MAGAZINE
March
Properties of New Materials for Microchips Can Now Be Measured Well
Reseachers of Delft University of Technology demonstrated measuring performance properties of ultrathin silicon membranes.
Silvaco Expands Partnership with Micron
Silvaco Group, Inc., a provider of TCAD, EDA software, and SIP solutions that enable semiconductor design and AI through software and innovation, today announced an enhanced partnership with Micron Technology, Inc.
IMAPS & IPC to Host Onshoring Workshop
The International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host a Workshop to discuss ongoing progress and forward-looking strategies to drive the Onshoring Advanced Packaging and Assembly, April 29 – May 1, 2024, in Arlington, Virginia.
Rapidus Announces U.S. Subsidiary and Opens Silicon Valley Office
Rapidus Corporation today announced it has formed a U.S. subsidiary, Rapidus Design Solutions (RDS); opened an office for the Americas in Santa Clara, California; and named long-time semiconductor executive Henri Richard as general manager and president of the U.S. organization.
Infineon and Amkor Announce Extended Partnership
Infineon Technologies AG is strengthening its outsourced backend manufacturing footprint in Europe and announced a multi-year partnership with Amkor Technology, Inc., a provider of semiconductor packaging and test services.
Semiconductor Advanced Packaging Market Size to Record $22.79B Growth from 2024-2028
The global semiconductor advanced packaging market size is estimated to grow by USD 22.79 billion from 2024 to 2028, according to Technavio.
Global PC Shipments Return to Growth and Pre-Pandemic Volumes in the First Quarter of 2024
After two years of decline, the worldwide traditional PC market returned to growth during the first quarter of 2024 (1Q24) with 59.8 million shipments, growing 1.5% year over year, according to preliminary results from the International Data Corporation (IDC) Worldwide Quarterly Personal Computing Device Tracker.
SEMI Issues Statement on Change to U.S. CHIPS Act Notice of Funding Opportunity
SEMI today issued the following statement from Ajit Manocha, SEMI President and CEO, after the United States Government announced it will no longer move forward with the Notice of Funding Opportunity for CHIPS funding for the construction, modernization, or expansion of semiconductor research and development (R&D) facilities in the United States.
Semiconductor Research Corporation Announces 2024 Call for Research, $13.8M in Funding Opportunities
Semiconductor Research Corporation (SRC) is announcing the start of solicitation season with $13.8 million in funding opportunities.
The Building Block for Magnetoelectric Spin-Orbit Logic
An international team, led by researchers from the Nanodevices group at CIC nanoGUNE, succeeded in voltage-based magnetization switching and reading of magnetoelectric spin-orbit nanodevices.
Breakthrough for Next-Generation Digital Displays
Researchers at Linköping University, Sweden, have developed a digital display screen where the LEDs themselves react to touch, light, fingerprints and the user’s pulse, among other things.
Global Semiconductor Equipment Billings Slip to $106.3 Billion in 2023
Worldwide sales of semiconductor manufacturing equipment edged down 1.3% to $106.3 billion in 2023 from an all-time record of $107.6 billion in 2022, SEMI, the industry association representing the global electronics design and manufacturing supply chain, reported today.
Micron’s Full Suite of Automotive-Grade Solutions Qualified for Qualcomm Automotive Platforms
Micron’s automotive memory and storage enable central compute, digital cockpit and advanced driver-assistance systems for Qualcomm customers.
SEMI Talent Forum 2024 to Help Build Next-Generation Chip Industry Workforce
Post-graduates and onboarding talent will connect with local companies to explore semiconductor industry career paths and employment opportunities at the SEMI Talent Forum, May 1, 2024 at the University of Swansea.
SEMI Applauds U.S. CHIPS Act Award for TSMC Manufacturing Facilities
“We applaud the U.S. Department of Commerce for taking this significant step to enhance the resilience of the domestic semiconductor supply chain,” said Joe Stockunas, President of SEMI Americas.
Breakthrough in Memory Technology: Next-Generation Optoelectronic Memory with Tellurene
Researchers developed a novel optoelectronic memory device that addresses the issues of conventional floating-gate nonvolatile memory devices.
Electronic System Design Industry Posts $4.4 Billion in Revenue in Q4 2023, ESD Alliance Reports
Electronic System Design (ESD) industry revenue increased 14% to $4,423 million in the fourth quarter of 2023 from the $3,879.9 million logged in the third quarter of 2023, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report.
SEMI University Launches In-Person Courses to Help Semiconductor Industry Workforce Build Skills
Aiming to help the global semiconductor workforce expand its skills to address the talent gap, SEMI today announced the expansion of the SEMI University learning platform to include in-person trainings.
Everspin Technologies Unveils PERSYST
Everspin Technologies, Inc. announced today the new brand name PERSYST for its persistent memory product family.
China to Become World’s Largest Source of IC Wafer Capacity by 2026
According to the Global Wafer Capacity 2024 report from Knometa Research, wafer capacity for IC production is projected to grow on average 7.1% each year through 2026.
TSMC Awarded $6.6B in CHIPS and Science Act Funding for Investments in Arizona Fabs
TSMC announces 2nm technology at second fab and a new third fab to produce 2nm or more advanced chips.
R2 Semiconductor Files New Patent Infringement Lawsuit Against Intel In France
R2 Semiconductor, a Third Point Ventures portfolio company, today announced it has filed a patent infringement lawsuit in Le Tribunal Judiciaire de Paris against the French subsidiaries of Intel Corp and its customers, Dell Technologies and Hewlett Packard Enterprise Company and HP Inc
Microchip Technology Expands Partnership with TSMC
Microchip Technology announced it has expanded its partnership with TSMC, to enable a specialized 40nm manufacturing capacity at Japan Advanced Semiconductor Manufacturing, Inc. (JASM), TSMC’s majority-owned manufacturing subsidiary in Kumamoto Prefecture, Japan.
Featured Video
Winnie Nabea, Global Product Manager at Mettler-Toledo Thornton, explains the importance of monitoring silica in ultra-high purity (UHP) water used in semiconductor manufacturing plants. Silica is one of the most critical indicators of the health of the water system. A rise in silica levels means the resin is approaching exhaustion and needs to be regenerated. If silica is not monitored, contamination of the ultrapure water can occur. She explains where silica should be monitored, outside factors that may cause silica issues, the best methods for monitoring silica, and how Mettler-Toledo is helping semiconductor manufacturers monitor the overall health of their water treatment plants.
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U.S. Aims for 20% of World’s Leading Edge Semiconductor Production by 2030
Secretary of Commerce Gina Raimondo believes investments in leading-edge logic chips manufacturing will put the U.S. on track to produce roughly 20 percent of the world’s leading-edge logic chips by the end of the decade.
Water Supply Challenges for the Semiconductor Industry
The energy-hungry nature and large carbon footprint of semiconductor manufacturing have received considerable attention in the context of reducing our emissions of planet-warming greenhouse gases. It turns out we are just as thirsty as we are hungry.
Professors from MIT, UCLA to be Honored for Excellence in Semiconductor Research
The Semiconductor Industry Association (SIA), in collaboration with the Semiconductor Research Corporation (SRC), today announced the winners of its 2019 University Research Awards.
What Do Small Companies Need to Know about the CHIPS Act?
IBM’s Poughkeepsie, N.Y. site was the backdrop for one of President Biden’s speeches promoting the passage of the $52B CHIPS (Creating Helpful Incentives to Produce Semiconductors) and Science Act, a rare piece of legislation for which the president won bipartisan support.
Intel 4 Process Drops Cobalt Interconnect, Goes with Tried and Tested Copper with Cobalt Liner/Cap
At the VLSI Symposia in June, Intel presented a paper “Intel 4 CMOS Technology Featuring Advanced FinFET Transistors Optimized for High Density and High-Performance Computing.” Blogger Dick James reports on details of the interconnect strategy.
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