Heterogeneous Integration: Expert Panel Addresses the Challenges Ahead

At SEMICON West, Applied Materials hosted a panel of experts that focused on emerging trends in heterogeneous design and integration using advanced packaging technology.

The ConFab 2018 Update

A new wave of growth is sweeping through the semiconductor industry, propelled by a vast array of new applications, including artificial intelligence, virtual and augmented reality, automotive, 5G, the IoT, cloud computing, healthcare and many others.

MPU Cores and Legal Boors

As reported by The Register, AMD has been sued by a customer who claims that the number of Bulldozer cores in some Opteron and FX microprocessor (MPU) chips are fewer than advertised. The claim is based on the argument that…