The total semiconductor materials market is forecasted to rebound with almost 7% growth in 2024 to reach US$74 billion. This upwards turnaround comes after a contraction of -3.3% in 2023 due
Atomic Layer Deposition Gains Traction in More-than-Moore Device Production
ALD adoption is likely to continue despite aggravating supply chain issues and production costs.
Sub-fab Improvements Require Reliable Real-time and High Sensitivity In-situ Data
Robust, high speed and high sensitivity real-time data monitoring is essential for enabling rapid response and tight feedback loops.
How Integrated Materials Solutions Speed Innovation
New solutions that rely on a unified database, machine learning and simulations are able to test, validate and provide customer insights into how materials work for new devices process flows, thereby speeding innovation.
Swagelok Introduces New ALD20 UHP Valve
The ALD20’s patent-pending design maximizes production process efficiency and deposition consistency by providing flow coefficients two to three times what can be achieved using today’s standard ALD valve technology.
ASM’s Haukka ALD Award
Dr. Suvi Haukka, executive scientist at ASM International, located in Finland, was awarded the ALD Innovation prize at the ALD 2016 Ireland conference (Figure), as chosen by the conference chairs. Haukka has had a lifetime career in Atomic Layer Deposition…
Litho becomes Patterning
Once upon a time, lithographic (litho) processes were all that IC fabs needed to transfer the design-intent into silicon chips. Over the last 10-15 years, however, IC device structural features have continued to shrink below half the wavelength of the…
Electronic Materials Specifications and Markets
At SEMICON West this year, July 14-16 in San Francisco, the Chemical and Gas Manufacturers Group (CGMG) Committee of SEMI have organized an excellent program covering “Contamination Control in the Sub-20nm Era” to occur in the afternoon of the 14th…
ALD of Crystalline High-K SHTO on Ge
Alternative channel materials (ACM) such as germanium (Ge) will need to be integrated into future CMOS ICs, and one part of the integration was shown at the recent Materials Research Society (MRS) spring meeting by John Ekerdt, Associate Dean for…
