced Packaging and SMT. Each brand corresponds to one of our topic centers: semiconductors, photovoltaics, nanotech MEMS, and surface mount technology. Navigate through our topic and subtopic centers to find the latest news and tech features, or use the search function to access all of our…

The Lean Manager: A Novel

I just started reading a new book titled "The Lean Manager, A Novel of Lean Transformation," and I’m already hooked. The authors, Michael and Freddy Balle, have taken what some would consider a pretty dry topic — the Toyota Production System — and brought it to life through a character by the name of Jenkinson, a new CEO at a fictional manufacturing plant. A quick excerpt: "Jenkinson stopped in front…

Weathering the Storm Together

Gail Flower, Editor-in-Chief What were the most significant technological advancements in our industry in 2008? Every year Advanced Packaging pans the industry to get a wide-spectrum view of what to expect from the coming year. Without a doubt, these are economically challenging times by all perspectives in this Forecast. Yet, there are bright spots: 3D packaging with TSV interconnect, photovoltaic technology, laser dicing, flip chip, WLP, sockets families aimed at…

2008: Packaging Drives the Industry

What were the most significant technological advancements in our industry in 2007? Click here to enlarge image This year’s forecast points toward healthy, confident growth in packaging. Some of the most significant growth is in the area of 3D stacked die and system-in-package. It’s amazing how many industry leaders mentioned the adoption of and deployment of 3D packaging. These same experts used words like “shift, mobile device, driving force, and…

Clearing the Air

New filtration media, technologies, and airflow design strategies are helping users of critical environments improve filtration efficiency and control costs in the face of tightening air-quality tolerances. Click here to enlarge image By Bruce FlickingerThere was a time that, if critical environment operators wanted to ensure the air in the facility met or exceeded accepted standards of cleanliness, they simply increased filtration efficiency and pumped up the volume of air…

Rising energy costs dictate cleanroom design

Cleanroom owners industrywide look to shrink expenses while battling high utility bills and the lure of cheap foreign labor By Sarah Fister Gale With energy costs nearly double what they were a few years ago, along with a steady stream of cleanroom production business-particularly in the microelectronics industry-being shipped over seas, the trends in cleanroom design for 2006 are far from the exciting technological revolutions that they’ve been in previous…

Products of the Year

Each month, CleanRooms brings you innovative products of interest to you and your industry. As we reach the end of 2004, we've compiled this complete collection of the products we've featured over the past year. From apparel to wafer sorters, you'll find it here in “Products of the Year.” Quiet efficiency Click here to enlarge image A comprehensive line of AC and brushless DC (electronically commutated) fan filter units are…

Pressure-based Mass Flow Controllers for Semiconductor Processing

Dr. Mohamed Saleem, Chief Technology Officer of Brooks Instrument, talks with Editor-in-Chief Pete Singer about how mass flow controllers (MFCs) are used in the semiconductor industry, and key differences between older thermal-based MFCs and newer pressure-based MFCs.

Featured Products

EVENTS

september

202120sepAll Day01octFeatured43rd Annual EOS/ESD Symposium and Exhibits(All Day) The Westin La Paloma Resort and Spa

202127sepAll Day29FeaturedStrategic Materials Conference — SMC 2021(All Day) DoubleTree by Hilton San Jose

202127sepAll Day01octFeaturedSPIE Photomask Technology + EUV Lithography 2021 - Virtual(All Day) VIRTUAL CONFERENCE

202130sep9:00 am1:10 pmFeaturedGSEF 3rd Edition — 5G Technology Readiness and Commercialisation - Virtual9:00 am - 1:10 pm EDT VIRTUAL CONFERENCE

october

202120sepAll Day01octFeatured43rd Annual EOS/ESD Symposium and Exhibits(All Day) The Westin La Paloma Resort and Spa

202127sepAll Day01octFeaturedSPIE Photomask Technology + EUV Lithography 2021 - Virtual(All Day) VIRTUAL CONFERENCE

202111octAll Day13FeaturedMEMS & Sensors Executive Congress — MSEC 2021(All Day) Marriott Coronado Island Resort & Spa

202111octAll Day14Featured54th International Symposium on Microelectronics — IMAPS 2021(All Day) Town and Country Hotel & Conference Center

202131octAll Day03novFeaturedITPC 2021(All Day) Four Seasons Resort O'ahu at Ko Olina

november

202131octAll Day03novFeaturedITPC 2021(All Day) Four Seasons Resort O'ahu at Ko Olina

202116novAll Day19FeaturedSEMICON Europa 2021(All Day) Messe Munchen

202128novAll Day03decFeaturedMRS 2021 Fall Meeting & Exhibit(All Day) Hynes Convention Center

X