Deci Raises $21M to Enable the World to Benefit from the Full Potential of AI

Deci, the deep learning development company that helps enterprises build, optimize, and deploy AI to production, today announced it has raised a $21 million Series A round led by New York-based global private equity and venture capital firm  Insight Partners.

Phononic Announces Full Customer and Manufacturing Qualification in APAC

Phononic, a developer of solid-state cooling and heating technology, today announced full customer qualification of manufacturing operations at Fabrinet, a provider of advanced optical packaging and precision optical, electro-mechanical and electronic manufacturing services.

Economy Threatens Semi Growth, not Technology – so Say Fab Engineers at ASMC

It’s still spring in the north-eastern part of North America, and that means it’s the time of year for the Advanced Semiconductor Manufacturing Conference, in the amiable ambiance of Saratoga Springs, New York. The conference took place last month, on May 13 – 16. As the name says, ASMC is an annual conference focused on the manufacturing of semiconductor devices; in this it differs from other conferences, since the emphasis…

Economy Threatens Semi Growth, not Technology – so Say Fab Engineers at ASMC

It’s still spring in the north-eastern part of North America, and that means it’s the time of year for the Advanced Semiconductor Manufacturing Conference, in the amiable ambiance of Saratoga Springs, New York. The conference took place last month, on May 13 – 16. As the name says, ASMC is an annual conference focused on the manufacturing of semiconductor devices; in this it differs from other conferences, since the emphasis…

Economy Threatens Semi Growth, not Technology – so Say Fab Engineers at ASMC

It’s still spring in the north-eastern part of North America, and that means it’s the time of year for the Advanced Semiconductor Manufacturing Conference, in the amiable ambiance of Saratoga Springs, New York. The conference took place last month, on May 13 – 16. As the name says, ASMC is an annual conference focused on the manufacturing of semiconductor devices; in this it differs from other conferences, since the emphasis…

Tackling Design for Yield Questions at DAC

Process variations are unavoidable, but how can chip designers plan for them in their designs to obtain optimal yield and device performance? That’s one of the focal points of a pavilion panel at the upcoming Design Automation Conference (DAC), to be held June 2-6 in Austin, TX. Titled "Learn the Secrets of Design for Yield," it will be moderated by yours truly with panelists: Shaofeng Yu of Semiconductor Manufacturing International…

Who’s Driving the MEMS Evolution Revolution Now? (Part 3 of 3)

Who’s Driving the MEMS Evolution Revolution Now? (Part 3 of 3) It is my pleasure to present the conclusion of the guest blog trilogy on the MEMS Evolution Revolution, written by my colleague, and long-time MEMS industry insider, Howard Wisniowski.  So far in this series, Howard has taken us with him to "visit" member companies Qualtré and WiSpry, taught us about bulk acoustic wave (BAW) solid state MEMS gyroscopes, radio frequency…

Who’s Driving the MEMS Evolution Revolution? (Part 2 of 3)

I am pleased to bring you the second part of a three part series on the MEMS Evolution Revolution, written by my colleague, and long-time MEMS industry insider, Howard Wisniowski.  So far in this series, Howard has taken us with him to "visit" member company  Qualtré, and taught us about bulk acoustic wave (BAW) solid state MEMS gyroscopes.  In part 2, we will begin to learn about radio frequency (RF)…

Who’s Driving The MEMS Evolution Revolution – Part 1 of 3

I am pleased to bring you part one of a three part series on the MEMS Evolution Revolution, written by my colleague, and long-time MEMS industry insider, Howard Wisniowski.  Howard takes us with him to "visit" three exciting MEMS startups that are breaking new ground in the mobile/consumer market.  In part one, we learn about bulk acoustic wave (BAW) solid state MEMS gyroscopes and meet MIG member company Qualtré.  In…

Karen’s blog from MEMS Executive Congress: Part 2

I last left you hanging, waiting to hear more about the heated conversations between the panelists and the audience – and I have to tell you, it really started heating up in the audience during the energy panel. Oooh baby, it was jumping. MEMS in energy can mean a lot of things – and our panelists diverse perspectives discussed a great deal, but the majority of the audience wanted to focus…

Karen’s blog from MEMS Executive Congress: Part 1

There were many things that impressed me from hosting the second MEMS Executive Congress Europe – and it wasn’t the cold and snow (though it was chilly!). What struck me the most was how lively, engaged and intelligent the conversations were, not amongst the panelists but between the audience and the panelists. Often, Europeans can be conservative and reserved in conferences, but not this year In fact my favorite quote…

Join The ConFab discussion

The ConFab is Solid State Technology’s annual conference and networking event. This year, it will be held June 23-26 at The Encore at The Wynn in Las Vegas. We recently started a LinkedIn group, where we will inform members of new activities, and keep the discussion going on topics related to semiconductor manufacturing, design, packaging and testing. Everyone is welcome to join. The overall theme of this year’s conference is…

MEMS Executive Congress Europe 2013 – Amsterdam is THE place to be for the MEMS industry on 12 March!

By Karen Lightman, Managing Director, MEMS Industry Group The keynote address at last year’s MEMS Executive Congress Europe stated: "MEMS is only limited by the imagination." MEMS Industry Group (MIG) took that sentiment to heart, and organized a 2013 EU Congress chock full of interesting keynotes, panels, dialogue, and camaraderie. We invited some of the top European companies using and commercializing MEMS to share their insight and imagination on the…

Intel Foundries MEMS for Fuel Cell Start-up Nectar

In the last couple of years there have been announcements that Intel will be acting as a foundry for FPGA company Achronix, PLD maker Tabula and programmable network processor provider Netronome, as well as much speculation about making chips for Apple. All these reports refer to using Intel’s leading-edge 22-nm tri-gate process. However, at CES a couple of weeks ago, my eye was caught by a 200-mm wafer on display…

Intel Foundries MEMS for Fuel Cell Start-up Nectar

In the last couple of years there have been announcements that Intel will be acting as a foundry for FPGA company Achronix, PLD maker Tabula and programmable network processor provider Netronome, as well as much speculation about making chips for Apple. All these reports refer to using Intel’s leading-edge 22-nm tri-gate process. However, at CES a couple of weeks ago, my eye was caught by a 200-mm wafer on display…

Intel Foundries MEMS for Fuel Cell Start-up Nectar

In the last couple of years there have been announcements that Intel will be acting as a foundry for FPGA company Achronix, PLD maker Tabula and programmable network processor provider Netronome, as well as much speculation about making chips for Apple. All these reports refer to using Intel’s leading-edge 22-nm tri-gate process. However, at CES a couple of weeks ago, my eye was caught by a 200-mm wafer on display…

Questions and answers on FD-SOI

A month or so ago, we implemented (without much fanfare) the ability to comment and rank articles on this site, and more easily use social media tools. I’d like to call your attention to one interesting exchange, and also invite you to start posting comments of your own. In mid-December, we posted an article titled “STMicro: 28nm FD-SOI is ready for manufacturing” which elicited an interesting comment and response. The…

MEMS is happening in Vegas baby, and it’s coming home with you, too

By Karen Lightman, managing director, MEMS Industry Group Everyone knows the famous refrain, "What happens in Vegas, stays in Vegas." But for MEMS, you’ll want what happens in Vegas to come home with you. Why? Because MEMS at CES has gone waaaaay beyond sensing your touch and letting you play Angry Birds. MEMS Industry Group (MIG) is going back for a second year to International CES — because MEMS is…

IBM surprises with 22nm details at IEDM

Monday afternoon at the 2012 IEEE International Electron Devices Meeting, IBM discussed their 22nm SOI high-performance technology [1], aimed at servers and high-end SoC products. To an extent, this is an extension of the 32nm process, using epitaxial SiGe for the PMOS channels and stress, and dual-stress liners for both NMOS and PMOS strain. However, there were a couple of surprises buried in there — at least for me! The…

IBM surprises with 22nm details at IEDM

Monday afternoon at the 2012 IEEE International Electron Devices Meeting, IBM discussed their 22nm SOI high-performance technology [1], aimed at servers and high-end SoC products. To an extent, this is an extension of the 32nm process, using epitaxial SiGe for the PMOS channels and stress, and dual-stress liners for both NMOS and PMOS strain. However, there were a couple of surprises buried in there — at least for me! The…

Intel details 22nm trigate SoC process at IEDM

After launching their 22nm tri-gate high-performance logic product back in the spring, Intel have been promising to show off their SoC derivative, and yesterday was the day at the 2012 IEEE International Electron Devices Meeting. [1] As you can see from Table 1, we now have six transistor options; the high-voltage transistors use a thicker gate dielectric stack (Fig. 1), and the gate pitch and gate lengths have been tuned…

Intel details 22nm trigate SoC process at IEDM

After launching their 22nm tri-gate high-performance logic product back in the spring, Intel have been promising to show off their SoC derivative, and yesterday was the day at the 2012 IEEE International Electron Devices Meeting. [1] As you can see from Table 1, we now have six transistor options; the high-voltage transistors use a thicker gate dielectric stack (Fig. 1), and the gate pitch and gate lengths have been tuned…

Intel details 22nm trigate SoC process at IEDM

After launching their 22nm tri-gate high-performance logic product back in the spring, Intel have been promising to show off their SoC derivative, and yesterday was the day at the 2012 IEEE International Electron Devices Meeting. [1] As you can see from Table 1, we now have six transistor options; the high-voltage transistors use a thicker gate dielectric stack (Fig. 1), and the gate pitch and gate lengths have been tuned…

Brooks Instrument Pressure-based Mass Flow Controllers - Theory of Operation

Meet the Brooks Instrument pressure-based mass flow controller (P-MFC) that can HANDLE the PRESSURE, the GP200 Series.

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