MAGAZINE
March
Properties of New Materials for Microchips Can Now Be Measured Well
Reseachers of Delft University of Technology demonstrated measuring performance properties of ultrathin silicon membranes.
Silvaco Expands Partnership with Micron
Silvaco Group, Inc., a provider of TCAD, EDA software, and SIP solutions that enable semiconductor design and AI through software and innovation, today announced an enhanced partnership with Micron Technology, Inc.
TANAKA Establishes New Overseas Subsidiary in Seoul, Korea
Establishing overseas subsidiary in Korea will invigorate transactions and expand business in the markets for fuel cell catalysts, power semiconductor materials, precursors, and precious metal recycling.
Navitas New Distribution Deal with Richardson Electronics Expands Americas Footprint for Next-Gen SiC Semiconductors
Partnership for advanced GeneSiC silicon carbide (SiC) targets renewable energy, industrial, medical, transportation, and energy storage.
Lattice Semiconductor Appoints Elizabeth Schwarting to Board of Directors
Lattice Semiconductor today announced the appointment of Elizabeth Schwarting to the Company’s Board of Directors and Nominating and Governance Committee effective March 14, 2023.
Silicon Labs Announces New Bluetooth SoC and MCU Ideal for Small Form-Factor Devices
Silicon Labs today announced two new integrated circuit families designed for the smallest form factor IoT devices: the xG27 family of Bluetooth systems on chips (SoCs) and the BB50 microcontroller unit (MCU).
Boston Semi Equipment Announces Record Orders
Boston Semi Equipment today announced its test handler backlog has reached a historical level and continues to grow.
Pusan National University Researchers Develop Novel Stackable Hole Injection Layer Material for Solution-processed OLEDs
Researchers have now developed a novel thermally cross-linkable poly(iminoarylene), a solvent-resistant hole injection layer material with excellent film-forming properties, optimum energy level and high mobility, a major stepping stone toward commercial viability of solution-processed OLEDs.
Henkel Delivers Versatile, High Thermal Die Attach Adhesive for Power IC Applications
Henkel today announced the availability of a die attach adhesive that provides high thermal capability to enable superior operation of power semiconductor packages.
Proposal Submitted to Create Northeast Microelectronics Coalition
The Center for Advanced Manufacturing at MassTech Collaborative (CAM) and more than 85 organizations from across the Northeast have submitted a proposal to the federal government to create the Northeast Microelectronics Coalition.
CAMECA Partners with imec on Atom Probe Tomography
IMEC’s acquisition of CAMECA’s Invizo 6000 will contribute to its advanced research and development for future logic, memory, and interconnected architectures.
Finalists Selected for Round Six of Luminate NY
Empire State Development (ESD) announced the 10 companies selected to take part in round six of the Luminate NY accelerator program, investment fund, and competition.
Microchip Reaches Milestone in $800 Million, Multi-Year Initiative
Microchip reached a milestone in its multi-year, $800 million initiative aiming to triple production capacity at its Gresham, Oregon manufacturing facility.
New AI Model Transforms Understanding of Metal-Organic Frameworks
Researchers at EPFL and KAIST have created a transformer for Metal-Organic Frameworks (MOFs), a class of porous crystalline materials. By combining organic linkers with metal nodes, chemists can synthesize millions of different materials with potential applications in energy storage and gas separation.
IMAPS Advanced System-in-Package Conference is Now CHIPcon
The top global event for advanced Chiplet and Heterogeneous Integration Packaging (CHIP) technologies to be held in July 2023.
Intrinsic Semiconductor Technologies Secures $8.5M Investment to Solve the Memory Bottleneck for Data Hungry Applications
Innovative non-volatile memory technology from UCL spin-out will create a new generation of small devices with big brains that embed intelligence everywhere.
Micron Releases ‘We Are Micron’ 2022 Diversity, Equality and Inclusion Report
Initiatives creating readiness for the workforce of the future and highlighting ongoing commitment to diversity.
Electric Vehicle Components Market Is Estimated To Be Valued At US$ 1001.95 Billion By 2032
The market is further expected to gain size of USD 1001.95 Billion by the year 2032. The market is expected to grow with a CAGR of 21.05% in the forecast period.
Tower Semiconductor Announces World’s First Heterogeneous Integration of Quantum Dot Lasers on its Popular SiPho Foundry Platform PH18
Tower Semiconductor, a foundry of high-value analog semiconductor solutions, in collaboration with Quintessent, Inc, today announced the world’s first heterogeneous integration of GaAs quantum dot (QD) lasers and a foundry silicon photonics platform (PH18DB).
Tower Semiconductor and Teramount Announce Technology Collaboration Connecting a Large Number of Optical Fibers to Silicon Chips
Tower Semiconductor, a foundry of high value analog semiconductor solutions, and Teramount today announced a collaboration based on Teramount’s ‘PhotonicPlug’ technology and Tower’s silicon photonic ‘Bump-ready’ wafers.‘
POET Technologies and Vanguard Automation Collaborate on Solutions for Co-packaged Optics and AI-ML Applications
POET Technologies Inc. and Vanguard Automation GmbH today announced a collaboration to enable the integration of Micro-Lenses on the POET Optical Interposer to maximize coupling efficiency while maintaining POET’s wafer-level passive assembly process.
Sivers Semiconductors Joins the Northeastern Microelectronics Coalition
Sivers Wireless and more than 85 organizations from across the Northeast region of the United States have submitted a proposal to the US federal government to create the Northeast Microelectronics Coalition.
Gartner Says Top 10 Semiconductor Buyers Decreased Chip Spending by 7.6% in 2022
The top 10 global original equipment manufacturers (OEMs) decreased their chip spending by 7.6% and accounted for 37.2% of the total market in 2022, according to preliminary results by Gartner, Inc.
Featured Video
Winnie Nabea, Global Product Manager at Mettler-Toledo Thornton, explains the importance of monitoring silica in ultra-high purity (UHP) water used in semiconductor manufacturing plants. Silica is one of the most critical indicators of the health of the water system. A rise in silica levels means the resin is approaching exhaustion and needs to be regenerated. If silica is not monitored, contamination of the ultrapure water can occur. She explains where silica should be monitored, outside factors that may cause silica issues, the best methods for monitoring silica, and how Mettler-Toledo is helping semiconductor manufacturers monitor the overall health of their water treatment plants.
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U.S. Aims for 20% of World’s Leading Edge Semiconductor Production by 2030
Secretary of Commerce Gina Raimondo believes investments in leading-edge logic chips manufacturing will put the U.S. on track to produce roughly 20 percent of the world’s leading-edge logic chips by the end of the decade.
Water Supply Challenges for the Semiconductor Industry
The energy-hungry nature and large carbon footprint of semiconductor manufacturing have received considerable attention in the context of reducing our emissions of planet-warming greenhouse gases. It turns out we are just as thirsty as we are hungry.
Professors from MIT, UCLA to be Honored for Excellence in Semiconductor Research
The Semiconductor Industry Association (SIA), in collaboration with the Semiconductor Research Corporation (SRC), today announced the winners of its 2019 University Research Awards.
What Do Small Companies Need to Know about the CHIPS Act?
IBM’s Poughkeepsie, N.Y. site was the backdrop for one of President Biden’s speeches promoting the passage of the $52B CHIPS (Creating Helpful Incentives to Produce Semiconductors) and Science Act, a rare piece of legislation for which the president won bipartisan support.
Intel 4 Process Drops Cobalt Interconnect, Goes with Tried and Tested Copper with Cobalt Liner/Cap
At the VLSI Symposia in June, Intel presented a paper “Intel 4 CMOS Technology Featuring Advanced FinFET Transistors Optimized for High Density and High-Performance Computing.” Blogger Dick James reports on details of the interconnect strategy.
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