Jim Hogan, executive, angel investor and board member, and Stanford University Professor Edward J. McCluskey today became the first posthumous honorees of a new honor acknowledging their significant and noteworthy contributions to the electronic system design industry.
Will there be new greenfield projects to help with tightened capacity?
NVIDIA today unveiled NVIDIA AI LaunchPad, a comprehensive program delivered through hybrid-cloud providers that gives enterprises immediate access to NVIDIA-powered infrastructure and software to streamline the entire AI lifecycle.
SiPearl, the company that is designing the high-performance, low power microprocessor for the European exascale supercomputer, is opening its Barcelona office as the second operational subsidiary outside of France.
Kioxia Corporation announced today that it was awarded the 2020 Field Innovation Award Silver Prize by the Japanese Society for Artificial Intelligence (JSAI) for its TEZUKA 2020 project.
There’s an ongoing push to strengthen the semiconductor supply chain, but making gains in that area is not as straightforward as some people initially believed. Here are five of the top vulnerabilities for the semiconductor sector to solve.
“Park Systems is experiencing unprecedented expansion, and during the coming years we expect to add significantly to the revenue growth that put us at the One Trillion Mark at Kosdaq in 2021”, comments Dr. Sang-il Park, CEO & Founder of Park Systems.
Synopsys, Inc. today announced that it has signed a definitive agreement to acquire the semiconductor and flat panel display solutions from BISTel, a developer of engineering equipment systems and AI applications for semiconductor smart manufacturing, headquartered in South Korea.
Dialog Semiconductor plc today announced that its DA16200 SoC has scored 815 on the EEMBC IoTMark-Wi-Fi benchmark.
The new device, Microchip’s first GaN MMIC, is designed for use in commercial and defense satellite communications, 5G networks and other aerospace and defense systems.
STMicroelectronics (NYSE: STM) is protecting wireless charging of small devices and mobiles with a convenient solution for authenticating certified Qi chargers.
EV Group announced that it has established the EVG Step-and-Repeat (S&R) Mastering Shop, a new service offering to help customers accelerate the deployment of nanoimprint lithography (NIL) in high-volume manufacturing.
Intel, EXOR International, TIM and JMA Wireless teamed together to build an end-to-end smart factory in Verona, Italy, as an example of the benefits of Industry 4.0 digitalization to manufacturers of all sizes.
ROHM Semiconductor today introduced the industry’s first AC/DC converter ICs with a built-in 1700V SiC MOSFET (BM2SC12xFP2-LBZ) in the TO263-7L package.
Winbond Electronics Corporation, a global supplier of semiconductor memory solutions, today announced it is expanding its total solution of SPI NOR Flash with the introduction of the new single die monolithic 1.8V 512Mb SPI NOR flash.
Osaka Prefecture University observes the molecular orientation of thin-film materials with Fourier transform infrared spectroscopy (FT-IR) using an originally designed, 3D printed attenuated total reflectance (ATR) unit.
The Semiconductor Industry Association (SIA) today applauded the introduction in Congress of the Facilitating American-Built Semiconductors (FABS) Act, bipartisan legislation that would establish an investment tax credit to incentivize greater semiconductor manufacturing in the United States.
Magnetic-spin interactions that allow spin-manipulation by electrical control allow potential applications in energy-efficient spintronic devices.
Innovative Foundry Technologies LLC (IFT) has resolved its patent dispute with Semiconductor Manufacturing International Corporation (SMIC).
AI is used in an array of extremely useful applications, such as predicting a machine’s lifetime through its vibrations, monitoring the cardiac activity of patients and incorporating facial recognition capabilities into video surveillance systems.
Researchers at Stanford University have invented a manufacturing technique that yields flexible, atomically thin transistors less than 100 nanometers in length – several times smaller than previously possible.
Semiconductor test equipment supplier Advantest Corporation is pilot testing a next-generation solution for performing both high-speed scan testing and software-driven functional device testing on the V93000 platform by leveraging the existing high-speed serial I/O interfaces on advanced integrated circuits (ICs).
Global IC market expected to exceed $500 billion for the first time.
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