Imec Builds World’s First Spiking Neural Network-Based Chip for Radar Signal Processing

Imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, today presents the world’s first chip that processes radar signals using a spiking recurrent neural network

Wide Bandgap Semiconductor Devices Based on Silicon Carbide May Revolutionize Electronics

Growth of high-quality substrates for microelectronic applications is one of the key elements helping drive society toward a more sustainable green economy. Today, silicon plays a central role within the semiconductor industry for microelectronic and nanoelectronic devices.

IEDM 2011 Preview

Next week the researchers and practitioners of the electron device world will be gathering in Washington D.C. for the 2011 IEEE International Electron Devices Meeting. To quote the conference web front page, “IEDM is the world’s pre-eminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS…

IEDM 2011 Preview

Next week the researchers and practitioners of the electron device world will be gathering in Washington D.C. for the 2011 IEEE International Electron Devices Meeting. To quote the conference web front page, “IEDM is the world’s pre-eminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS…

Intel clarifies 32nm NMOS stress mechanism at IEDM 2011

I was browsing through the advance program for the upcoming IEDM conference when, almost at the end, I came across paper number 34.4, "Modeling of NMOS Performance Gains from Edge Dislocation Stress," by Weber et al. of Intel. According to the abstract: "Simulations show stress from edge dislocations introduced by solid phase epitaxial regrowth increases as gate pitch is scaled, reaching over 1GPa. This makes edge dislocations attractive, as stress…

Intel clarifies 32nm NMOS stress mechanism at IEDM 2011

I was browsing through the advance program for the upcoming IEDM conference when, almost at the end, I came across paper number 34.4, "Modeling of NMOS Performance Gains from Edge Dislocation Stress," by Weber et al. of Intel. According to the abstract: "Simulations show stress from edge dislocations introduced by solid phase epitaxial regrowth increases as gate pitch is scaled, reaching over 1GPa. This makes edge dislocations attractive, as stress…

Intel clarifies 32nm NMOS stress mechanism at IEDM 2011

I was browsing through the advance program for the upcoming IEDM conference when, almost at the end, I came across paper number 34.4, "Modeling of NMOS Performance Gains from Edge Dislocation Stress," by Weber et al. of Intel. According to the abstract: "Simulations show stress from edge dislocations introduced by solid phase epitaxial regrowth increases as gate pitch is scaled, reaching over 1GPa. This makes edge dislocations attractive, as stress…

GLOBALFOUNDRIES Takes a Different Approach to HKMG in AMD’s Llano CPU/GPU

After much anticipation, and with quite a few design wins, AMD’s Llano CPU/GPU chip arrived on the scene a couple of months ago. Fabricated by GlobalFoundries (more easily known as GloFo) in their 32nm SHP process, it was the first foundry-based gate-first HKMG product to come on the market. As a processor, it garnered pretty favorable reviews, but of course we were keen to get it into the lab and…

GLOBALFOUNDRIES Takes a Different Approach to HKMG in AMD’s Llano CPU/GPU

After much anticipation, and with quite a few design wins, AMD’s Llano CPU/GPU chip arrived on the scene a couple of months ago. Fabricated by GlobalFoundries (more easily known as GloFo) in their 32nm SHP process, it was the first foundry-based gate-first HKMG product to come on the market. As a processor, it garnered pretty favorable reviews, but of course we were keen to get it into the lab and…

GLOBALFOUNDRIES Takes a Different Approach to HKMG in AMD’s Llano CPU/GPU

After much anticipation, and with quite a few design wins, AMD’s Llano CPU/GPU chip arrived on the scene a couple of months ago. Fabricated by GlobalFoundries (more easily known as GloFo) in their 32nm SHP process, it was the first foundry-based gate-first HKMG product to come on the market. As a processor, it garnered pretty favorable reviews, but of course we were keen to get it into the lab and…

Intel Enlarges Process Lead over Their Competition

22-nm Trigate Transistors Discussed At a morning session at the Intel Developer Forum Tuesday, Mark Bohr tooted the Intel trumpet and put a slide up to emphasise their lead over the other leading semiconductor companies: Intel Process Evolution Since 90-nm One can quibble a bit about the odd month here or there for the dates, but essentially things have been as they say — they were the first with embedded…

Intel Enlarges Process Lead over Their Competition

22-nm Trigate Transistors Discussed At a morning session at the Intel Developer Forum Tuesday, Mark Bohr tooted the Intel trumpet and put a slide up to emphasise their lead over the other leading semiconductor companies: Intel Process Evolution Since 90-nm One can quibble a bit about the odd month here or there for the dates, but essentially things have been as they say — they were the first with embedded…

Intel Enlarges Process Lead over Their Competition

22-nm Trigate Transistors Discussed At a morning session at the Intel Developer Forum Tuesday, Mark Bohr tooted the Intel trumpet and put a slide up to emphasise their lead over the other leading semiconductor companies: Intel Process Evolution Since 90-nm One can quibble a bit about the odd month here or there for the dates, but essentially things have been as they say — they were the first with embedded…

A SEMICON West snippet: AMAT launches new products, prepares for 450mm

SEMICON West is usually taken as a barometer for the industry, and my subjective impression is steaming along nicely, but no record breaking years coming up! According to Tom Morrow of SEMI, this year’s preregistrations were flat, but there about 10% more booths than last year. I kicked off the show by sitting in at the Applied Materials (AMAT) press and analysts breakfast. As usual AMAT had a flurry of…

A SEMICON West snippet: AMAT launches new products, prepares for 450mm

SEMICON West is usually taken as a barometer for the industry, and my subjective impression is steaming along nicely, but no record breaking years coming up! According to Tom Morrow of SEMI, this year’s preregistrations were flat, but there about 10% more booths than last year. I kicked off the show by sitting in at the Applied Materials (AMAT) press and analysts breakfast. As usual AMAT had a flurry of…

A SEMICON West snippet: AMAT launches new products, prepares for 450mm

SEMICON West is usually taken as a barometer for the industry, and my subjective impression is steaming along nicely, but no record breaking years coming up! According to Tom Morrow of SEMI, this year’s preregistrations were flat, but there about 10% more booths than last year. I kicked off the show by sitting in at the Applied Materials (AMAT) press and analysts breakfast. As usual AMAT had a flurry of…

TSMC HKMG is Out There!

I have to apologise for a hiatus in posting due to pressure from the day job, but this week is Semicon West week, so it seems appropriate to announce that we’ve started analysing TSMC’s 28-nm gate-last HKMG product, in this case a Xilinx Kintex-7 FPGA, fabbed in TSMC’s HPL process. Having seen two generations of Intel’s HKMG parts (the 45-nm Xeon and 32-nm Westmere) using gate-last technology, it’s inevitable that…

TSMC HKMG is Out There!

I have to apologise for a hiatus in posting due to pressure from the day job, but this week is Semicon West week, so it seems appropriate to announce that we’ve started analysing TSMC’s 28-nm gate-last HKMG product, in this case a Xilinx Kintex-7 FPGA, fabbed in TSMC’s HPL process. Having seen two generations of Intel’s HKMG parts (the 45-nm Xeon and 32-nm Westmere) using gate-last technology, it’s inevitable that…

Intel Goes Tri-Gate at 22-nm!

In a pair of press and analyst briefings this morning, Mark Bohr and Steve Smith announced that Intel will indeed be using a 3D transistor structure for their 22-nm product, settling one of the big questions about Intel’s process development over the last few years – do they stay planar or not? (And, incidentally, settling a bet between me and Scott Thompson – Scott wins!) The big debate at IEDM…

Intel Goes Tri-Gate at 22-nm!

In a pair of press and analyst briefings this morning, Mark Bohr and Steve Smith announced that Intel will indeed be using a 3D transistor structure for their 22-nm product, settling one of the big questions about Intel’s process development over the last few years – do they stay planar or not? (And, incidentally, settling a bet between me and Scott Thompson – Scott wins!) The big debate at IEDM…

A Shameless Plug for ASMC

Winter is finally starting to fade in Ottawa, and the early signs of spring are showing. The maple sap is running, the first migrant birds have arrived, the frogs are peeping, and we have evening daylight. On the conference calendar, spring means that ASMC (IEEE/SEMI Advanced Semiconductor Manufacturing Conference) is on the horizon, this year in Saratoga Springs, New York on May 16 -18. There, spring should be well advanced,…

Panasonic Gate-First HKMG also First Out of the Gate

As I suggested a few months ago, we put some credence in Panasonic’s press release last September that they would be shipping their first 32-nm HKMG parts last October. Samsung had announced their Saratoga chip, and both Altera and Xilinx have displayed silicon from TSMC, but until last Friday (18 March), none have said that they were shipping product. As of Friday Xilinx announced that they were shipping their Kintex-7…

Panasonic Gate-First HKMG also First Out of the Gate

As I suggested a few months ago, we put some credence in Panasonic’s press release last September that they would be shipping their first 32-nm HKMG parts last October. Samsung had announced their Saratoga chip, and both Altera and Xilinx have displayed silicon from TSMC, but until last Friday (18 March), none have said that they were shipping product. As of Friday Xilinx announced that they were shipping their Kintex-7…

Interview with Dr. Subodh Kulkarni, CyberOptics Corporation

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