MAGAZINE
March
JCET Q1 2024 Revenue and Net Profit Achieve Double-digit Year-on-Year Growth
JCET Group, a global provider of integrated circuit (IC) back-end manufacturing and technology services, today announced its financial results for the first quarter of 2024.
Opening Up the Potential of Thin-Film Electronics for Flexible Chip Design
New research demonstrates feasibility of ‘foundry’ model for flexible electronics.
Scott Monroe Appointed as Vice President of Sales at Encore Semi
Encore Semi, a provider of tailored engineering solutions to accelerate projects, improve performance, and reduce risks in the development of next generation System-on-Chip (SoC), electronic subsystems, and intellectual property (IP), announced the appointment of Scott Monroe as Vice President of Sales.
Utilizing Palladium for Addressing Contact Issues of Buried Oxide Thin Film Transistors
A novel method that employs palladium to inject hydrogen into the deeply buried oxide-metal electrode contacts of amorphous oxide semiconductors (AOSs) storage devices, which reduces contact resistance, has been developed by scientists at Tokyo Tech.
U.S. Department of Commerce Receives Over 160 Concept Plans for CHIPS for America Funding
Projects to play vital role in strengthening the U.S. semiconductor supply chain.
Global Semiconductor Sales Increase 16.3% Year-to-Year in February
Year-to-year market growth in February is largest since May 2022; worldwide chip sales decrease 3.1% month-to-month.
Lambda Announces $500M GPU-Backed Facility to Expand Cloud for AI
Lambda, the GPU cloud company founded by AI engineers and powered by NVIDIA GPUs, today announced that it has secured a special purpose GPU financing vehicle of up to $500 million to fund the expansion of its on-demand cloud offering.
sureCore Announces Low Power Memory Compiler for 16nm FinFET
sureCore, the low power embedded memory specialist, has announced the availability of its PowerMiser, ultra-low, dynamic power memory compiler in 16nm.
Allegro MicroSystems Appoints Jennie Raubacher to its Board of Directors
Allegro MicroSystems, Inc. today announced the appointment of Jennie Raubacher to Allegro’s Board of Directors as an independent director.
Semiconductor Metal Plating Chemicals to Top $1 Billion
TECHCET is forecasting Metal Plating Chemicals to grow 7% in 2024, to reach over $1 billion.
SiMa.ai Secures Funds and Readies New Generative Edge AI Platform
SiMa.ai, the software-centric, embedded edge machine learning system-on-chip company, today announced it has raised an additional $70M of funding led by Maverick Capital, with participation from Point72 and Jericho, as well as existing investors Amplify Partners, Dell Technologies Capital, Lip-Bu Tan and others.
Binghamton University Receives $1M to Support Job Training in Electronics Manufacturing
New cleanroom equipment creates ideal space for students to learn advanced packaging processes.
SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana
SK hynix Inc. announced today that it will invest an estimated $3.87 billion in West Lafayette, Indiana to build an advanced packaging fabrication and R&D facility for AI products.
Aspinity Establishes Technical Advisory Board
Aspinity today announced the formation of its technical advisory board, including Kymeta President and CEO Rick Bergman and Boston Consulting Group (BCG) Advisor Bill Earnshaw.
Nordson Electronics Solutions Expands the SELECT Synchro Selective Soldering Equipment Family
Nordson Electronics Solutions releases the Synchro 3, a new model in the SELECT Synchro selective soldering equipmen family for high-volume printed circuit board assembly applications.
Empower Semiconductor Announces European Sales Expansion
Empower Semiconductor today announced a representation and distribution agreement with Dimac Red Spa.
Chemistry Researchers Modify Solar Technology to Produce a Less Harmful Greenhouse Gas
Researchers in the UNC-Chapel Hill Chemistry Department are using semiconductors to harvest and convert the sun’s energy into high-energy compounds that have the potential to produce environmentally friendly fuels.
Henkel Semiconductor Capillary Underfill Enables AI and Advanced Packaging Designs
Henkel today announced that it has commercialized a semiconductor capillary underfill encapsulant to address the unique requirements of the market’s most demanding advanced packages, like those used in artificial intelligence (AI) and high-performance computing (HPC) applications.
NY CREATES and C2MI Announce Partnership
NY CREATES and MiQro Innovation Collaborative Centre – C2MI today announced a partnership between the two entities that will enhance research opportunities, expand potential for economic and workforce development, and nurture collaborative efforts.
Hailo Closes New $120 Million Funding Round and Debuts Hailo-10
Hailo’s funding now exceeds $340 million as the company introduces its newest AI accelerator specifically designed to process LLMs at low power consumption for the personal computer and automotive industries, bringing generative AI to the edge.
Old Crystal, New Story for Enhancing Deep Ultraviolet Laser Performance
In the realm of science and technology, harnessing coherent light sources in the deep ultraviolet (DUV) region holds immense significance across various applications such as lithography, defect inspection, metrology, and spectroscopy.
X3 Holdings Strikes Major Partnership Deal
X3 Holdings Co., Ltd. unveiled its strategic partnership with a leading provider of semiconductor modules and devices.
ATREG Announces Completion of JDI’s Higashiura, Japan Fab Sale to Sony
ATREG, Inc. announced today that the acquisition of Japan Display, Inc. (JDI)’s large operational LCD panel manufacturing fab located in Higashiura, Japan by Sony Semiconductor Manufacturing Corporation (SCK) has officially closed.
Featured Video
Winnie Nabea, Global Product Manager at Mettler-Toledo Thornton, explains the importance of monitoring silica in ultra-high purity (UHP) water used in semiconductor manufacturing plants. Silica is one of the most critical indicators of the health of the water system. A rise in silica levels means the resin is approaching exhaustion and needs to be regenerated. If silica is not monitored, contamination of the ultrapure water can occur. She explains where silica should be monitored, outside factors that may cause silica issues, the best methods for monitoring silica, and how Mettler-Toledo is helping semiconductor manufacturers monitor the overall health of their water treatment plants.
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U.S. Aims for 20% of World’s Leading Edge Semiconductor Production by 2030
Secretary of Commerce Gina Raimondo believes investments in leading-edge logic chips manufacturing will put the U.S. on track to produce roughly 20 percent of the world’s leading-edge logic chips by the end of the decade.
Water Supply Challenges for the Semiconductor Industry
The energy-hungry nature and large carbon footprint of semiconductor manufacturing have received considerable attention in the context of reducing our emissions of planet-warming greenhouse gases. It turns out we are just as thirsty as we are hungry.
Professors from MIT, UCLA to be Honored for Excellence in Semiconductor Research
The Semiconductor Industry Association (SIA), in collaboration with the Semiconductor Research Corporation (SRC), today announced the winners of its 2019 University Research Awards.
What Do Small Companies Need to Know about the CHIPS Act?
IBM’s Poughkeepsie, N.Y. site was the backdrop for one of President Biden’s speeches promoting the passage of the $52B CHIPS (Creating Helpful Incentives to Produce Semiconductors) and Science Act, a rare piece of legislation for which the president won bipartisan support.
Intel 4 Process Drops Cobalt Interconnect, Goes with Tried and Tested Copper with Cobalt Liner/Cap
At the VLSI Symposia in June, Intel presented a paper “Intel 4 CMOS Technology Featuring Advanced FinFET Transistors Optimized for High Density and High-Performance Computing.” Blogger Dick James reports on details of the interconnect strategy.
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