MAGAZINE
March
SEMI 3D & Systems Summit to Spotlight Trends in Hybrid Bonding, Chiplet Design and Environmental Sustainability
Leading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, 12-14 June, 2024, in Dresden for insights into the latest heterogeneous integration innovations for semiconductor applications enabling the future of intelligent and sustainable systems.
Wolfspeed Tops Out World’s Largest, Most Advanced Silicon Carbide Facility
Today, Wolfspeed, Inc. hosted Senator Thom Tillis (R-NC) and other local officials, community partners, and employees at a ceremony to celebrate the topping out of construction at the $5 billion John Palmour Manufacturing Center for Silicon Carbide.
Innolux Signs LCD Technology Transfer Agreement with India’s Vedanta
Innolux made a public disclosure that it has reached an agreement to transfer TFT LCD panel and module technology to India’s Vedanta.
CMP Equipment “Ancillaries” Poised for Growth
Increases driven by 3DFinFET and X-Stack 3DNAND.
Alliance Memory Expands Lineup of CMOS DDR4 SDRAMs With New 16Gb Device
Alliance Memory today announced that it has expanded its portfolio of CMOS DDR4 SDRAMs with a new 16Gb device in the 96-ball FBGA package.
Ingestible Sensor Could Help Doctors Pinpoint GI Difficulties
Engineers at MIT and Caltech have demonstrated an ingestible sensor whose location can be monitored as it moves through the digestive tract, an advance that could help doctors more easily diagnose gastrointestinal motility disorders such as constipation, gastroesophageal reflux disease, and gastroparesis.
Ouster and Velodyne Complete Merger
The combined company will keep the name Ouster and continue to trade on New York Stock Exchange under the ticker “OUST.”
indie to Acquire GEO Semiconductor
indie Semiconductor today announced it has entered a definitive agreement to purchase GEO Semiconductor, Inc., a developer of video processors for automotive cameras.
onsemi Commemorates Transfer of Ownership of East Fishkill, New York Facility from GlobalFoundries with Ribbon Cutting Ceremony
onsemi today announced the successful completion of its acquisition of GlobalFoundries’ (GF’s) 300mm East Fishkill (EFK), New York site and fabrication facility, effective December 31, 2022.
Beyond Lithium: A Promising Cathode Material for Magnesium Rechargeable Batteries
Scientists discover the optimal composition for a magnesium secondary battery cathode to achieve better cyclability and high battery capacity.
MemryX Inc. and Edge Impulse Announce Partnership to Effortlessly Develop and Deploy AI on MemryX Edge AI Processors
MemryX Inc. announced it has formed a partnership with Edge Impulse, the AI-algorithm software provider, to streamline the development, testing, and deployment of AI models on MemryX’s advanced AI accelerator chips.
Lam Research Appoints Semiconductor Engineering Leader Dr. Ho Kyu Kang to Board of Directors
Lam Research Corp. today announced that Dr. Ho Kyu Kang has joined its board of directors, effective February 7, 2023.
Denton Vacuum Announces Third Order for Infinity FA Ion Beam Etch Delayering System
Denton Vacuum LLC announced today that they have won a third order for the Infinity FA failure analysis system from a leading global semiconductor memory device manufacturer.
Lorentz Solution Joins Intel Foundry Services (IFS) Accelerator EDA Alliance Program
Lorentz collaborates with Intel Foundry Services (IFS) to provide EDA tools and simulation solutions for silicon success and customers’ design needs.
Linton Crystal Technologies Announces Groundbreaking U.S. Manufacturing Investment
Linton Crystal Technologies (LCT), headquartered in Rochester, New York, announced today it will produce semiconductor and solar manufacturing equipment in the United States.
Make Them Thin Enough, and Antiferroelectric Materials Become Ferroelectric
Antiferroelectric materials have electrical properties that make them advantageous for use in high-density energy storage applications. Researchers have now discovered a size threshold beyond which antiferroelectrics lose those properties, becoming ferroelectric.
3D TSV Packages Market Size & Share to Surpass $14.9 Billion by 2028
The Global 3D TSV Packages Market is valued at $6.1 billion in 2021 and is projected to reach $14.9 billion by 2028 at a CAGR (Compound Annual Growth Rate) of 16.1% over the forecast period 2022-2028.
IDTechEx Explores Nine Startups Innovating Polymer Additive Manufacturing
Essential to understanding the evolution of the polymer 3D printing industry is exploring the change from low-cost printing technologies and materials to the slow growth and adoption of innovative polymer printing technologies and materials, from viscous thermosets to carbon fiber composites to foams.
GlobalFoundries and GM Announce Long-Term Direct Supply Agreement for U.S. Production of Semiconductor Chips
General Motors Co. and GlobalFoundries today announced a strategic, long-term agreement establishing a dedicated capacity corridor exclusively for GM’s chip supply.
GlobalFoundries Acquires Renesas’ Non-Volatile Resistive RAM Technology to Proliferate IoT and 5G Applications
Technology acquisition expands GF’s portfolio and differentiated roadmap while accelerating the commercialization of memory solutions.
New SEMI Online Learning Platform Delivers Semiconductor Training to Support Workforce Development for Industry Growth
SEMI University curriculum enables upskilling and career advancement for various employee levels and industry newcomers.
NTT and the University of Tokyo Develop World’s First Optical Computing AI Using an Algorithm Inspired by the Human Brain
Collaboration advances the practical application of low-power, high-speed AI based on optical computing.
Cree LED’s Three New High-Brightness LEDs Improve Large-Format Video Displays
These new LEDs provide enhanced performance for all types of large-format displays requiring superior image quality and reliability.
Featured Video
Ultrapure Water Monitoring for Semiconductor Sustainability
Is your semiconductor plant seeking methods to enhance sustainability in wafer manufacturing and water reclamation? The semiconductor sector faces two challenges: waste reduction and water usage. The use of on-line water analytics can assist in overseeing water quality in both wafer manufacturing and reclamation/reuse procedures. This video underscores the significance of monitoring the levels of conductivity, TOC, and microbes to identify impurities that may lead to rejected wafers. Monitoring these parameters also ensures the purity of water to improve wafer quality and yield. Furthermore, this video emphasizes the importance of monitoring the levels of dissolved oxygen, TOC, and pH in waste streams to optimize water recovery.
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