MAGAZINE
March
SK hynix Partners with TSMC
SK hynix Inc. announced today that it has recently signed a memorandum of understanding with TSMC for collaboration to produce next-generation HBM and enhance logic and HBM integration through advanced packaging technology.
Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
Omni Design Technologies, a provider of high-performance, low-power mixed-signal intellectual property (IP), today announced it has joined the Intel Foundry Accelerator IP Alliance.
High Current Rated TOLL MOSFETs from Diodes Incorporated Target EV Applications
Diodes Incorporated has introduced a portfolio of automotive MOSFETs packaged in the space saving, thermally-efficient TOLL package.
Samsung Announces Availability of Its Leading-Edge 2.5D Integration ‘H-Cube’ Solution for High Performance Applications
Samsung Electronics today announced that it has developed Hybrid-Substrate Cube (H-Cube) technology, its latest 2.5D packaging solution specialized for semiconductors for HPC, AI, data center, and network products that require high-performance and large-area packaging technology.
JSR Closes Deal to Acquire EUV Pioneer Inpria Corporation
JSR announced that it completed the acquisition of Corvallis, OR-based Inpria Corporation on Oct. 29, making it a wholly owned subsidiary of JSR.
The 2022 IEEE Symposium on VLSI Technology & Circuits Announces Call for Workshop Submissions
The 2022 IEEE Symposium on VLSI Technology & Circuits has announced a Call for Workshop topics in support of the conference theme: “Technology & Circuits for the Critical Infrastructure of the Future.”
After Strong Gains, DRAM Prices Expected To Retreat in 4Q21
DRAM buyers cautious about placing significant orders; opting instead to keep inventory in check.
Top European Research Center Selects Veeco’s Ion Beam Etch System for 5G RF Filter Production
Veeco Instruments Inc. announced today that Silicon Austria Labs (SAL) has selected Veeco’s Lancer Ion Beam Etch (IBE) System for the production of 5G RF Filters.
NXP and Ford Collaborate to Deliver Next-Generation Connected Car Experiences and Expanded Services
NXP Semiconductors today announced a collaboration with the Ford Motor Company to deliver enhanced driver experiences, convenience and services across its global fleet of vehicles, including the 2021 Ford F-150 pickup, Mustang Mach-E and Bronco SUVs.
TechSearch International’s Analysis Shows Surge in Fan-Out and Embedded Bridge for High Performance Packaging
With AMD’s announcement of its Elevated Fanout Bridge (EFB) GPU package, the embedded bridge for fan-out (FO) on substrate is in the spotlight.
Allegro MicroSystems Announces Changes to its Board of Directors
Allegro MicroSystems, Inc., a developer of sensing and power semiconductor technology, today announced the appointment of Susan Lynch to Allegro’s Board of Directors and its Audit Committee, replacing Christine King, who is leaving the board.
Gallium Semi Selects Nijmegen, Netherlands for European R&D Center
Gallium Semiconductor launches its European research and development (R&D) center in Nijmegen, Netherlands
NVIDIA Sets Path for Future of Edge AI and Autonomous Machines With New Jetson AGX Orin Robotics Computer
NVIDIA today introduced NVIDIA Jetson AGX Orin, the world’s smallest, most powerful and energy-efficient AI supercomputer for robotics, autonomous machines, medical devices and other forms of embedded computing at the edge.
New Senior Appointment at Smart Tech Company, amBX
amBX announced today that it has appointed Jonathan Couch as Product and Solutions Director, a brand-new role for the business.
Primo1D Raises 15M Euros for Industrial-Scale Deployment
Primo1D today announced a new funding round of 15 million euros from major French capital funds.
aveni, SA Secures Patent For Groundbreaking, One-Step 3D NAND Wet Deposition Process That Replaces ALD And CVD Technologies
aveni SA today announced that it has secured a patent that can extend the industry standard of layers from 100 to 200+ layers on a single wafer for 3D NAND memory devices.
Samsung Develops Industry’s First LPDDR5X DRAM
Samsung Electronics Co., Ltd. today announced that it has developed the industry’s first 14-nanometer (nm) based 16-gigabit (Gb) Low Power Double Data Rate 5X (LPDDR5X) DRAM, designed to drive further growth throughout the high-speed data service applications including 5G, artificial intelligence (AI) and the metaverse.
What’s in the November Issue?
Each issue of Semiconductor Digest has articles found only in the magazine! Read the November issue…
Posifa Technologies Introduces New MEMS Thermal Conductivity Hydrogen Sensors for Safety Monitoring
Posifa Technologies today introduced its new PGS1000 series of MEMS thermal conductivity hydrogen sensors.
Carlos Morales Joins Ambiq As Vice President of AI
Ambiq announces that Carlos Morales has joined the company as Vice President of Artificial Intelligence (AI).
Navitas Highlights Electrification Opportunities for Next-Gen Semiconductors at Baird Global Industrial Conference
Navitas Semiconductor, a developer of gallium nitride (GaN) power integrated circuits, has announced that it will take part in Baird’s 2021 Global Industrial Conference on November 11th.
KLA Announces Grand Opening of $200 Million Second Headquarters in Ann Arbor, Michigan
KLA Corporation today announced the official opening of its second U.S. headquarters, a $200 million facility in Ann Arbor, Michigan.
Pure Storage Partners with Microsoft Azure to Speed Semiconductor Design
Pure Storage today announced it has partnered with Microsoft Azure to significantly speed next-gen chip design by delivering a data layer that can keep up with massive, concurrent high-performance computing (HPC) workloads running in the cloud.
Featured Video
Winnie Nabea, Global Product Manager at Mettler-Toledo Thornton, explains the importance of monitoring silica in ultra-high purity (UHP) water used in semiconductor manufacturing plants. Silica is one of the most critical indicators of the health of the water system. A rise in silica levels means the resin is approaching exhaustion and needs to be regenerated. If silica is not monitored, contamination of the ultrapure water can occur. She explains where silica should be monitored, outside factors that may cause silica issues, the best methods for monitoring silica, and how Mettler-Toledo is helping semiconductor manufacturers monitor the overall health of their water treatment plants.
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U.S. Aims for 20% of World’s Leading Edge Semiconductor Production by 2030
Secretary of Commerce Gina Raimondo believes investments in leading-edge logic chips manufacturing will put the U.S. on track to produce roughly 20 percent of the world’s leading-edge logic chips by the end of the decade.
Water Supply Challenges for the Semiconductor Industry
The energy-hungry nature and large carbon footprint of semiconductor manufacturing have received considerable attention in the context of reducing our emissions of planet-warming greenhouse gases. It turns out we are just as thirsty as we are hungry.
Professors from MIT, UCLA to be Honored for Excellence in Semiconductor Research
The Semiconductor Industry Association (SIA), in collaboration with the Semiconductor Research Corporation (SRC), today announced the winners of its 2019 University Research Awards.
What Do Small Companies Need to Know about the CHIPS Act?
IBM’s Poughkeepsie, N.Y. site was the backdrop for one of President Biden’s speeches promoting the passage of the $52B CHIPS (Creating Helpful Incentives to Produce Semiconductors) and Science Act, a rare piece of legislation for which the president won bipartisan support.
Intel 4 Process Drops Cobalt Interconnect, Goes with Tried and Tested Copper with Cobalt Liner/Cap
At the VLSI Symposia in June, Intel presented a paper “Intel 4 CMOS Technology Featuring Advanced FinFET Transistors Optimized for High Density and High-Performance Computing.” Blogger Dick James reports on details of the interconnect strategy.
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