New processes and materials pose many challenges for supporting vacuum equipment. Intelligent design choices can address these challenges.
Most incidents with energetic materials occur in the sub-fab where material can accumulate in vacuum lines and pumps. Careless behavior can result in catastrophic failures that injure personnel, damage equipment, and halt production.
Mixed-refrigerant Joule-Thomson refrigeration can provide the necessary wafer temperatures and cooling power with smaller footprint, better reliability and lower power consumption than alternative cooling technologies. Cryo-trapping can reduce particle generation by removing the water that mediates the particle formation process.
Maximizing the productivity and profitability of the semiconductor manufacturing process requires pump designs that are optimized for the application, especially harsh applications that use condensable or corrosive gases.
Processes such as atomic layer deposition and etch require fast, repetitive, complete exchange of gases in the process chamber. Vacuum equipment manufacturers have responded with solutions that address the challenges presented by these high flow applications.